US8064214B2 - Press fit passive component - Google Patents
Press fit passive component Download PDFInfo
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- US8064214B2 US8064214B2 US11/969,401 US96940108A US8064214B2 US 8064214 B2 US8064214 B2 US 8064214B2 US 96940108 A US96940108 A US 96940108A US 8064214 B2 US8064214 B2 US 8064214B2
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- printed circuit
- press fit
- circuit board
- component
- passive electrical
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10583—Cylindrically shaped component; Fixing means therefore
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
Definitions
- the present invention relates generally to printed circuit boards and electronic components used thereon and, more particularly, to passive electronic components and printed circuit boards including passive components.
- a standard surface mount resistor 100 is illustrated one example of a standard surface mount resistor 100 .
- the resistor 100 has a package body 102 with two solderable pads 104 for connecting the resistor to a printed circuit board.
- Surface mount passive components are generally fairly small.
- a standard surface mount resistor such as that illustrated in FIG. 1 , may be approximately rectangular with a length, L, of about 0.040 inches ( ⁇ 0.002 inches), a height, h, of about 0.018 inches ( ⁇ 0.002 inches), and a width, w, of about 0.020 inches ( ⁇ 0.002 inches).
- BGA ball grid array
- a BGA uses an array of solder balls attached to its solderable pads on one side; it uses the solder balls to connect to the circuit board or other substrates.
- BGAs have very limited space on which to place passive components, such as resistors. This limited space creates a challenge for optimal component placement.
- many printed circuit boards are now multi-layer boards and therefore, vias are used to connect surface mount components to signal traces on other board layers as well as to the solder balls of the BGA.
- FIG. 2 there is illustrated an example of a BGA circuit board 106 with solder balls 108 making up the BGA.
- the trace 110 b forms an extra stub length, which can add undesirable inductance, but is required to connect the surface mount resistor 100 to the solder ball 108 of the BGA.
- FIG. 3 illustrates an example of a vertical stub caused by a via connecting a surface mount resistor to inner signal layers of a multi-layer board.
- a surface mount resistor 100 is mounted on layer one (which is the top or bottom of the circuit board) of a multi-layer printed circuit board and connected (by its solderable terminals 104 ) to a signal trace 110 .
- a via 112 is used to connect the surface mount resistor 100 to signal traces 116 on other layers.
- a via pad 114 couples the via 112 to a signal trace 116 a on layer two, thereby forming a series connection of the trace 110 , resistor 100 and trace 116 a .
- the remaining length of the via 112 from layer three to the bottom via pad 118 on layer six is an extra vertical stub length that adds additional inductance and could act as an antenna.
- buried passive components An alternative to surface mount passive components are buried passive components.
- the resistor is screened onto an inner layer of the circuit board, generally in a rectangular area, as shown in FIG. 4 .
- a buried resistor 120 is screened onto a signal layer 122 of a circuit board and connected to traces 116 and vias 112 .
- the buried component 120 may be placed on a inner layer, thereby possibly eliminating a via needed to connect the component 120 from the top or bottom of the board to a signal trace on an inner layer, vias are still needed to form connections between the signal traces on different layers.
- the presence of the buried component 120 on the signal layer 122 actually uses up valuable via and signal trace space on the inner layers of the board.
- Press fit passive components may take up far less space on a printed circuit board than do conventional surface mount or buried passive components, and may conveniently be placed directly within the vias taking signals to or from board connection points, such as the solder balls of a BGA.
- a press fit passive component comprises a body, collar disposed at least partially about the body, the collar comprising a non-conductive material, a first solderable terminal disposed at a first end of the body, and a second solderable terminal disposed at a second opposing end of the body.
- the press fit passive component may be, for example, a resistor, capacitor, diode or inductor.
- the collar may be a dielectric material, and in one example, is a compliant dielectric material.
- the collar may be disposed substantially about a center of the body. In one example, the body is substantially cylindrically shaped.
- a printed circuit board may comprise a substrate having a first surface and a second surface, the second surface being disposed substantially opposite and substantially parallel to the first surface, a via extending through the substrate from the first surface of the substrate to the second surface of the substrate, a press fit passive component disposed at least partially within the via, and a non-conductive collar disposed at least partially around a circumference of the press fit passive component and maintaining the press fit passive component within the via.
