WO2015124036A1 - 基于印刷电路板的开关电路结构 - Google Patents

基于印刷电路板的开关电路结构 Download PDF

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WO2015124036A1
WO2015124036A1 PCT/CN2015/000068 CN2015000068W WO2015124036A1 WO 2015124036 A1 WO2015124036 A1 WO 2015124036A1 CN 2015000068 W CN2015000068 W CN 2015000068W WO 2015124036 A1 WO2015124036 A1 WO 2015124036A1
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conductive
printed circuit
circuit board
metal wire
control
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PCT/CN2015/000068
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English (en)
French (fr)
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刘晓霖
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刘晓霖
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Publication of WO2015124036A1 publication Critical patent/WO2015124036A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/58—Electric connections to or between contacts; Terminals
    • H01H1/5805—Connections to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10053—Switch
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Definitions

  • the utility model relates to a switch circuit structure, in particular to a switch circuit structure based on a printed circuit board.
  • the packages of current high current and low internal resistance electronic switching devices are mostly printed circuit board pins, the two conductive electrodes that need to be soldered due to the electronic switch and The control poles are all in the same plane, and the control poles cannot be connected to any one of the conductive electrodes.
  • Two copper plates are used for splicing, or two of the poles are on the same plate, which needs to be inserted into the insulator or more complicated. Process, add another printed circuit board, and have more solder pins, in the high current bar Next, the heating wire to be connected can not be ignored, resulting in the use of the device not only more material, larger, high resistance, high loss, high manufacturing cost and poor heat dissipation and reliability, use is restricted.
  • the purpose of the utility model is to provide a switch circuit structure based on a printed circuit board, which has the advantages of less material, small volume, low resistance, low loss, high yield and low manufacturing cost. The advantages, and the heat dissipation effect and reliability are good, and the application range is wider.
  • the printed circuit board-based switching circuit structure of the present invention comprises a printed circuit board and one or more electronic switching devices, and the printed circuit board comprises a conductive substrate, a thermal conductive insulating layer and a metal wiring layer, which are sequentially connected, and a metal
  • the wire layer includes a plurality of conductive metal wires and control metal wires, each of the electronic switching devices is provided with two conductive electrodes and a control electrode, and is characterized in that the conductive heat insulating layer is provided with each set of conductive metal wires and control metal wires. a window, one of the conductive electrodes of each electronic switching device is soldered to the respective conductive metal wire, the other conductive electrode is soldered to the substrate through the window, and the control electrode is soldered to the respective control metal wire;
  • a conductive window is provided with a corresponding window, a conductive electrode and a control electrode of each electronic switching device are soldered to a conductive metal wire or a control metal wire in the same plane, and another conductive electrode passes through the window and the substrate.
  • Soldering no need to pad the insulator or add another printed circuit board, the thickness of the substrate and the thermal insulating layer can be reduced, the material and the soldering pin are reduced, so that the heat dissipation effect is good, the volume is small, and the conductive resistance of the printed circuit conductor is small.
  • a conductive metal block is disposed on the metal wire layer through the screw and the insulating pad, and the conductive metal block is in contact with each conductive metal wire; a conductive electrode of each electronic switching device passes through the respective conductive metal wire The conductive metal block is turned on, and the conductive metal block can be used as an output pole of the switch circuit;
  • a conductive heat dissipating block is fixed on one side of the substrate; the conductive heat dissipating block can enhance heat dissipation and serve as another lead electrode of the switch circuit;
  • the utility model has the advantages of less material, small volume, low electrical resistance, low loss, high yield and low manufacturing cost, and has good heat dissipation effect and reliability, and has wider application range.
  • FIG. 1 is a perspective view of a printed circuit board in accordance with an embodiment of the present invention.
  • FIG. 2 is a perspective view of the thermally conductive insulating layer of FIG. 1.
  • Figure 3 is a front elevational view of an embodiment of the present invention.
  • Figure 4 is a left side view of Figure 3.
  • Figure 5 is a partial enlarged view of I in Figure 4.
  • the printed circuit board-based switch circuit structure comprises a printed circuit board 1 and three electronic switching devices 2, and the printed circuit board 1 comprises a conductive substrate 3, a thermal conductive insulating layer 4 and Metal wire layer 5,
  • the substrate 3 is a material that is easy to solder, heat conduction and conductive, such as a copper-based printed circuit board
  • the thermal conductive insulating layer 4 may be epoxy or ceramic powder
  • the metal wire layer includes three sets of conductive metal wires 6 and Controlling the metal wires 7, each of the electronic switching devices 2 is provided with two conductive electrodes and a control electrode, such as a field effect transistor, and a window 8 corresponding to each set of conductive metal wires 6 and control metal wires 7 is provided in the heat conductive insulating layer 4,
  • One conductive electrode of each electronic switching device 2 is soldered to the respective conductive metal wire 6, the other conductive electrode is soldered to the substrate 3 through the window 8, and the control electrode is soldered to the respective control metal wire 7; on the metal wire layer 5
  • the substrate 3 is
  • a conductive electrode and a control electrode of each electronic switching device 2 are soldered to the conductive metal wire 6 or the control metal wire 7 in the same plane, and the other conductive electrode is worn.
  • the window 8 is soldered to the substrate 3, there is no need to pad the insulator or add another printed circuit board, and the thickness of the substrate 3 and the heat conductive insulating layer 4 can be reduced, thereby reducing the use.
  • the material and the soldering pin have the advantages of good heat dissipation effect, small volume, small conductive resistance of the printed circuit conductor and low loss, and the electronic surface switching device 2 can be soldered by using the surface mounting process of the machine, thereby improving reliability and yield.
  • the manufacturing cost is reduced; the conductive metal block 11 and the conductive heat sink block 12 can be used as the two terminals of the switch circuit to facilitate connection with external circuits.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Combinations Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

