CN218957731U - 用于集成电路的封装 - Google Patents

用于集成电路的封装 Download PDF

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Publication number
CN218957731U
CN218957731U CN202222396467.5U CN202222396467U CN218957731U CN 218957731 U CN218957731 U CN 218957731U CN 202222396467 U CN202222396467 U CN 202222396467U CN 218957731 U CN218957731 U CN 218957731U
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package
heat spreader
electronic chip
mounting surface
top surface
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Y·博塔勒布
L·施瓦茨
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STMicroelectronics Grenoble 2 SAS
STMicroelectronics Alps SAS
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STMicroelectronics Grenoble 2 SAS
STMicroelectronics Alps SAS
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Abstract

本公开涉及用于集成电路的封装。一种用于集成电路的封装包括基座衬底，具有安装面；第一电子芯片，具有通过电连接线电连接到安装面的顶面和通过导热粘合剂层安装到安装面的底面；第二电子芯片，具有覆盖有热界面材料层的底面和通过嵌入在底部填充材料层中的导电连接件而电连接到安装面的顶面；散热器，具有：嵌入导热粘合剂层中的第一部分、具有顶面和与热界面材料层接触的底面的第二部分、以及在第一部分和第二部分之间的连接部分；以及涂层，封装第一电子芯片和第二电子芯片以及散热器，其中散热器的第二部分的顶面从涂层暴露。利用本公开的实施例，多个芯片在此可以在相同的封装中更接近，同时避免在多个芯片之间的增加的加热。

Description

用于集成电路的封装
技术领域
具体实施方式和实施例涉及微电子领域，具体地，涉及集成电路封装领域，更具体地，涉及包含若干不同类型的集成电路的封装的散热。
背景技术
通常，一种类型的集成电路封装包括电子集成电路芯片，该电子集成电路芯片设置在基座衬底的表面上并由涂层(通常为树脂)保护，该涂层被模制以封装在芯片周围并且刚性地连接到基座衬底。基座衬底的另一个面可以包括用于安装在印刷电路板(PCB)上的电连接件，例如球。
这种涂覆(封装)树脂不仅可以保护芯片，而且有助于封装的坚固性。
在一些应用中，可以将多个电子芯片设置在相同的基座衬底上，并且多个电子芯片全部涂覆有相同的涂覆树脂。
此外，在一些情况下，这些不同的芯片可以使用不同的方法电连接到基座衬底。
第一种方法可以使用引线键合技术。更具体地，这种电子芯片具有通过电连接线电连接到基座衬底的顶面和通过粘合剂层安装在基座衬底上的底面。
第二种方法可以使用所谓的“倒装芯片”技术。更具体地，这种电子芯片具有底面和顶面，该底面和顶面通过嵌入在底部填充材料层中的导电连接件装置(例如球)电连接到基座衬底。
在操作中，这些不同的芯片散发热量。然后有必要以集成电路的温度不达到导致其退化的值的方式尽可能地排出该热量。
在这点上，就倒装芯片而言，可以在芯片的底面上设置本领域技术人员公知的热界面材料(TIM)层，并通过散热器例如铜板覆盖该热界面层，涂层树脂使散热器的顶面暴露。
也就是说，不同芯片的接近引起了芯片的相互加热，需要将芯片彼此移开，以便通过从相邻芯片的热发射来限制对一个芯片的加热。