- the non-conductive collar is constructed and arranged to provide a gas tight seal between the press fit passive component and an inner wall of the via.
- the non-conductive collar may comprise a C-ring.
- the non-conductive collar may comprise a dielectric material.
- the press fit passive component has a substantially cylindrical body and the collar is disposed at least partially around a circumference of the substantially cylindrical body.
- the printed circuit board further comprises a conductive trace disposed on the first surface of the substrate and coupled to the via, and the press fit passive component may comprise a solderable terminal that can be soldered to the conductive trace.
- the press fit passive component can be contained entirely within the via, with the solderable terminal soldered substantially flush with the conductive trace.
- a surface mount component can be disposed above the via.
- a method of assembling a printed circuit board comprises inserting a press fit passive component into a via on the printed circuit board, and soldering solderable terminals of the press fit passive component to the via. This soldering may be done, for example, by wave soldering.
- the method also includes soldering a surface mount component over the press fit passive component, and the soldering step comprises applying solder paste to the solder terminal, applying solder paste to a pad for a surface mount component, placing the surface mount component on the pad, and soldering the surface mount component to the pad.
- the press fit passive component comprises a body, two solderable terminals and a non-conductive collar disposed at least partially about the body.
- the method comprises de-soldering the solderable terminals of the press fit passive component, and removing the press fit passive component from the via.
- the non-conductive collar is dielectric collar, and removing the press fit passive component from the via includes dissolving the dielectric collar using a chemical solvent.
- the method further comprises inserting a replacement press fit passive component into the via, and soldering solderable terminals of the replacement press fit passive component to the via.
- FIG. 1 is a diagram of one example of a conventional surface mount resistor
- FIG. 2 is a diagram of one example of a conventional ball grid array (BGA) including the surface mount resistor of FIG. 1 ;
- BGA ball grid array
- FIG. 3 is a vertical cross-sectional view of one example of a conventional multi-layer printed circuit board including the surface mount resistor of FIG. 1 ;
- FIG. 4 is a diagram of one example of a conventional buried resistor
- FIG. 5 is an exploded view of one example of a press fit passive component, according to aspects of the invention.
- FIG. 6 is a vertical cross sectional view of a multi-layer printed circuit board having a press fit passive component located within a via, according to aspects of the invention
- FIG. 7 is a radial cross-sectional diagram of one example of a press fit passive component according to aspects of the invention.
- FIG. 8 is a top view of a via having a press fit passive component located therein in accordance with aspects of the invention.
- FIG. 9 is a perspective view of the via of FIG. 8 having the press fit passive component located therein;
- FIG. 10 is a diagram of one example of a BGA showing a press fit passive component replacing a conventional surface mount component, in accordance with aspects of the invention.
- FIG. 11 is a flow diagram illustrating one example of a method of assembly for a printed circuit board according to aspects of the invention.
- FIG. 12 is a cross-sectional diagram of one example of a printed circuit board and underlying plate, according to aspects of the invention.
- FIG. 13 is a cross-sectional diagram of the printed circuit board of FIG. 12 illustrating another example of an underlying plate in accordance with aspects of the invention
- FIG. 14 is a flow diagram of one example of a method of printed circuit board assembly according to aspects of the invention.
- FIG. 15 is a flow diagram of one example of a method of reworking a printed circuit board to replace a damaged press fit passive component.
- embodiments are directed to press fit passive components that may be located within (or at least partially within) vias on a printed circuit board.
- a resistor placed within a via in accordance with one embodiment, may provide a favorable solution to the problem mentioned above in terms of both component spacing constraints and proximity to the location of the signal source, as discussed further below.
- press fit passive components may facilitate optimizing space on a printed circuit board to facilitate design or more compact printed circuit boards.
- a press fit passive component is a circuit element, such as a resistor, capacitor, diode or inductor, that comprises a housing, or body, designed to fit at least partially within a via on a printed circuit board, and a collar of pliable dielectric material disposed at least partially about the body.
