JP2010538462A5 - - Google Patents

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Publication number
JP2010538462A5
JP2010538462A5 JP2010522986A JP2010522986A JP2010538462A5 JP 2010538462 A5 JP2010538462 A5 JP 2010538462A5 JP 2010522986 A JP2010522986 A JP 2010522986A JP 2010522986 A JP2010522986 A JP 2010522986A JP 2010538462 A5 JP2010538462 A5 JP 2010538462A5
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JP
Japan
Prior art keywords
die
adhesive coating
release film
support substrate
active surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010522986A
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English (en)
Japanese (ja)
Other versions
JP5187863B2 (ja
JP2010538462A (ja
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Publication date
Priority claimed from US11/846,671 external-priority patent/US7595226B2/en
Application filed filed Critical
Publication of JP2010538462A publication Critical patent/JP2010538462A/ja
Publication of JP2010538462A5 publication Critical patent/JP2010538462A5/ja
Application granted granted Critical
Publication of JP5187863B2 publication Critical patent/JP5187863B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010522986A 2007-08-29 2008-06-25 集積回路ダイのパッケージング方法及びパッケージ工程中に集積回路ダイを一時的に保持するための構造 Expired - Fee Related JP5187863B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/846,671 2007-08-29
US11/846,671 US7595226B2 (en) 2007-08-29 2007-08-29 Method of packaging an integrated circuit die
PCT/US2008/068076 WO2009032389A1 (en) 2007-08-29 2008-06-25 Method of packaging an integrated circuit die

Publications (3)

Publication Number Publication Date
JP2010538462A JP2010538462A (ja) 2010-12-09
JP2010538462A5 true JP2010538462A5 (enExample) 2011-08-11
JP5187863B2 JP5187863B2 (ja) 2013-04-24

Family

ID=40408116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010522986A Expired - Fee Related JP5187863B2 (ja) 2007-08-29 2008-06-25 集積回路ダイのパッケージング方法及びパッケージ工程中に集積回路ダイを一時的に保持するための構造

Country Status (7)

Country Link
US (1) US7595226B2 (enExample)
EP (1) EP2186125A1 (enExample)
JP (1) JP5187863B2 (enExample)
KR (1) KR101483419B1 (enExample)
CN (1) CN101790781B (enExample)
TW (1) TWI423350B (enExample)
WO (1) WO2009032389A1 (enExample)

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