然而，这导致基座衬底尺寸的增加，并因此导致封装尺寸的增加。
因此，需要增强包含以不同方式电连接的若干芯片的封装的热耗散，同时不过度地或根本不增加这些封装的尺寸。
实用新型内容
本公开的目的是提供用于集成电路的封装，以至少部分地解决现有技术中存在的上述问题。
本公开的一方面提供了一种用于集成电路的封装，包括：基座衬底，具有安装面；第一电子芯片，具有通过电连接线电连接到所述安装面的顶面和通过导热粘合剂层安装到所述安装面的底面；第二电子芯片，具有覆盖有热界面材料层的底面和通过嵌入在底部填充材料层中的导电连接件而电连接到所述安装面的顶面；散热器，具有：嵌入所述导热粘合剂层中的第一部分、具有顶面和与所述热界面材料层接触的底面的第二部分、以及在所述第一部分和所述第二部分之间的连接部分；以及涂层，封装所述第一电子芯片和所述第二电子芯片以及所述散热器，其中所述散热器的所述第二部分的顶面从所述涂层暴露。
根据一个或多个实施例，其中所述导热粘合剂层也是导电的，并且搁置在所述安装面的旨在被连接到冷电源点的接触焊盘上，并且其中至少一个电连接线被连接在所述第一电子芯片的顶面与所述散热器的所述连接部分之间。
根据一个或多个实施例，封装还包括另一第二电子芯片，所述另一第二电子芯片电连接到所述基座衬底的所述安装面并且覆盖有另一热界面材料层，其中所述第一电子芯片在相对侧上由所述第二电子芯片和所述另一第二电子芯片框住，并且其中所述散热器还包括位于所述另一热界面材料层上方的另一第二部分以及在所述第一部分和所述另一第二部分之间的另一连接部分，并且其中所述连接部分和所述另一连接部分中的一者或多者包括使电连接线能够通过的一个或多个槽。
本公开的另一方面提供了一种用于集成电路的封装，包括：基座衬底，具有安装面；散热器，具有第一部分、第二部分以及在所述第一部分与所述第二部分之间的连接部分；其中所述散热器的所述第一部分被安装到所述基座衬底的所述安装面；第一电子芯片，具有通过电连接线电连接到所述安装面的顶面和安装到所述散热器的所述第一部分的底面；第二电子芯片，具有顶面和底面，所述第二电子芯片的顶面通过嵌入底部填充材料层中的导电连接件而电连接到所述安装面，并且所述第二电子芯片的底面通过热界面材料层安装到所述散热器的所述第二部分的下侧；以及涂层，封装所述第一电子芯片和所述第二电子芯片以及所述散热器，其中所述散热器的所述第二部分的顶面从所述涂层暴露。
根据一个或多个实施例，其中所述电连接线穿过所述散热器中的槽。
根据一个或多个实施例，其中所述连接部分是倾斜的，并且所述第一部分和所述第二部分在不同的平面上。
根据一个或多个实施例，封装还包括用于将所述散热器的所述第一部分安装到所述基座衬底的所述安装面的粘合剂材料。
根据一个或多个实施例，其中所述粘合剂材料还将所述第一电子芯片的底面安装到所述散热器的所述第一部分。
本公开的又一方面提供了一种用于集成电路的封装，包括：基座衬底，具有安装面；第一电子芯片，安装到所述基座衬底的所述安装面；散热器，具有第一部分、第二部分以及在所述第一部分与所述第二部分之间的连接部分；其中所述散热器的所述第一部分被安装到所述基座衬底的所述安装面上并且所述第二部分被安装在所述第一电子芯片上；第二电子芯片，安装在所述散热器的所述第一部分上；涂层，封装所述第一电子芯片和所述第二电子芯片以及所述散热器，其中所述散热器的所述第二部分的顶面从所述涂层暴露。
根据一个或多个实施例，封装进一步包括：第一电连接件，在所述第一电子芯片和所述基座衬底之间；以及第二电连接件，在所述第二电子芯片与所述基座衬底之间。
根据一个或多个实施例，其中所述第一电连接包括穿过所述散热器中的一个或多个槽的电连接线。
根据一个或多个实施例，其中所述一个或多个槽位于所述散热器的所述连接部分中。
根据一个或多个实施例，其中所述连接部分是倾斜的，并且所述第一部分和所述第二部分在不同的平面上。
根据一个或多个实施例，封装还包括嵌入所述散热器的所述第一部分的导热粘合剂，所述导热粘合剂将所述第一部分附接到所述基座衬底的所述安装面，并且将所述第二电子芯片附接到所述散热器的所述第一部分。
根据一个或多个实施例，封装还包括在所述散热器的所述第二部分与所述第一电子芯片之间的导热粘合剂。