- a press fit passive component may have a cylindrical body sized to fit within a standard-sized via.
- vias may typically have a diameter of about 0.010 inches to 0.012 inches, and thus the press fit passive component may have a diameter slightly less than that range.
- the press fit passive component may have a similar, or smaller, size form factor to that of a standard surface mount passive component.
- press fit passive components may have any size suitable for a particular printed circuit board design, whether or not that size is the same as or similar to any standard component or via sizes.
- press fit passive components are not limited to having cylindrically shaped bodies, and may have a body that is any shape (e.g., rectangular, trapezoidal, arbitrary, etc.) dictated only by the application for which the press fit passive component is intended (for example, by the shape of the via or other cavity into which the press fit passive component is to be inserted).
- the press fit passive component 126 includes a body 132 and two solderable terminals 130 disposed at either end of the body 132 .
- the body 132 is cylindrical in shape; however, as discussed above, embodiments of the press fit passive component are not limited to being cylindrical in shape.
- a non-conductive collar 142 is disposed about a portion of the body 132 .
- this collar 142 comprises a dielectric material.
- the dielectric material may comprise a pliable material that may be deformed under pressure, such as, for example, an elastic rubber, a polymeric material or foamed polymeric material.
- the pliable material can be polytetrafluoroethylene.
- the collar 142 may be made of a material that provides minimal insertion force, adequate stability, can withstand high temperatures, and is still pliable enough to close to a complete ring upon insertion.
- the material can be a thermoset or thermoplastic polymer material.
- the dielectric collar 142 may be placed around an approximate center of the body 132 . However, it is to be appreciated that other placements of the dielectric collar 142 are also possible.
- solder 138 may be used to provide electrical connection to the press fit passive component 126 .
- the solder 138 may connect the solderable terminals 130 of the press fit passive component 126 to via pads 140 which may, in turn, be connected to signal traces (not shown) on the printed circuit board 124 .
- solder 138 may be deposited over the via 128 and via pads 140 , such that it contacts the solderable terminals 130 of the press fit passive component 126 , and standard heat processes (such as those used to solder surface mount components to a printed circuit board) may be used to melt the solder 138 and bond the press fit passive component 126 to the via pad 140 , as discussed further below.
- the press fit passive component 126 includes a dielectric collar 142 disposed about at least a portion of the body 132 .
- the dielectric collar 142 may serve to secure the press fit passive component 126 within the via 128 , particularly prior to soldering.
- the dielectric collar 142 may comprise a C-ring, as illustrated in FIG. 7 .
- the C-ring When the press fit passive component 126 is inserted (press fit) into the via 128 , the C-ring may be compressed to form a gas tight seal around the press fit passive component 126 . This is illustrated, in top view, in FIG. 8 .
- the dielectric collar 142 may thus isolate one solderable terminal 130 from the other and prevent solder 138 from leaking through the via 128 and “shorting out” the press fit passive component 126 .
- the via 128 may include conductive plating (not shown) along a portion of the via sides, for example, extending as far down the via as to reach the solderable terminals 130 of the press fit passive component 126 .
- the via 128 should have no conductive plating along at least an interior portion, for example, the area approximately corresponding to the location of the dielectric collar 142 , so as to prevent a short circuit from being formed across the press fit passive component 126 .
- CAD computer aided design
- CAD computer aided design
- the CAD software can be designed to accommodate press fit passive components.
- the CAD software can be adapted to allow placement of a press fit passive component 126 within a via 128 , and to specify plating of the via only on certain layers (such as the top and bottom layers, but not some inner layers).
- Press fit passive components may provide several advantages to printed circuit board designers and manufacturers. For example, by using press fit passive components located within vias, a printed circuit board designer may no longer need to add the extra vias and traces that were required to connect a surface mount component to appropriate signal traces (as shown in FIG. 2 ). Rather, referring to FIG. 10 , a press fit passive component (not shown) may be placed directly in the via 112 b that takes the signal from the BGA to the inner layers, obviating the need for the traces 110 a and 100 b and the extra via 112 a . Reducing the number of vias may decrease the cost of the printed circuit board and free up more space for signal traces.
