JP2010537402A - 複口径ドリル加工スルーホールおよびバイアを用いたバックプレーン搭載高速ルータ - Google Patents

複口径ドリル加工スルーホールおよびバイアを用いたバックプレーン搭載高速ルータ Download PDF

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Publication number
JP2010537402A
JP2010537402A JP2010521034A JP2010521034A JP2010537402A JP 2010537402 A JP2010537402 A JP 2010537402A JP 2010521034 A JP2010521034 A JP 2010521034A JP 2010521034 A JP2010521034 A JP 2010521034A JP 2010537402 A JP2010537402 A JP 2010537402A
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Japan
Prior art keywords
hole
circuit board
pattern
conductive
longitudinal section
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Pending
Application number
JP2010521034A
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English (en)
Japanese (ja)
Inventor
ゴエルゲン，ジョエル，アール．
ハント，グレッグ
Original Assignee
フォース テン ネットワークス，インク．
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Application filed by フォース テン ネットワークス，インク． filed Critical フォース テン ネットワークス，インク．
Publication of JP2010537402A publication Critical patent/JP2010537402A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0242—Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2010521034A 2007-08-13 2008-08-13 複口径ドリル加工スルーホールおよびバイアを用いたバックプレーン搭載高速ルータ Pending JP2010537402A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/891,785 US8158892B2 (en) 2007-08-13 2007-08-13 High-speed router with backplane using muli-diameter drilled thru-holes and vias
PCT/US2008/009713 WO2009023238A1 (fr) 2007-08-13 2008-08-13 Routeur grande vitesse à fond de panier utilisant des trous débouchants et des trous d'interconnexion alésés à plusieurs diamètres

Publications (1)

Publication Number Publication Date
JP2010537402A true JP2010537402A (ja) 2010-12-02

Family

ID=39952294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010521034A Pending JP2010537402A (ja) 2007-08-13 2008-08-13 複口径ドリル加工スルーホールおよびバイアを用いたバックプレーン搭載高速ルータ

Country Status (6)

Country Link
US (2) US8158892B2 (fr)
EP (1) EP2179634B1 (fr)
JP (1) JP2010537402A (fr)
CN (1) CN201709040U (fr)
TW (1) TWI462656B (fr)
WO (1) WO2009023238A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014534642A (ja) * 2011-11-09 2014-12-18 サンミナ コーポレーションSanmina Corporation 高域伝送用電気工学受動素子を埋め込んだプリント回路基板
US8957325B2 (en) 2013-01-15 2015-02-17 Fujitsu Limited Optimized via cutouts with ground references
US9380704B2 (en) 2011-03-30 2016-06-28 Nec Corporation Transmission system and method for constructing backplane system
US9397418B2 (en) 2011-03-30 2016-07-19 Nec Corporation Transmission system and method for constructing backplane system
KR20160099476A (ko) * 2015-02-12 2016-08-22 (주) 다우리시스템 백플레인 보드
JP2016539504A (ja) * 2013-11-21 2016-12-15 ツェットエフ、フリードリッヒスハーフェン、アクチエンゲゼルシャフトＺｆ Ｆｒｉｅｄｒｉｃｈｓｈａｆｅｎ Ａｇ 多機能型高電流用回路基板
JP2017005266A (ja) * 2016-09-07 2017-01-05 日本電気株式会社 伝送路構造、その製造方法、および伝送路選択方法
US9788415B2 (en) 2015-05-13 2017-10-10 Fujitsu Limited Circuit board, electronic device, and method of manufacturing circuit board

