JP2011097053A5 - - Google Patents

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Publication number
JP2011097053A5
JP2011097053A5 JP2010236945A JP2010236945A JP2011097053A5 JP 2011097053 A5 JP2011097053 A5 JP 2011097053A5 JP 2010236945 A JP2010236945 A JP 2010236945A JP 2010236945 A JP2010236945 A JP 2010236945A JP 2011097053 A5 JP2011097053 A5 JP 2011097053A5
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JP
Japan
Prior art keywords
power semiconductor
positive
output
terminal
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010236945A
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English (en)
Japanese (ja)
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JP2011097053A (ja
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Publication date
Priority claimed from US12/609,400 external-priority patent/US8076696B2/en
Application filed filed Critical
Publication of JP2011097053A publication Critical patent/JP2011097053A/ja
Publication of JP2011097053A5 publication Critical patent/JP2011097053A5/ja
Pending legal-status Critical Current

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JP2010236945A 2009-10-30 2010-10-22 インダクタンスを低減した電力モジュール組立体 Pending JP2011097053A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/609,400 US8076696B2 (en) 2009-10-30 2009-10-30 Power module assembly with reduced inductance

Publications (2)

Publication Number Publication Date
JP2011097053A JP2011097053A (ja) 2011-05-12
JP2011097053A5 true JP2011097053A5 (enExample) 2012-11-15

Family

ID=43533445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010236945A Pending JP2011097053A (ja) 2009-10-30 2010-10-22 インダクタンスを低減した電力モジュール組立体

Country Status (6)

Country Link
US (1) US8076696B2 (enExample)
EP (1) EP2317551B1 (enExample)
JP (1) JP2011097053A (enExample)
CN (1) CN102110680B (enExample)
BR (1) BRPI1004830B1 (enExample)
CA (1) CA2719179C (enExample)

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JP6488940B2 (ja) * 2015-08-07 2019-03-27 富士電機株式会社 半導体装置
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CN105789192B (zh) * 2016-05-03 2018-11-30 扬州国扬电子有限公司 一种设有电极大臂的功率模块
CN105957860B (zh) * 2016-05-03 2018-07-20 扬州国扬电子有限公司 一种设有绝缘隔板的功率模块
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