CN203775524U - 基于印刷电路板的开关电路结构 - Google Patents

基于印刷电路板的开关电路结构 Download PDF

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CN203775524U
CN203775524U CN201420071523.0U CN201420071523U CN203775524U CN 203775524 U CN203775524 U CN 203775524U CN 201420071523 U CN201420071523 U CN 201420071523U CN 203775524 U CN203775524 U CN 203775524U
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printed circuit
circuit board
conductive
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刘晓霖
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/58—Electric connections to or between contacts; Terminals
    • H01H1/5805—Connections to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10053—Switch
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Abstract

本实用新型公开了一种基于印刷电路板的开关电路结构，包括印刷电路板和一个以上的电子开关器件，印刷电路板包括依次相连的导电的基板、导热绝缘层和金属导线层，金属导线层包括一组以上的导电金属导线和控制金属导线，每个电子开关器件设有两导电极和一控制极，其特征在于在导热绝缘层设有与每组导电金属导线和控制金属导线对应的窗口，每个电子开关器件的一导电极与各自的导电金属导线焊接，另一导电极穿过该窗口与基板焊接，控制极与各自的控制金属导线焊接。本实用新型具有用材较少、体积小、电阻小、损耗低、成品率高、制造成本低的优点，且散热效果和可靠性好，其适用范围更广。

Description

基于印刷电路板的开关电路结构
技术领域
 本实用新型涉及一种开关电路结构，特别是基于印刷电路板的开关电路结构。
背景技术
由于功率半导体技术飞速的发展，单只功率电子开关器件频率、电流和电压得到飞速提升，各类大电流开关应用中，在低电压输入或者低电压输出时，由于电子开关器件的导通电压阵的影响，要使此类电子开关器件效率提高，就得并联多只电子开关器件，降低电子开关器件内阻；前述应用中，一般是并联或者串联后再并联多只电子开关器件，随着所需并联器件数量上升，器件的发热及散热问题也更加突出，同时，由于目前大电流低内阻电子开关器件的封装多为印刷电路板引脚焊接形式，由于电子开关需要焊接的两导电极及控制极都处在同一个平面，且控制极不能和任意一个导电极相连，使用两铜板拼接的方式，要么其中两个极会处于同一个极板上，需要垫入绝缘体，要么使用更复杂的工艺，增加另外一个印刷电路板，且焊接引脚较多，在大电流条件下，需要连接的引线发热也不可忽视，导致整个装置不仅使用材料较多、体积较大、电阻大、损耗高、制造成本高，且散热效果和可靠性较差，使用受到限制。
实用新型内容
本实用新型的目的是针对现有技术存在的上述不足，提供一种基于印刷电路板的开关电路结构，它具有用材较少、体积小、电阻小、损耗低、成品率高、制造成本低的优点，且散热效果和可靠性好，其适用范围更广。
为达到上述目的，本实用新型的基于印刷电路板的开关电路结构，包括印刷电路板和一个以上的电子开关器件，印刷电路板包括依次相连的导电的基板、导热绝缘层和金属导线层，金属导线层包括一组以上的导电金属导线和控制金属导线，每个电子开关器件设有两导电极和一控制极，其特征在于在导热绝缘层设有与每组导电金属导线和控制金属导线对应的窗口，每个电子开关器件的一导电极与各自的导电金属导线焊接，另一导电极穿过该窗口与基板焊接，控制极与各自的控制金属导线焊接；
本实用新型由于在导热绝缘层设有对应的窗口，每个电子开关器件的一导电极和控制极与处于同一平面的导电金属导线或控制金属导线焊接，另一导电极穿过该窗口与基板焊接，无需再垫入绝缘体或增加另外一个印刷电路板，基板及导热绝缘层厚度可减小，减少了用材及焊接引脚，因此具有散热效果好、体积小、印制电路导体导电电阻小、损耗低的优点，并可使用机器表面贴装工艺焊接电子开关器件，提高了可靠性及成品率，降低了制造成本；
作为本实用新型的进一步改进，在金属导线层上通过螺钉及绝缘垫设有导电金属块，导电金属块与各导电金属导线接触；各电子开关器件的一导电极通过各自的导电金属导线均与导电金属块导通，导电金属块可作为开关电路的一引出极；
作为本实用新型的进一步改进，在基板的一侧固联有导电散热块；导电散热块既可增强散热，又可作为开关电路的另一引出极；
综上所述，本实用新型具有用材较少、体积小、电阻小、损耗低、成品率高、制造成本低的优点，且散热效果和可靠性好，其适用范围更广。 
附图说明
图1为本实用新型实施例中印刷电路板的立体图。
图2为图1中导热绝缘层的立体图。
图3为本实用新型实施例的主视图。
图4为图3的左视图。
图5为图4中Ⅰ处的局部放大图。
具体实施方式
下面结合附图对本实用新型作进一步详细的说明。
如图1至图5所示，该基于印刷电路板的开关电路结构，包括印刷电路板1和三个电子开关器件2，印刷电路板1包括依次相连的导电的基板3、导热绝缘层4和金属导线层5，基板3为容易焊接、导热和导电良好的材料，如铜基印制电路板，导热绝缘层4可采用环氧树脂或陶瓷粉末，金属导线层包括三组导电金属导线6和控制金属导线7，每个电子开关器件2设有两导电极和一控制极，如场效应晶体管、三极管、碳化硅晶体管等，在导热绝缘层4设有与每组导电金属导线6和控制金属导线7对应的窗口8，每个电子开关器件2的一导电极与各自的导电金属导线6焊接，另一导电极穿过该窗口8与基板3焊接，控制极与各自的控制金属导线7焊接；在金属导线层5上通过螺钉9及绝缘垫10设有导电金属块11，导电金属块11与各导电金属导线6接触；在基板3的一侧固联有导电散热块12；
本实用新型由于在导热绝缘层4设有对应的窗口8，每个电子开关器件2的一导电极和控制极与处于同一平面的导电金属导线6或控制金属导线7焊接，另一导电极穿过该窗口8与基板3焊接，无需再垫入绝缘体或增加另外一个印刷电路板，基板3及导热绝缘层4厚度可减小，减少了用材及焊接引脚，因此具有散热效果好、体积小、印制电路导体导电电阻小、损耗低的优点，并可使用机器表面贴装工艺焊接电子开关器件2，提高了可靠性及成品率，降低了制造成本；导电金属块11和导电散热块12可作为开关电路的两引出极，便于与外界电路连接。