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007002342B3 (de) * 2007-01-16 2008-10-16 Friwo Mobile Power Gmbh Vereinfachte primärseitige Ansteuerschaltung für den Schalter in einem Schaltnetzteil
WO2008135305A1 (fr) * 2007-05-08 2008-11-13 International Business Machines Corporation Procédé et appareil servant à une compensation du délai programmable et extensible pour des signaux de synchronisation en temps réel dans un système multiprocesseur avec une commande de fréquence individuelle
US8158892B2 (en) * 2007-08-13 2012-04-17 Force10 Networks, Inc. High-speed router with backplane using muli-diameter drilled thru-holes and vias
EP2051360B1 (fr) * 2007-10-17 2016-09-21 Power Systems Technologies GmbH Circuit de commande pour un bloc à découpage à commande primaire avec precision amèliorèe du réglage de la tension ainsi que un bloc à découpage à commande primaire
CN101460018B (zh) * 2007-12-14 2011-02-16 华为技术有限公司 一种印制电路板及其制造方法、射频装置
US20090188710A1 (en) * 2008-01-30 2009-07-30 Cisco Technology, Inc. System and method for forming filled vias and plated through holes
US7948348B2 (en) 2008-05-28 2011-05-24 Flextronics Ap, Llc Cross-core transformer
JP2010027654A (ja) * 2008-07-15 2010-02-04 Nec Corp 配線基板、配線基板のビア形成方法、及び配線基板の製造方法
US8230592B2 (en) * 2008-08-19 2012-07-31 International Business Machines Corporation Method for via stub elimination
TW201130251A (en) * 2009-02-27 2011-09-01 Agency Science Tech & Res Wireless transmission of layered signals in a relay network
CN102396299A (zh) * 2009-04-13 2012-03-28 惠普开发有限公司 反钻验证部件
CN101944851B (zh) 2009-05-07 2014-10-29 弗莱克斯电子有限责任公司 功率变换器的能量恢复缓冲电路
EP2520141A2 (fr) * 2009-11-27 2012-11-07 BAE Systems Plc. Carte de circuits imprimés
DE102009057260A1 (de) * 2009-12-08 2011-08-04 ERNI Electronics GmbH, 73099 Relief-Steckverbinder und Multilayerplatine
US8586873B2 (en) * 2010-02-23 2013-11-19 Flextronics Ap, Llc Test point design for a high speed bus
WO2011126646A2 (fr) * 2010-03-31 2011-10-13 Flextronics Ap, Llc Rétroperçage amélioré de cartes de circuits imprimés multicouches
JP2012195389A (ja) * 2011-03-15 2012-10-11 Fujitsu Ltd 配線基板、配線基板ユニット、電子装置、及び配線基板の製造方法
US8889999B2 (en) * 2011-10-24 2014-11-18 Cisco Technology, Inc. Multiple layer printed circuit board with unplated vias
JP5919873B2 (ja) * 2012-02-21 2016-05-18 富士通株式会社 多層配線基板及び電子機器
US9269593B2 (en) * 2012-05-29 2016-02-23 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Multilayer electronic structure with integral stepped stacked structures
US9203293B2 (en) 2012-06-11 2015-12-01 Power Systems Technologies Ltd. Method of suppressing electromagnetic interference emission
US9203292B2 (en) 2012-06-11 2015-12-01 Power Systems Technologies Ltd. Electromagnetic interference emission suppressor
US9287792B2 (en) 2012-08-13 2016-03-15 Flextronics Ap, Llc Control method to reduce switching loss on MOSFET
US9312775B2 (en) 2012-08-15 2016-04-12 Flextronics Ap, Llc Reconstruction pulse shape integrity in feedback control environment
US9318965B2 (en) 2012-10-10 2016-04-19 Flextronics Ap, Llc Method to control a minimum pulsewidth in a switch mode power supply
US9605860B2 (en) 2012-11-02 2017-03-28 Flextronics Ap, Llc Energy saving-exhaust control and auto shut off system
US9660540B2 (en) 2012-11-05 2017-05-23 Flextronics Ap, Llc Digital error signal comparator
US9545003B2 (en) * 2012-12-28 2017-01-10 Fci Americas Technology Llc Connector footprints in printed circuit board (PCB)
BR112015016946B1 (pt) * 2013-01-15 2021-10-13 Nsk Ltd. Placa de circuito impresso e estrutura de supressão de ruído
US9323267B2 (en) 2013-03-14 2016-04-26 Flextronics Ap, Llc Method and implementation for eliminating random pulse during power up of digital signal controller
US9494658B2 (en) 2013-03-14 2016-11-15 Flextronics Ap, Llc Approach for generation of power failure warning signal to maximize useable hold-up time with AC/DC rectifiers
US10820427B2 (en) * 2013-03-15 2020-10-27 Sanmina Corporation Simultaneous and selective wide gap partitioning of via structures using plating resist
US9184668B2 (en) 2013-03-15 2015-11-10 Flextronics Ap, Llc Power management integrated circuit partitioning with dedicated primary side control winding
US8654553B1 (en) 2013-03-15 2014-02-18 Flextronics Ap, Llc Adaptive digital control of power factor correction front end
US9369000B2 (en) 2013-03-15 2016-06-14 Flextronics Ap, Llc Sweep frequency for multiple magnetic resonant power transmission using alternating frequencies