- the press fit passive component takes up limited horizontal space on the printed circuit board, in one example, far less space than is used by conventional surface mount passive components (such as resistor 100 ) or buried passive components.
- a conventional surface mount resistor of the 0402 size, together with its vias takes up approximately 2400 sq. mils of surface area, whereas a press fit passive component would require only the surface area of the via in which the component is located, which is about 576 sq. mils.
- a press fit passive resistor can provide approximately 75% savings in board surface area compared to a conventional surface mount resistor.
- press fit passive components may save considerable component space on the printed circuit board and facilitate the production of higher density printed circuit boards.
- via 112 a and traces 110 a and 100 b will also eliminate the vertical stub (see FIG. 6 ) before the signal reaches the resistor.
- these vertical stubs cause unwanted inductance and can act as antennas, which can degrade the electrical performance of the board. Therefore, removal of these vertical stubs can be advantageous, particularly for high-speed devices, such as, for example, telecommunications devices.
- a method of producing a populated printed circuit board may include placing a press fit passive component on the printed circuit board before or during the process of populating the board with other active and/or passive surface components.
- FIG. 11 there is illustrated a flow diagram of one example of such a method. It is to be appreciated however, that the order of steps presented in FIG. 11 is one example only and not intended to be limiting, and that embodiments of methods of assembling printed circuit boards may use more or fewer steps than, or may be otherwise modified as compared to, those illustrated in FIG. 11 , and may implement those steps in an order different to that shown in FIG. 11 . In some applications, it may be currently preferable to place any press fit passive components on the printed circuit board before other surface mount components are placed.
- a first assembly operation on the printed circuit board may include placing the press fit passive components on the prepared printed circuit board.
- press fit passive components as used herein is intended to refer to one or more press fit passive components.
- press fit passive components may be supplied in reels that may be fed into a dispensing machine adapted to accommodate press fit passive components.
- the dispensing machine may include a press-fit insertion tool that may take a press fit passive component from the reel and press the component into a prepared via on the printed circuit board.
- a fixture may be used to hold the printed circuit board stationary while the press fit passive components are inserted into prepared vias.
- mechanical fixtures are used to hold the printed circuit boards as the boards are moved from one dispensing station to another and the components are placed on the board. Therefore, the same, or a similar, fixture may be used to hold the printed circuit boards during placement of the press fit passive components.
- a plate made of a substantially inflexible substance may be placed under the printed circuit board and pressed flush to the printed circuit board from the bottom of the board. This plate may prevent the press fit passive components from being pushed through the printed circuit board.
- a press-fit insertion tool may be used to press the component into the printed circuit board.
- the press-fit insertion tool may be controlled to exert sufficient force on the press fit passive component so as to insert it without damaging the press fit passive component.
- the press-fit insertion tool may be controllable (e.g., by way of a user interface) so as to adjust the insertion force based on, for example, the material used for the dielectric collar on the press fit passive component.
- the press fit passive component may extend out from the via above one or both of the top and bottom surfaces of the printed circuit board.
- the underlying plate may have holes formed therein that correspond to the locations of the vias through which the press fit passive component(s) may extend.
- FIG. 12 there is illustrated a printed circuit board 144 having a plurality of vias 128 (at least some of which may receive press fit passive components) formed therein.
- a plate 146 is held against the bottom surface of the printed circuit board 144 by the fixture, a portion 150 of which is schematically illustrated in FIG. 12 .
- the plate 146 has a plurality of holes 148 formed therein, as discussed above. In one example, as illustrated in FIG.
- the holes 148 are shown as being slightly larger than the vias 128 , and thus larger than the press fit passive components, in order not to damage the press fit passive components.
- the holes 148 may be formed having substantially the same size as the vias 128 , or may be larger than the vias.
- the location of vias 128 on different printed circuit boards 144 can be different. Therefore, in one example, each type of printed circuit board 144 may have a corresponding plate 146 having holes 148 precisely drilled (or otherwise formed) therein to correspond to the locations of the vias 128 .
