JP2008519453A5 - - Google Patents

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Publication number
JP2008519453A5
JP2008519453A5 JP2007539700A JP2007539700A JP2008519453A5 JP 2008519453 A5 JP2008519453 A5 JP 2008519453A5 JP 2007539700 A JP2007539700 A JP 2007539700A JP 2007539700 A JP2007539700 A JP 2007539700A JP 2008519453 A5 JP2008519453 A5 JP 2008519453A5
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit chip
support substrate
chip device
underfill material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007539700A
Other languages
English (en)
Japanese (ja)
Other versions
JP4901745B2 (ja
JP2008519453A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/IB2005/053623 external-priority patent/WO2006048844A1/en
Publication of JP2008519453A publication Critical patent/JP2008519453A/ja
Publication of JP2008519453A5 publication Critical patent/JP2008519453A5/ja
Application granted granted Critical
Publication of JP4901745B2 publication Critical patent/JP4901745B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2007539700A 2004-11-04 2005-11-04 集積回路のためのカーボンナノチューブを基材とする充填材 Expired - Lifetime JP4901745B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US62545204P 2004-11-04 2004-11-04
US60/625,452 2004-11-04
PCT/IB2005/053623 WO2006048844A1 (en) 2004-11-04 2005-11-04 Carbon nanotube-based filler for integrated circuits

Publications (3)

Publication Number Publication Date
JP2008519453A JP2008519453A (ja) 2008-06-05
JP2008519453A5 true JP2008519453A5 (enExample) 2012-01-26
JP4901745B2 JP4901745B2 (ja) 2012-03-21

Family

ID=35784720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007539700A Expired - Lifetime JP4901745B2 (ja) 2004-11-04 2005-11-04 集積回路のためのカーボンナノチューブを基材とする充填材

Country Status (7)

Country Link
US (1) US20110156255A1 (enExample)
EP (2) EP2302669A1 (enExample)
JP (1) JP4901745B2 (enExample)
KR (1) KR101183754B1 (enExample)
CN (1) CN100521126C (enExample)
TW (1) TWI393226B (enExample)
WO (1) WO2006048844A1 (enExample)

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US9041228B2 (en) 2008-12-23 2015-05-26 Micron Technology, Inc. Molding compound including a carbon nano-tube dispersion
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US20110309481A1 (en) * 2010-06-18 2011-12-22 Rui Huang Integrated circuit packaging system with flip chip mounting and method of manufacture thereof
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US20150045478A1 (en) * 2012-03-21 2015-02-12 Applied Nanotech Holdings, Inc. Polymer Composites with Silicon Dioxide Particles
US9321245B2 (en) 2013-06-24 2016-04-26 Globalfoundries Inc. Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosion
US20170141007A1 (en) * 2015-11-17 2017-05-18 Advanced Semiconductor Engineering, Inc. Filler compositions and underfill compositions and molding compounds including the same for preparing semiconductor packages
WO2025245156A1 (en) * 2024-05-23 2025-11-27 Micron Technology, Inc. Method of forming stacked semiconductor devices with carbon nanofiber structures and associated systems and methods

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