US20140268610A1 (en) * 2013-03-15 2014-09-18 Gregory HALVORSON Method and system for forming a microvia in a printed circuit board
TWI488553B (zh) * 2013-07-08 2015-06-11 Boardtek Electronics Corp 電路板及其製造方法
US9462703B2 (en) 2013-10-02 2016-10-04 International Business Machines Corporation Solder void reduction between electronic packages and printed circuit boards
JP6723156B2 (ja) 2014-01-22 2020-07-15 サンミナ コーポレーションＳａｎｍｉｎａ Ｃｏｒｐｏｒａｔｉｏｎ 高いアスペクト比を有するめっきスルーホールの形成方法およびプリント回路基板中の高精度なスタブ除去方法
US9621053B1 (en) 2014-08-05 2017-04-11 Flextronics Ap, Llc Peak power control technique for primary side controller operation in continuous conduction mode
US9560742B2 (en) * 2014-11-11 2017-01-31 Alcatel Lucent Backdrill reliability anchors
WO2016081855A1 (fr) 2014-11-21 2016-05-26 Amphenol Corporation Fond de panier adapté pour un connecteur électrique à haute densité et grande vitesse
US9907156B1 (en) * 2015-03-06 2018-02-27 Juniper Networks, Inc. Cross-talk reduction for high speed signaling at ball grid array region and connector region
JP6600176B2 (ja) * 2015-06-19 2019-10-30 ホシデン株式会社 多層プリント配線板及び多層プリント配線板とコネクタとの接続構造
US10556305B2 (en) 2016-02-03 2020-02-11 The Boeing Company Aligning parts using multi-part scanning and feature based coordinate systems
US10257931B2 (en) * 2016-02-09 2019-04-09 Dell Products, L.P. Systems and methods for providing grooved vias in high-speed printed circuit boards
WO2017155997A1 (fr) 2016-03-08 2017-09-14 Amphenol Corporation Encombrement de face arrière destiné à des connecteurs électriques de haute densité, à vitesse élevée
US10201074B2 (en) 2016-03-08 2019-02-05 Amphenol Corporation Backplane footprint for high speed, high density electrical connectors
US20170318673A1 (en) * 2016-04-29 2017-11-02 Arista Networks, Inc. Connector for printed circuit board
US10251270B2 (en) * 2016-09-15 2019-04-02 Innovium, Inc. Dual-drill printed circuit board via
EP3513631B1 (fr) * 2016-09-15 2024-05-08 Google LLC Carte de circuit imprimé multicouche pour réduire la diaphonie de signal quantique
US10917976B1 (en) * 2017-07-12 2021-02-09 Juniper Networks, Inc. Designing a printed circuit board (PCB) to detect slivers of conductive material included within vias of the PCB
CN107592728B (zh) * 2017-09-26 2019-03-12 郑州云海信息技术有限公司 一种pcb布局布线的方法和结构
US10244629B1 (en) * 2017-11-03 2019-03-26 Innovium, Inc. Printed circuit board including multi-diameter vias
CN109874229B (zh) * 2017-12-04 2021-04-09 北大方正集团有限公司 Pcb板阶梯孔的制造方法及pcb板
US10524351B2 (en) * 2018-01-02 2019-12-31 Qualcomm Incorporated Printed circuit board (PCB) with stubs coupled to electromagnetic absorbing material
US10667393B2 (en) * 2018-01-04 2020-05-26 Dell Products, L.P. Stepped vias for next generation speeds
US10477672B2 (en) * 2018-01-29 2019-11-12 Hewlett Packard Enterprise Development Lp Single ended vias with shared voids
EP3788849A1 (fr) * 2018-05-03 2021-03-10 University of Limerick Structure de carte de circuit imprimé pour incorporer des composants électroniques
CN108684139B (zh) * 2018-06-01 2020-10-09 华为技术有限公司 一种电路板
WO2019241107A1 (fr) 2018-06-11 2019-12-19 Amphenol Corporation Empreinte de fond de panier destinée à des connecteurs électriques à haute densité et à haute vitesse
US20190116668A1 (en) * 2018-12-21 2019-04-18 Intel Corporation Differential via with per-layer void
JP7237572B2 (ja) * 2018-12-27 2023-03-13 京セラ株式会社 印刷配線板の製造方法及び複合印刷配線板の製造方法
US10842017B2 (en) 2019-01-29 2020-11-17 Dell Products L.P. Printed circuit boards with non-functional features
WO2020236794A1 (fr) 2019-05-20 2020-11-26 Amphenol Corporation Connecteur électrique à haut débit et haute densité
EP3979308A4 (fr) * 2019-05-31 2023-08-16 Kyocera Corporation Carte imprimée et procédé de fabrication d'une carte imprimée
CN112888163A (zh) * 2019-11-29 2021-06-01 深南电路股份有限公司 电路板及电路板的制作方法
CN110933855B (zh) * 2019-12-26 2021-07-02 昆山首源电子科技有限公司 5g信号通讯用ptfe高频电路板盲钻工艺
EP3852506A1 (fr) * 2020-01-14 2021-07-21 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Support de composants ayant un col de gravure reliant un trou de forage arrière à une connexion transversale verticale
CN115315855A (zh) 2020-01-27 2022-11-08 安费诺有限公司 具有高速安装接口的电连接器
US11637403B2 (en) 2020-01-27 2023-04-25 Amphenol Corporation Electrical connector with high speed mounting interface
KR20210146059A (ko) * 2020-05-26 2021-12-03 주식회사 케이엠더블유 Pcb 조립체
US11664626B2 (en) * 2021-07-29 2023-05-30 Dell Products L.P. Staggered press-fit fish-eye connector