Claims (3)

1.一种基于印刷电路板的开关电路结构，包括印刷电路板和一个以上的电子开关器件，印刷电路板包括依次相连的导电的基板、导热绝缘层和金属导线层，金属导线层包括一组以上的导电金属导线和控制金属导线，每个电子开关器件设有两导电极和一控制极，其特征在于在导热绝缘层设有与每组导电金属导线和控制金属导线对应的窗口，每个电子开关器件的一导电极与各自的导电金属导线焊接，另一导电极穿过该窗口与基板焊接，控制极与各自的控制金属导线焊接。
2.如权利要求1所述的基于印刷电路板的开关电路结构，其特征在于在金属导线层上通过螺钉及绝缘垫设有导电金属块，导电金属块与各导电金属导线接触。
3. 如权利要求1或2所述的基于印刷电路板的开关电路结构，其特征在于在基板的一侧固联有导电散热块。
CN201420071523.0U 2014-02-19 2014-02-19 基于印刷电路板的开关电路结构 Expired - Lifetime CN203775524U (zh)

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PCT/CN2015/000068 WO2015124036A1 (zh) 2014-02-19 2015-01-29 基于印刷电路板的开关电路结构

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WO2015124036A1 (zh) * 2014-02-19 2015-08-27 刘晓霖 基于印刷电路板的开关电路结构

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CN106793478A (zh) * 2017-03-31 2017-05-31 三禾电器(福建)有限公司 一种带有窗口的电路板

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CN2786910Y (zh) * 2005-05-13 2006-06-07 佳总兴业股份有限公司 一种印刷电路复合板
US8648643B2 (en) * 2012-02-24 2014-02-11 Transphorm Inc. Semiconductor power modules and devices
CN203279343U (zh) * 2013-06-07 2013-11-06 深圳市恒瑞灵机电有限公司 一种具有散热功能的电动装置
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