JP2011040882A5 - - Google Patents
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- Publication number
- JP2011040882A5 JP2011040882A5 JP2009184674A JP2009184674A JP2011040882A5 JP 2011040882 A5 JP2011040882 A5 JP 2011040882A5 JP 2009184674 A JP2009184674 A JP 2009184674A JP 2009184674 A JP2009184674 A JP 2009184674A JP 2011040882 A5 JP2011040882 A5 JP 2011040882A5
- Authority
- JP
- Japan
- Prior art keywords
- dielectric
- high frequency
- substrate
- frequency device
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 description 12
- 230000001939 inductive effect Effects 0.000 description 8
- 239000004642 Polyimide Substances 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009184674A JP2011040882A (ja) | 2009-08-07 | 2009-08-07 | 高周波デバイス |
| CN201010241077XA CN101996979B (zh) | 2009-08-07 | 2010-07-30 | 中介层、包括该中介层的模块及电子装置 |
| TW99125503A TWI441307B (zh) | 2009-08-07 | 2010-07-30 | 內插器、模組及包括該內插器之電子裝置 |
| US12/847,182 US8546911B2 (en) | 2009-08-07 | 2010-07-30 | High frequency device |
| US12/847,240 US20110032685A1 (en) | 2009-08-07 | 2010-07-30 | Interposer, module, and electronics device including the same |
| CN201010243766.4A CN101997506B (zh) | 2009-08-07 | 2010-08-02 | 高频装置 |
| EP20100008048 EP2284888A3 (en) | 2009-08-07 | 2010-08-02 | Interposer, module and electronics device including the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009184674A JP2011040882A (ja) | 2009-08-07 | 2009-08-07 | 高周波デバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011040882A JP2011040882A (ja) | 2011-02-24 |
| JP2011040882A5 true JP2011040882A5 (https=) | 2012-09-13 |
Family
ID=43534177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009184674A Pending JP2011040882A (ja) | 2009-08-07 | 2009-08-07 | 高周波デバイス |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8546911B2 (https=) |
| JP (1) | JP2011040882A (https=) |
| CN (1) | CN101997506B (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5540912B2 (ja) * | 2009-08-12 | 2014-07-02 | 株式会社村田製作所 | 積層型フィルタ |
| FR2961345A1 (fr) * | 2010-06-10 | 2011-12-16 | St Microelectronics Tours Sas | Circuit integre passif |
| JP5339092B2 (ja) * | 2010-07-22 | 2013-11-13 | Ｔｄｋ株式会社 | バンドパスフィルタモジュール及びモジュール基板 |
| CN103824755A (zh) * | 2012-11-16 | 2014-05-28 | 中国科学院上海微系统与信息技术研究所 | 高q电感及制备方法 |
| JP2014170811A (ja) * | 2013-03-01 | 2014-09-18 | Sony Corp | ＣＳＰ（ＣｈｉｐＳｉｚｅＰａｃｋａｇｅ） |
| JP6334439B2 (ja) * | 2015-03-12 | 2018-05-30 | 日本電信電話株式会社 | 集積回路内信号伝播構造 |
| CN105140218A (zh) * | 2015-09-01 | 2015-12-09 | 中国科学院上海微系统与信息技术研究所 | 一种高品质因数电感制造方法 |
| CN105118771A (zh) * | 2015-09-01 | 2015-12-02 | 中国科学院上海微系统与信息技术研究所 | 一种高品质因数电容制造方法 |
| DE102016107678B4 (de) * | 2016-04-26 | 2023-12-28 | Infineon Technologies Ag | Halbleitervorrichtungen mit on-chip-antennen und deren herstellung |
| CN105895507B (zh) * | 2016-05-09 | 2018-12-14 | 中国科学院上海微系统与信息技术研究所 | 基于绝缘体上硅衬底的射频电容元件及其制备方法 |
| JP2018041767A (ja) * | 2016-09-05 | 2018-03-15 | アンリツ株式会社 | 波形整形回路及びその製造方法とパルスパターン発生器 |
| DE102019109200B4 (de) * | 2019-04-08 | 2024-03-07 | Infineon Technologies Ag | Halbleitervorrichtungen mit nicht-galvanischer verbindung |
| US20210281234A1 (en) * | 2020-03-07 | 2021-09-09 | Qualcomm Incorporated | Hybrid three dimensional inductor |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4959705A (en) * | 1988-10-17 | 1990-09-25 | Ford Microelectronics, Inc. | Three metal personalization of application specific monolithic microwave integrated circuit |
| JPH0677407A (ja) * | 1992-04-06 | 1994-03-18 | Nippon Precision Circuits Kk | 半導体装置 |
| JP3631667B2 (ja) | 2000-06-29 | 2005-03-23 | 京セラ株式会社 | 配線基板およびその導波管との接続構造 |
| JP4130323B2 (ja) * | 2002-03-28 | 2008-08-06 | 株式会社東芝 | 高周波フィルタ及び高周波集積回路 |
| JP4159378B2 (ja) * | 2002-04-25 | 2008-10-01 | 三菱電機株式会社 | 高周波装置とその製造方法 |
| JP2004235602A (ja) * | 2002-12-06 | 2004-08-19 | Matsushita Electric Ind Co Ltd | 高周波回路とその製造方法 |
| US7075167B2 (en) * | 2003-08-22 | 2006-07-11 | Agere Systems Inc. | Spiral inductor formed in a semiconductor substrate |
| JP4541718B2 (ja) * | 2004-02-16 | 2010-09-08 | 三菱電機株式会社 | 高周波集積回路とその製造方法 |
| US8359349B2 (en) * | 2004-03-18 | 2013-01-22 | Nokia Corporation | System and associated terminal, method and computer program product for uploading content |
| JP2007053124A (ja) * | 2005-08-15 | 2007-03-01 | Renesas Technology Corp | 半導体装置 |
| JP2007220874A (ja) | 2006-02-16 | 2007-08-30 | Murata Mfg Co Ltd | 積層型セラミック電子部品及びｌｃノイズフィルタ |
| US7518229B2 (en) | 2006-08-03 | 2009-04-14 | International Business Machines Corporation | Versatile Si-based packaging with integrated passive components for mmWave applications |
| US7855685B2 (en) | 2007-09-28 | 2010-12-21 | Delphi Technologies, Inc. | Microwave communication package |
| US7710329B2 (en) * | 2007-11-26 | 2010-05-04 | Infineon Technologies Austria Ag | System including an inter-chip communication system |
| TWI441307B (zh) * | 2009-08-07 | 2014-06-11 | 新力股份有限公司 | 內插器、模組及包括該內插器之電子裝置 |
-
2009
- 2009-08-07 JP JP2009184674A patent/JP2011040882A/ja active Pending
-
2010
- 2010-07-30 US US12/847,182 patent/US8546911B2/en not_active Expired - Fee Related
- 2010-08-02 CN CN201010243766.4A patent/CN101997506B/zh not_active Expired - Fee Related
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