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05347480A (ja) * 1992-06-15 1993-12-27 Sumitomo Bakelite Co Ltd 多層プリント配線板の製造方法
JP2004047795A (ja) * 2002-07-12 2004-02-12 Nec Corp 多層配線基板およびその製造方法
JP2006041966A (ja) * 2004-07-28 2006-02-09 Kyocera Corp 高周波モジュール
JP2007201112A (ja) * 2006-01-26 2007-08-09 Hitachi Ltd 掘削深さ検出構造を備えた回路基板及びこれが搭載された伝送装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9400261A (nl) * 1994-02-22 1995-10-02 Hollandse Signaalapparaten Bv Werkwijze voor het vervaardigen van een multilayer microwave board alsmede op deze wijze verkregen boards.
US6392160B1 (en) * 1998-11-25 2002-05-21 Lucent Technologies Inc. Backplane for radio frequency signals
US6541712B1 (en) * 2001-12-04 2003-04-01 Teradyhe, Inc. High speed multi-layer printed circuit board via
US6812803B2 (en) * 2002-02-05 2004-11-02 Force10 Networks, Inc. Passive transmission line equalization using circuit-board thru-holes
US20040108137A1 (en) * 2002-12-10 2004-06-10 Litton Systems, Inc. Cross connect via for multilayer printed circuit boards
US20040118605A1 (en) * 2002-12-20 2004-06-24 Van Der Laan Ruud Circuit board having a multi-functional hole
US6995322B2 (en) * 2003-01-30 2006-02-07 Endicott Interconnect Technologies, Inc. High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same
US7047628B2 (en) * 2003-01-31 2006-05-23 Brocade Communications Systems, Inc. Impedance matching of differential pair signal traces on printed wiring boards
US7249337B2 (en) * 2003-03-06 2007-07-24 Sanmina-Sci Corporation Method for optimizing high frequency performance of via structures
US7337537B1 (en) * 2003-09-22 2008-03-04 Alcatel Lucent Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board
JP4259311B2 (ja) * 2003-12-19 2009-04-30 株式会社日立製作所 多層配線基板
US7852635B1 (en) * 2004-05-25 2010-12-14 Lineage Power Corporation Multi-connection via
US20060203457A1 (en) * 2005-03-14 2006-09-14 Tyco Electronics Power Systems, Inc. Z-axis component connections for use in a printed wiring board
JP4676238B2 (ja) * 2005-04-18 2011-04-27 株式会社日立製作所 バックプレーンバス用メインボード、および、それを用いたルータシステム、ストレージシステム
US7291790B2 (en) * 2005-05-02 2007-11-06 Cisco Technology, Inc. Apertures for signal shaping using ground and signal PTH back-drilling
JP2008218925A (ja) * 2007-03-07 2008-09-18 Fujitsu Ltd 配線板、配線板の製造方法及び検査方法
US8158892B2 (en) * 2007-08-13 2012-04-17 Force10 Networks, Inc. High-speed router with backplane using muli-diameter drilled thru-holes and vias
US8064214B2 (en) * 2008-01-04 2011-11-22 Dialogic Corporation Press fit passive component