利用本公开的实施例，多个芯片在此可以在相同的封装中更接近，同时避免在多个芯片之间的增加的加热。
附图说明
本实用新型的其他优点和特征将通过研究实施例和实现方式的详细描述而变得显而易见，这些实施例和实现方式决不是限制性的，并且附图中：
图1示意性地示出了用于集成电路的封装的截面图；
图2示意性地示出了用于集成电路的封装的截面图；以及
图3特别部分地表示图2中的散热器。
具体实施方式
图1示意性地示出了根据本实用新型实施例的用于集成电路的封装BT的截面图。封装BT包括具有顶部安装面FM的基座衬底SS。封装BT还包括至少第一电子集成电路芯片P1和至少第二电子集成电路芯片P2。
第一电子芯片P1具有顶面FS1和底面FI1。芯片P1的顶面FS1通过焊接到芯片P1和基座衬底SS的连接焊盘的连接线WB1电连接到基座衬底SS的安装面FM。芯片P1的底面FI1通过本领域技术人员公知的粘合剂层1安装在安装面FM上。粘合层1是导热的，因此当芯片P1工作时，可以将由芯片P1发出的热量向基座衬底散发。
因此，电子芯片P1将电子芯片P1连接到基座衬底SS。
第二电子芯片P2具有底面FI2和顶面FS2。芯片P2的底面FI2被本领域技术人员公知的热界面材料层3的底面30覆盖。作为非限制性实施例，例如可以使用购自DOW公司的商品名DOWSILDA-6534的材料，其是具有高热导率(通常为6.8瓦/米和每开氏度)的导电粘合剂。
芯片P2的顶面FS2通过连接2电连接到安装面FM。连接2可以是例如连接球，并且通常嵌入在底部填充材料层20中。例如，本领域技术人员公知的底部填充层可以由树脂形成。
电子芯片P2因此使用“倒装芯片”技术连接到基座衬底SS。
封装BT还包括通常由例如铜的导热材料形成的散热器4。散热器4具有第一部分41和第二部分42。散热器4的第一部分41嵌入导热粘合剂层1中并位于第一电子芯片P1的下方。然后通过第一部分41将粘合剂层1分成两个粘合剂子层。第一粘合剂子层位于芯片P1的底面FI1和第一部分41之间，第二子层位于第一部分41和基座衬底SS之间。优选地，粘合剂层1的厚度在散热器4的第一部分41的任一侧上是相同的，并且可以是例如30μm。
因此，导热粘合剂1一方面提供从第一芯片P1到散热器4的第一部分41的热传递，另一方面提供从散热器4的第一部分41到基座衬底SS的热传递。
散热器4的第二部分42具有底面421和顶面420。底面421与热界面材料层3的顶面31接触并位于第二电子芯片P2上方。
散热器4还包括在第一部分41和第二部分42之间的连接部分43。连接部分43以这样的方式倾斜，即连接在两个不同平面上的第一部分41和第二部分42。散热器4因此在此可以具有例如倒置的半帽形状。
封装BT还包括涂层5。涂层5封装芯片P1和P2以及散热器4，并且同时使散热器4的第二部分42的顶面420暴露。更具体地，涂层5可以由例如与用于底部填充层的树脂类似的树脂形成。这种材料具有有利的机械性能，使得封装BT能够承受易于施加在其上的机械应力并保护芯片P1和P2。
热界面层3提供从第二芯片P2到散热器4的第二部分42的热传递。散热器4的第二部分42然后可以排出由封装BT外部的热界面材料层3传递的热量，而不会被涂层5阻碍，因为其顶面420是洁净(clear)的。
因此，第一芯片P1的散热通过导热粘合剂层1，第一部分41，连接部分43和第二部分42向外进行，并且通过导热粘合剂层1和第一部分41朝向基座衬底SS进行。
第二芯片P2的散热通过层3和第二部分42向外进行，并且通过层3和第二部分42、连接部分43、第一部分41和导热粘合层1向基座衬底SS进行。
因此，不必增加芯片P1和P2之间的空间就能增强封装BT的散热。因此，虽然根据现有技术的封装中的两个相邻芯片必须间隔开，以便通过从相邻芯片的热发射来限制芯片的加热，但是根据实施例，芯片P1和P2在此可以在相同的封装BT中更接近，同时避免芯片P1和P2之间的增加的加热。
尽管这不是强制性的，但粘合剂层1不仅可以是导热的，而且可以是导电的。例如，可以使用购自公司Alpha Advanced Materials的以商品名ATROX800HT2V-P1的粘合剂，其电阻率为0.00001ohm-cm。
