JP2011101053A - 熱伝達部に凹部が形成されたledパッケージ及びledパッケージの製造方法 - Google Patents
熱伝達部に凹部が形成されたledパッケージ及びledパッケージの製造方法 Download PDFInfo
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- H01L33/64—Heat extraction or cooling elements
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- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Abstract
【解決手段】本発明のLEDパッケージは、LEDチップと、折れた板金部材からなり上記LEDチップを装着させる凹部が上部に形成された熱伝達部と、上記熱伝達部を封止し上記LEDチップから発生した光を上方に案内するよう構成されたパッケージ本体と、少なくとも上記熱伝達部の凹部に提供された透明密封体、及び上記LEDチップに電源を供給するよう上記パッケージ本体により一部が封止される複数のリードを含む。このように板金を折って熱伝達部を形成しこの熱伝達部にLEDチップを収容する凹部を形成することにより反射効率を改善し工程を単純化することが出来る。
【選択図】図4
Description
110、110−2 熱伝達部
112a、112b 板金
114、114−3 熱伝達部の凹部
115 熱伝達部の通路
116、120 リード
130 パッケージ本体
132 パッケージ本体の凹部
138 パッケージ本体の通路
140、140−1、140−2 透明密封体
Claims (14)
- LEDチップと、
折れた板金部材からなり前記LEDチップを装着させる凹部が上部に形成された熱伝達部と、
前記熱伝達部を封止し前記LEDチップから発生した光を上方に案内するよう構成されたパッケージ本体と、
少なくとも前記熱伝達部の凹部に提供された透明密封体と、
前記LEDチップに電源を供給するよう前記パッケージ本体により一部が封止される複数のリードを含むことを特徴とするLEDパッケージ。 - 前記パッケージ本体は前記熱伝達部の上面の一部を露出させるよう前記熱伝達部の凹部の周りの上方に形成された凹部を含み、
前記透明密封体は前記パッケージ本体の凹部にも提供されることを特徴とする請求項1に記載のLEDパッケージ。 - 前記熱伝達部は前記リードのうち一つと一体で形成されることを特徴とする請求項1に記載のLEDパッケージ。
- 前記熱伝達部は前記熱伝達部の折れた部分を相互結合させるよう前記折れた部分の間に形成された結合部をさらに含むことを特徴とする請求項1に記載のLEDパッケージ。
- 前記結合部は溶着部または金属介在物であることを特徴とする請求項4に記載のLEDパッケージ。
- 前記溶着部は抵抗溶接、ホットプレス溶接、超音波溶接及び高周波溶接を含む群の少なくとも一つにより形成されることを特徴とする請求項5に記載のLEDパッケージ。
- 前記金属介在物はコーティング剤または金属ペーストであることを特徴とする請求項5に記載のLEDパッケージ。
- 前記熱伝達部の凹部は前記熱伝達部の折れた板金部分中の上のものに形成された孔であることを特徴とする請求項1に記載のLEDパッケージ。
- 前記熱伝達部の凹部は前記熱伝達部の折れた板金部分中の上のものに形成された溝であることを特徴とする請求項1に記載のLEDパッケージ。
- 前記熱伝達部の前記LEDチップの周りの部分と前記パッケージ本体の隣接した部分は前記熱伝達部の凹部から電気連結部のうち少なくとも一つの上面に繋がる通路を形成するよう構成され、前記LEDチップは前記通路を通じワイヤにより前記通路と繋がっている電気連結部の上面に連結されることを特徴とする請求項1に記載のLEDパッケージ。
- 前記透明密封体は前記通路にも形成されることを特徴とする請求項10に記載のLEDパッケージ。
- 前記パッケージ本体は前記熱伝達部の上面の一部を露出させるよう前記熱伝達部の凹部の周りの上方に形成された凹部を含み、
前記LEDパッケージは前記パッケージ本体の凹部に提供された第2透明密封体をさらに含むことを特徴とする請求項11に記載のLEDパッケージ。 - 前記リードの上部に形成された前記パッケージ本体の一部は前記LEDチップと前記リードとの間の電気的連結を許容しつつ前記熱伝達部の凹部の縁まで延長されることを特徴とする請求項1に記載のLEDパッケージ。
- 前記透明密封体は上部半球形態であることを特徴とする請求項1に記載のLEDパッケージ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR10-2005-0072435 | 2005-08-08 | ||
KR1020050072435A KR100632003B1 (ko) | 2005-08-08 | 2005-08-08 | 열전달부에 오목부가 형성된 led 패키지 |
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JP2006214617A Division JP4758301B2 (ja) | 2005-08-08 | 2006-08-07 | 熱伝達部に凹部が形成されたledパッケージ |
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JP2011101053A true JP2011101053A (ja) | 2011-05-19 |
JP5246893B2 JP5246893B2 (ja) | 2013-07-24 |
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JP2006214617A Active JP4758301B2 (ja) | 2005-08-08 | 2006-08-07 | 熱伝達部に凹部が形成されたledパッケージ |
JP2011024230A Active JP5246893B2 (ja) | 2005-08-08 | 2011-02-07 | Ledパッケージ及びその製造方法 |
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US (1) | US8169128B2 (ja) |
EP (1) | EP1753038A3 (ja) |
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CN (1) | CN100428514C (ja) |
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- 2006-08-08 CN CNB2006101106884A patent/CN100428514C/zh active Active
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US9741909B2 (en) | 2014-12-02 | 2017-08-22 | Nichia Corporation | Package, light emitting device, and methods of manufacturing the package and the light emitting device |
US10074783B2 (en) | 2014-12-02 | 2018-09-11 | Nichia Corporation | Package and light emitting device |
US9614138B2 (en) | 2014-12-25 | 2017-04-04 | Nichia Corporation | Package, light emitting device, and methods of manufacturing the package and the light emitting device |
US9893258B2 (en) | 2014-12-25 | 2018-02-13 | Nichia Corporation | Package, light emitting device, and methods of manufacturing the package and the light emitting device |
Also Published As
Publication number | Publication date |
---|---|
EP1753038A3 (en) | 2012-11-21 |
US20070030703A1 (en) | 2007-02-08 |
US8169128B2 (en) | 2012-05-01 |
KR100632003B1 (ko) | 2006-10-09 |
EP1753038A2 (en) | 2007-02-14 |
JP5246893B2 (ja) | 2013-07-24 |
CN1913187A (zh) | 2007-02-14 |
JP4758301B2 (ja) | 2011-08-24 |
CN100428514C (zh) | 2008-10-22 |
JP2007049149A (ja) | 2007-02-22 |
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