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05347480A (ja) * 1992-06-15 1993-12-27 Sumitomo Bakelite Co Ltd 多層プリント配線板の製造方法
JP2004047795A (ja) * 2002-07-12 2004-02-12 Nec Corp 多層配線基板およびその製造方法
JP2006041966A (ja) * 2004-07-28 2006-02-09 Kyocera Corp 高周波モジュール
JP2007201112A (ja) * 2006-01-26 2007-08-09 Hitachi Ltd 掘削深さ検出構造を備えた回路基板及びこれが搭載された伝送装置

Cited By (9)

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US9397418B2 (en) 2011-03-30 2016-07-19 Nec Corporation Transmission system and method for constructing backplane system
JP2014534642A (ja) * 2011-11-09 2014-12-18 サンミナ コーポレーションSanmina Corporation 高域伝送用電気工学受動素子を埋め込んだプリント回路基板
US8957325B2 (en) 2013-01-15 2015-02-17 Fujitsu Limited Optimized via cutouts with ground references
JP2016539504A (ja) * 2013-11-21 2016-12-15 ツェットエフ、フリードリッヒスハーフェン、アクチエンゲゼルシャフトＺｆ Ｆｒｉｅｄｒｉｃｈｓｈａｆｅｎ Ａｇ 多機能型高電流用回路基板
KR20160099476A (ko) * 2015-02-12 2016-08-22 (주) 다우리시스템 백플레인 보드
KR101672869B1 (ko) * 2015-02-12 2016-11-04 다우리시스템 주식회사 백플레인 보드
US9788415B2 (en) 2015-05-13 2017-10-10 Fujitsu Limited Circuit board, electronic device, and method of manufacturing circuit board
JP2017005266A (ja) * 2016-09-07 2017-01-05 日本電気株式会社 伝送路構造、その製造方法、および伝送路選択方法

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EP2179634B1 (fr) 2013-10-09
US8158892B2 (en) 2012-04-17
TW200917913A (en) 2009-04-16
TWI462656B (zh) 2014-11-21
US9560774B2 (en) 2017-01-31
US20120167386A1 (en) 2012-07-05
US20090045889A1 (en) 2009-02-19
WO2009023238A1 (fr) 2009-02-19
EP2179634A1 (fr) 2010-04-28
CN201709040U (zh) 2011-01-12
WO2009023238A4 (fr) 2009-04-02

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