此外，基座衬底的安装面FM在此具有用于连接到冷电源点(例如接地)的接触焊盘10。粘合剂层1，特别是在基座衬底SS和散热器的第一部分41之间的粘合剂子层，搁置在该接触焊盘10上。因此，第一部分41嵌入在粘合剂层1中，然后散热器4电连接到冷电源点，并因此用作接地面。因此，可以利用散热器4的特定形状，特别是连接部分43的倾斜，以使用较短的连接线WB2在芯片P1的顶面FS1的接触焊盘和散热器4之间建立连接，从而将该接触焊盘连接到地。
在较大尺寸的封装例如图2所示的封装BT的情况下，可以提供更多的电子芯片。封装BT则包括例如除了分别对应于图1中的芯片P1和P2的第一芯片P1和第二芯片P2A之外的至少另一个第二芯片P2B。
芯片P1使用引线键合技术，而芯片P2A使用所谓的“倒装”技术。
另一个第二芯片P2B使用与芯片P2A相同的技术，即所谓的“倒装芯片”技术。
类似于第二芯片P2A，另一个第二芯片P2B电连接到基座衬底SS的安装面FM，并且覆盖有另一层热界面材料3B，例如与热界面材料3A相同的热界面材料3B。第一芯片P1由第二电子芯片P2A和另一第二电子芯片P2B框住。
散热器4还包括另一第二部分42B和另一连接部分43B。另一第二部分42B位于另一热界面材料层3B之上，另一连接部分43B位于第一部分41和另一第二部分42B之间。散热器4因此具有倒置的半帽形状。
以上针对图1中的第二芯片P2所描述的所有内容，特别是在散热方面的优点，都适用于第二芯片P2A和第二芯片P2B，与图1中的第二芯片P2A和第二芯片P2B相关联的元件，类似于与图1中的第二芯片P2相关联的元件，相对于图1中的这些等效元件的附图标记，分别用字母A和B来表示。
此外，连接部分之一，例如散热器4的连接部分43B包括使得WB1型连接线能够通过的槽FNT。在该示例中，连接线WB2然后连接到另一连接部分43A。然而，另一连接部分43A也可以包括槽FNT，其使得图2中未示出的另一WB1型连接线能够通过。
如在图3中更精确地示出的，图3具体地部分地表示图2中的散热器4，散热器4可以包括数个单独的槽FNT，用于其它WB1型连接线的通过。槽FNT不中断散热器4的热和可选的电连续性。
在这点上，根据实施例提出了将具有特定形状的散热器具体化，例如以倒置的半帽或倒置的帽的形状，使得一方面与倒装芯片的热界面层接触，另一方面嵌入另一芯片的导热粘合剂层中。
根据一个方面，一种用于集成电路的封装包括：具有安装面的基座衬底；至少第一电子芯片，其具有通过电连接线电连接到所述安装面的顶面和通过至少导热粘合剂层安装在所述安装面上的底面；至少第二电子芯片，其具有覆盖有热界面材料层的底面和通过嵌入在底部填充材料层中的导电连接件而电连接到所述安装面的顶面；散热器，其具有嵌入在所述至少导热粘合剂层中的第一部分，具有与所述热界面材料层接触的底面和顶面的第二部分，以及在所述第一部分和所述第二部分之间的连接部分；以及封装所述至少两个芯片和散热器的涂层，使得散热器的第二部分的顶面暴露。
散热器因此例如具有倒置的半帽形状。
热耗散通过散热器的第二部分向外执行，并且通过导热粘合剂层由基座衬底执行。
因此增强了封装的散热，而不必增加芯片之间的空间。
此外，例如由铜制成的散热器的特定形状，特别是增加第一部分和连接部分有助于增加电子封装的刚性。
根据一个实施例，粘合剂层也可以是导电的并且搁置在安装面的接触焊盘上，该接触焊盘旨在连接到冷电源点，例如接地。并且至少一个电连接线有利地连接在所述至少一个第一电子芯片的顶面与散热器的连接部分之间。
散热器可以用作接地面，并且通过使用一个或多个较短的电连接线来促进第一芯片到接地的连接。
根据一个实施例，封装可以包括数个第一芯片和/或数个第二芯片。
例如，封装可以包括至少另一个第二芯片，其电连接到基座衬底的顶面并且覆盖有另一层热界面材料。
所述至少一个第一电子芯片可以由第二电子芯片和另一个第二电子芯片框住。
散热器可以包括位于另一热界面材料层上方的另一第二部分和在第一部分与另一第二部分之间的另一连接部分。
散热器的连接部分和/或另一个连接部分于是可以包括一个或多个槽缝，这些槽缝使得这些电连接线中的至少一些能够通过。

Claims (15)

1.一种用于集成电路的封装，其特征在于，包括：
