JP2011097053A - インダクタンスを低減した電力モジュール組立体 - Google Patents

インダクタンスを低減した電力モジュール組立体 Download PDF

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Publication number
JP2011097053A
JP2011097053A JP2010236945A JP2010236945A JP2011097053A JP 2011097053 A JP2011097053 A JP 2011097053A JP 2010236945 A JP2010236945 A JP 2010236945A JP 2010236945 A JP2010236945 A JP 2010236945A JP 2011097053 A JP2011097053 A JP 2011097053A
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positive
power semiconductor
output
lead
electrically coupled
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JP2011097053A5 (enExample
Inventor
Richard Alfred Beaupre
リチャード・アルフレッド・ビュープレ
Eladio C Delgado
エラディオ・クレメンテ・デルガド
Ljubisa Dragoljub Stevanovic
リュビサ・ドラゴリュブ・ステヴァノヴィック
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General Electric Co
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General Electric Co
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Publication of JP2011097053A publication Critical patent/JP2011097053A/ja
Publication of JP2011097053A5 publication Critical patent/JP2011097053A5/ja
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Inverter Devices (AREA)
  • Rectifiers (AREA)
JP2010236945A 2009-10-30 2010-10-22 インダクタンスを低減した電力モジュール組立体 Pending JP2011097053A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/609,400 US8076696B2 (en) 2009-10-30 2009-10-30 Power module assembly with reduced inductance

Publications (2)

Publication Number Publication Date
JP2011097053A true JP2011097053A (ja) 2011-05-12
JP2011097053A5 JP2011097053A5 (enExample) 2012-11-15

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Country Status (6)

Country Link
US (1) US8076696B2 (enExample)
EP (1) EP2317551B1 (enExample)
JP (1) JP2011097053A (enExample)
CN (1) CN102110680B (enExample)
BR (1) BRPI1004830B1 (enExample)
CA (1) CA2719179C (enExample)

Cited By (14)

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JP2015026724A (ja) * 2013-07-26 2015-02-05 住友電気工業株式会社 半導体モジュール
WO2015121900A1 (ja) * 2014-02-11 2015-08-20 三菱電機株式会社 電力用半導体モジュール
JP2015185630A (ja) * 2014-03-24 2015-10-22 日産自動車株式会社 ハーフブリッジパワー半導体モジュール及びその製造方法
JP2017037892A (ja) * 2015-08-07 2017-02-16 富士電機株式会社 半導体装置
CN109417051A (zh) * 2016-04-12 2019-03-01 通用电气公司 具有鲁棒性的低电感功率模块封装
JP2019220719A (ja) * 2019-09-24 2019-12-26 ローム株式会社 半導体装置
JP2020501353A (ja) * 2016-11-25 2020-01-16 アーベーベー・シュバイツ・アーゲー パワー半導体モジュール
US10892218B2 (en) 2015-02-26 2021-01-12 Rohm Co., Ltd. Semiconductor device
JP2021132234A (ja) * 2017-01-13 2021-09-09 クリー ファイエットヴィル インコーポレイテッド パワーデバイスを並列接続するための低インダクタンスおよび高速スイッチングを有するハイパワー多層モジュール
JP2022526411A (ja) * 2019-04-05 2022-05-24 ロベルト・ボッシュ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング 電子スイッチングユニット
JP2022091899A (ja) * 2019-09-24 2022-06-21 ローム株式会社 半導体装置
JPWO2022176675A1 (enExample) * 2021-02-16 2022-08-25
JPWO2022209381A1 (enExample) * 2021-04-01 2022-10-06
US11848622B2 (en) 2020-10-08 2023-12-19 Kabushiki Kaisha Toshiba Electronic device and power converter

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US8803001B2 (en) 2011-06-21 2014-08-12 Toyota Motor Engineering & Manufacturing North America, Inc. Bonding area design for transient liquid phase bonding process
US8675379B2 (en) 2011-08-08 2014-03-18 General Electric Company Power converting apparatus having improved electro-thermal characteristics
US8487416B2 (en) 2011-09-28 2013-07-16 General Electric Company Coaxial power module
US10058951B2 (en) 2012-04-17 2018-08-28 Toyota Motor Engineering & Manufacturing North America, Inc. Alloy formation control of transient liquid phase bonding
US9044822B2 (en) 2012-04-17 2015-06-02 Toyota Motor Engineering & Manufacturing North America, Inc. Transient liquid phase bonding process for double sided power modules
US8847384B2 (en) 2012-10-15 2014-09-30 Toyota Motor Engineering & Manufacturing North America, Inc. Power modules and power module arrays having a modular design
KR101890752B1 (ko) * 2012-11-01 2018-08-22 삼성전자 주식회사 균일한 병렬 스위치 특성을 갖는 파워모듈용 기판 및 이를 포함하는 파워모듈
US9391055B2 (en) 2012-12-05 2016-07-12 Lockheed Martin Corporation Power module having stacked substrates arranged to provide tightly-coupled source and return current paths
KR102034717B1 (ko) 2013-02-07 2019-10-21 삼성전자주식회사 파워모듈용 기판, 파워모듈용 터미널 및 이들을 포함하는 파워모듈
DE102013104522B3 (de) * 2013-05-03 2014-06-26 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Subeinheiten und Anordnung hiermit
WO2015176985A1 (en) * 2014-05-20 2015-11-26 Abb Technology Ag Semiconductor power module with low stray inductance
DE102014110617B4 (de) * 2014-07-28 2023-05-04 Infineon Technologies Ag Leistungshalbleitermodulsystem mit hoher Isolationsfestigkeit und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung mit einer hohen Isolationsfestigkeit
DE102014111421A1 (de) * 2014-08-11 2016-02-11 Woodward Kempen Gmbh Niederinduktive Schaltungsanordnung eines Umrichters
JP6166701B2 (ja) * 2014-08-22 2017-07-19 株式会社東芝 半導体装置
CN107112898B (zh) 2014-11-18 2019-06-21 通用电气全球采购有限责任公司 母线和功率电子装置及制造引线端连接器的方法
JP6288301B2 (ja) * 2014-11-28 2018-03-14 日産自動車株式会社 ハーフブリッジパワー半導体モジュール及びその製造方法
US9985550B2 (en) 2014-12-23 2018-05-29 General Electric Company Systems and methods for reducing loop inductance
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CN106340513B (zh) * 2015-07-09 2019-03-15 台达电子工业股份有限公司 一种集成控制电路的功率模块
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