本申请公开了一种基于印刷电路板的开关电路结构，包括印刷电路板和一个以上的电子开关器件，印刷电路板包括依次相连的导电的基板、导热绝缘层和金属导线层，金属导线层包括一组以上的导电金属导线和控制金属导线，每个电子开关器件设有两导电极和一控制极，其特征在于在导热绝缘层设有与每组导电金属导线和控制金属导线对应的窗口，每个电子开关器件的一导电极与各自的导电金属导线焊接，另一导电极穿过该窗口与基板焊接，控制极与各自的控制金属导线焊接。本申请具有用材较少、体积小、电阻小、损耗低、成品率高、制造成本低的优点，且散热效果和可靠性好，其适用范围更广。

Description

基于印刷电路板的开关电路结构 技术领域
本实用新型涉及一种开关电路结构，特别是基于印刷电路板的开关电路结构。
背景技术
由于功率半导体技术飞速的发展，单只功率电子开关器件频率、电流和电压得到飞速提升，各类大电流开关应用中，在低电压输入或者低电压输出时，由于电子开关器件的导通电压阵的影响，要使此类电子开关器件效率提高，就得并联多只电子开关器件，降低电子开关器件内阻；前述应用中，一般是并联或者串联后再并联多只电子开关器件，随着所需并联器件数量上升，器件的发热及散热问题也更加突出，同时，由于目前大电流低内阻电子开关器件的封装多为印刷电路板引脚焊接形式，由于电子开关需要焊接的两导电极及控制极都处在同一个平面，且控制极不能和任意一个导电极相连，使用两铜板拼接的方式，要么其中两个极会处于同一个极板上，需要垫入绝缘体，要么使用更复杂的工艺，增加另外一个印刷电路板，且焊接引脚较多，在大电流条件下，需要连接的引线发热也不可忽视，导致整个装置不仅使用材料较多、体积较大、电阻大、损耗高、制造成本高，且散热效果和可靠性较差，使用受到限制。
实用新型内容
本实用新型的目的是针对现有技术存在的上述不足，提供一种基于印刷电路板的开关电路结构，它具有用材较少、体积小、电阻小、损耗低、成品率高、制造成本低的优点，且散热效果和可靠性好，其适用范围更广。
为达到上述目的，本实用新型的基于印刷电路板的开关电路结构，包括印刷电路板和一个以上的电子开关器件，印刷电路板包括依次相连的导电的基板、导热绝缘层和金属导线层，金属导线层包括一组以上的导电金属导线和控制金属导线，每个电子开关器件设有两导电极和一控制极，其特征在于在导热绝缘层设有与每组导电金属导线和控制金属导线对应的窗口，每个电子开关器件的一导电极与各自的导电金属导线焊接，另一导电极穿过该窗口与基板焊接，控制极与各自的控制金属导线焊接；
本实用新型由于在导热绝缘层设有对应的窗口，每个电子开关器件的一导电极和控制极与处于同一平面的导电金属导线或控制金属导线焊接，另一导电极穿过该窗口与基板焊接，无需再垫入绝缘体或增加另外一个印刷电路板，基板及导热绝缘层厚度可减小，减少了用材及焊接引脚，因此具有散热效果好、体积小、印制电路导体导电电阻小、损耗低的优点，并可使用机器表面贴装工艺焊接电子开关器件，提高了可靠性及成品率，降低了制造成本；
作为本实用新型的进一步改进，在金属导线层上通过螺钉及绝缘垫设有导电金属块，导电金属块与各导电金属导线接触；各电子开关器件的一导电极通过各自的导电金属导线均与导电金属块导通，导电金属块可作为开关电路的一引出极；
