KR101183754B1 - 집적 회로 칩 장치 - Google Patents

집적 회로 칩 장치 Download PDF

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Publication number
KR101183754B1
KR101183754B1 KR1020077011528A KR20077011528A KR101183754B1 KR 101183754 B1 KR101183754 B1 KR 101183754B1 KR 1020077011528 A KR1020077011528 A KR 1020077011528A KR 20077011528 A KR20077011528 A KR 20077011528A KR 101183754 B1 KR101183754 B1 KR 101183754B1
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South Korea
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integrated circuit
circuit chip
delete delete
carbon nanotube
filler
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KR1020077011528A
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English (en)
Korean (ko)
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KR20070084429A (ko
Inventor
크리스 윌랜드
헨드리쿠스 요한네스 요카부스 수넨
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타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/29393—Base material with a principal constituent of the material being a solid not provided for in groups H01L2224/293 - H01L2224/29391, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
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    • H01L2924/151—Die mounting substrate
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    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Materials Engineering (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
KR1020077011528A 2004-11-04 2005-11-04 집적 회로 칩 장치 Expired - Lifetime KR101183754B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US62545204P 2004-11-04 2004-11-04
US60/625,452 2004-11-04
PCT/IB2005/053623 WO2006048844A1 (en) 2004-11-04 2005-11-04 Carbon nanotube-based filler for integrated circuits

Publications (2)

Publication Number Publication Date
KR20070084429A KR20070084429A (ko) 2007-08-24
KR101183754B1 true KR101183754B1 (ko) 2012-09-17

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KR1020077011528A Expired - Lifetime KR101183754B1 (ko) 2004-11-04 2005-11-04 집적 회로 칩 장치

Country Status (7)

Country Link
US (1) US20110156255A1 (enExample)
EP (2) EP1810324A1 (enExample)
JP (1) JP4901745B2 (enExample)
KR (1) KR101183754B1 (enExample)
CN (1) CN100521126C (enExample)
TW (1) TWI393226B (enExample)
WO (1) WO2006048844A1 (enExample)

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US9041228B2 (en) 2008-12-23 2015-05-26 Micron Technology, Inc. Molding compound including a carbon nano-tube dispersion
JP4913853B2 (ja) * 2009-08-31 2012-04-11 Ｓｍｋ株式会社 微細コネクタ
US20110309481A1 (en) * 2010-06-18 2011-12-22 Rui Huang Integrated circuit packaging system with flip chip mounting and method of manufacture thereof
TWI452960B (zh) * 2010-11-25 2014-09-11 光宏精密股份有限公司 具有熱傳導性質的模塑互連組件及其製造方法
CN103311195A (zh) * 2012-03-15 2013-09-18 南亚科技股份有限公司 散热结构
WO2013142074A2 (en) * 2012-03-21 2013-09-26 Applied Nanotech Holdings, Inc. Polymer composites with silicon dioxide particles
US9321245B2 (en) 2013-06-24 2016-04-26 Globalfoundries Inc. Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosion
US20170141007A1 (en) * 2015-11-17 2017-05-18 Advanced Semiconductor Engineering, Inc. Filler compositions and underfill compositions and molding compounds including the same for preparing semiconductor packages
WO2025245156A1 (en) * 2024-05-23 2025-11-27 Micron Technology, Inc. Method of forming stacked semiconductor devices with carbon nanofiber structures and associated systems and methods

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TWI393226B (zh) 2013-04-11
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