基座衬底，具有安装面；
第一电子芯片，具有通过电连接线电连接到所述安装面的顶面和通过导热粘合剂层安装到所述安装面的底面；
第二电子芯片，具有覆盖有热界面材料层的底面和通过嵌入在底部填充材料层中的导电连接件而电连接到所述安装面的顶面；
散热器，具有：嵌入所述导热粘合剂层中的第一部分、具有顶面和与所述热界面材料层接触的底面的第二部分、以及在所述第一部分和所述第二部分之间的连接部分；以及
涂层，封装所述第一电子芯片和所述第二电子芯片以及所述散热器，其中所述散热器的所述第二部分的顶面从所述涂层暴露。
2.根据权利要求1所述的封装，其特征在于，所述导热粘合剂层也是导电的，并且搁置在所述安装面的旨在被连接到冷电源点的接触焊盘上，并且其中至少一个电连接线被连接在所述第一电子芯片的顶面与所述散热器的所述连接部分之间。
3.根据权利要求1所述的封装，其特征在于，还包括另一第二电子芯片，所述另一第二电子芯片电连接到所述基座衬底的所述安装面并且覆盖有另一热界面材料层，其中所述第一电子芯片在相对侧上由所述第二电子芯片和所述另一第二电子芯片框住，并且其中所述散热器还包括位于所述另一热界面材料层上方的另一第二部分以及在所述第一部分和所述另一第二部分之间的另一连接部分，并且其中所述连接部分和所述另一连接部分中的一者或多者包括使电连接线能够通过的一个或多个槽。
4.一种用于集成电路的封装，其特征在于，包括：
基座衬底，具有安装面；
散热器，具有第一部分、第二部分以及在所述第一部分与所述第二部分之间的连接部分；
其中所述散热器的所述第一部分被安装到所述基座衬底的所述安装面；
第一电子芯片，具有通过电连接线电连接到所述安装面的顶面和安装到所述散热器的所述第一部分的底面；
第二电子芯片，具有顶面和底面，所述第二电子芯片的顶面通过嵌入底部填充材料层中的导电连接件而电连接到所述安装面，并且所述第二电子芯片的底面通过热界面材料层安装到所述散热器的所述第二部分的下侧；以及
涂层，封装所述第一电子芯片和所述第二电子芯片以及所述散热器，其中所述散热器的所述第二部分的顶面从所述涂层暴露。
5.根据权利要求4所述的封装，其特征在于，所述电连接线穿过所述散热器中的槽。
6.根据权利要求4所述的封装，其特征在于，所述连接部分是倾斜的，并且所述第一部分和所述第二部分在不同的平面上。
7.根据权利要求4所述的封装，其特征在于，还包括用于将所述散热器的所述第一部分安装到所述基座衬底的所述安装面的粘合剂材料。
8.根据权利要求7所述的封装，其特征在于，所述粘合剂材料还将所述第一电子芯片的底面安装到所述散热器的所述第一部分。
9.一种用于集成电路的封装，其特征在于，包括：
基座衬底，具有安装面；
第一电子芯片，安装到所述基座衬底的所述安装面；
散热器，具有第一部分、第二部分以及在所述第一部分与所述第二部分之间的连接部分；
其中所述散热器的所述第一部分被安装到所述基座衬底的所述安装面上并且所述第二部分被安装在所述第一电子芯片上；
第二电子芯片，安装在所述散热器的所述第一部分上；
涂层，封装所述第一电子芯片和所述第二电子芯片以及所述散热器，其中所述散热器的所述第二部分的顶面从所述涂层暴露。
10.根据权利要求9所述的封装，其特征在于，进一步包括：
第一电连接件，在所述第一电子芯片和所述基座衬底之间；以及
第二电连接件，在所述第二电子芯片与所述基座衬底之间。
11.根据权利要求10所述的封装，其特征在于，所述第一电连接包括穿过所述散热器中的一个或多个槽的电连接线。
12.根据权利要求11所述的封装，其特征在于，所述一个或多个槽位于所述散热器的所述连接部分中。
13.根据权利要求9所述的封装，其特征在于，所述连接部分是倾斜的，并且所述第一部分和所述第二部分在不同的平面上。
14.根据权利要求9所述的封装，其特征在于，还包括嵌入所述散热器的所述第一部分的导热粘合剂，所述导热粘合剂将所述第一部分附接到所述基座衬底的所述安装面，并且将所述第二电子芯片附接到所述散热器的所述第一部分。
15.根据权利要求9所述的封装，其特征在于，还包括在所述散热器的所述第二部分与所述第一电子芯片之间的导热粘合剂。
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