作为本实用新型的进一步改进，在基板的一侧固联有导电散热块；导电散热块既可增强散热，又可作为开关电路的另一引出极；
综上所述，本实用新型具有用材较少、体积小、电阻小、损耗低、成品率高、制造成本低的优点，且散热效果和可靠性好，其适用范围更广。
附图说明
图1为本实用新型实施例中印刷电路板的立体图。
图2为图1中导热绝缘层的立体图。
图3为本实用新型实施例的主视图。
图4为图3的左视图。
图5为图4中I处的局部放大图。
具体实施方式
下面结合附图对本实用新型作进一步详细的说明。
如图1至图5所示，该基于印刷电路板的开关电路结构，包括印刷电路板1和三个电子开关器件2，印刷电路板1包括依次相连的导电的基板3、导热绝缘层4和金属导线层5，基板3为容易焊接、导热和导电良好的材料，如铜基印制电路板，导热绝缘层4可采用环氧树脂或陶瓷粉末，金属导线层包括三组导电金属导线6和控制金属导线7，每个电子开关器件2设有两导电极和一控制极，如场效应晶体管，在导热绝缘层4设有与每组导电金属导线6和控制金属导线7对应的窗口8，每个电子开关器件2的一导电极与各自的导电金属导线6焊接，另一导电极穿过该窗口8与基板3焊接，控制极与各自的控制金属导线7焊接；在金属导线层5上通过螺钉9及绝缘垫10设有导电金属块11，导电金属块11与各导电金属导线6接触；在基板3的一侧固联有导电散热块12；
本实用新型由于在导热绝缘层4设有对应的窗口8，每个电子开关器件2的一导电极和控制极与处于同一平面的导电金属导线6或控制金属导线7焊接，另一导电极穿过该窗口8与基板3焊接，无需再垫入绝缘体或增加另外一个印刷电路板，基板3及导热绝缘层4厚度可减小，减少了用 材及焊接引脚，因此具有散热效果好、体积小、印制电路导体导电电阻小、损耗低的优点，并可使用机器表面贴装工艺焊接电子开关器件2，提高了可靠性及成品率，降低了制造成本；导电金属块11和导电散热块12可作为开关电路的两引出极，便于与外界电路连接。

Claims (3)

  1. 一种基于印刷电路板的开关电路结构，包括印刷电路板和一个以上的电子开关器件，印刷电路板包括依次相连的导电的基板、导热绝缘层和金属导线层，金属导线层包括一组以上的导电金属导线和控制金属导线，每个电子开关器件设有两导电极和一控制极，其特征在于在导热绝缘层设有与每组导电金属导线和控制金属导线对应的窗口，每个电子开关器件的一导电极与各自的导电金属导线焊接，另一导电极穿过该窗口与基板焊接，控制极与各自的控制金属导线焊接。
  2. 如权利要求1所述的基于印刷电路板的开关电路结构，其特征在于在金属导线层上通过螺钉及绝缘垫设有导电金属块，导电金属块与各导电金属导线接触。
  3. 如权利要求1或2所述的基于印刷电路板的开关电路结构，其特征在于在基板的一侧固联有导电散热块。
PCT/CN2015/000068 2014-02-19 2015-01-29 基于印刷电路板的开关电路结构 WO2015124036A1 (zh)

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