- the underlying plate 146 may have a recessed surface 152 that may correspond to a majority of the surface area of the printed circuit board 144 (but leaving a rim around the recessed surface to allow the plate 146 to be clamped to the printed circuit board 144 ). Having this recessed surface 152 , rather than a plurality of precisely located holes 148 , may allow one plate 146 to be used for multiple different printed circuit board layouts. The depth of the holes 148 (or recessed surface 152 ) may be dependent on the height of the exposure of the press fit passive component from the surface of the printed circuit board 144 . Therefore, in one example, controlled-depth-drilling may be used to form the holes 148 (or recessed surface 152 ) to a desired depth.
- press fit passive components may be provided in reels, similar to conventional surface mount components.
- the placement of the press fit passive component in the reel may define the polarity direction of the press fit passive component, top or bottom on the printed circuit board 144 . If all of the press fit passive components were designed to have one type of polarity, either negative or positive on the top of the board, the press-fit operation may be done in one step. Alternatively, if some press fit passive components have an opposite polarity to others, the board 144 may be flipped (e.g., by rotating the fixture) over to the opposite side for a second press-fit operation.
- Rotating fixtures are known in the art and are commonly used with surface mount component dispensing machines that do not have rotatable dispensing heads, in order for the non-rotatable dispenser heads to account for the direction of the polarity of the component on the printed circuit board 144 .
- the rotating fixture may also accommodate integrated circuits (ICs), which may be rotated in different directions. Accordingly, in at least one example, such an existing fixture, or a modification thereof, may be used to hold and rotate the printed circuit board 144 during placement of the press fit passive components. When the board 144 is flipped, the underlying plate 146 may be moved from one side of the board to the other, or the plate may be removed and another plate attached to the new underside of the board.
- the dispenser may have a rotating head that will rotate to account for the direction of the polarity of the component on the printed circuit board 144 . Therefore, in at least one example, the dispenser/insertion tool for press fit passive components may have a rotating head, thus obviating the need to rotate the printed circuit board 144 with the fixture. Alternatively, a reel of press fit passive components with the opposite polarity may be provided and loaded into the dispensing machine/insertion tool.
- the press fit passive components may be soldered in place (step 202 ).
- a technique generally known in the art as wave soldering may be used to implement this step.
- a solder dispensing tool may be used to apply solder paste to the solderable terminals of the press fit passive component(s) on one side of the board 144 .
- step 202 may also include applying solder paste to the solderable pads of any surface mount components that are to be placed on that side of the printed circuit board 144 .
- the printed circuit board 144 may then be placed in clamps on a conveyor belt (step 204 ).
- the conveyor belt runs past multiple stations where mechanical dispensers press any surface mount components onto the board 144 .
- the method may skip step 204 .
- the board 144 may be sent to an infrared (IR) oven where the solder paste is melted, creating a solder joint (step 202 ). This procedure may then be repeated for the opposite side of the board (step 208 ).
- IR infrared
- press fit passive components may extend from the via 128 above the surface of the printed circuit board 144 .
- press fit passive components may be designed to fit entirely within a via 128 , such that the component may fit below the surface of the printed circuit board 144 .
- the press fit passive component may be soldered flush with the surface of the printed circuit board 144 .
- surface mount components may be placed over soldered-in press fit passive components.
- the body of the surface mount component may be placed above the press fit passive component, with its solderable pads being on either side of the press fit passive component. This arrangement may avoid the need to solder on top of an already existing solder joint (i.e., the solder joint connecting the press fit passive component to the via pad).
- the press fit passive component may be placed underneath a solderable pad for surface components such as gull wing, j-leaded or quad-pack devices.
- the press fit passive component may be located directly beneath a solder ball of a BGA.
- the assembly process may include a step of soldering the surface mount components to the pre-existing solder joints. Such “double soldering” may be accomplished, for example, by using a high melt-temperature solder paste to solder the press fit passive components, and then using a lower melt-temperature solder to solder the surface mount components.
- the difference between the two melt-temperatures for the different solder compounds may allow the surface mount components to be soldered on top of the press fit passive component solder joints without melting the existing joints.
- a method may include electrical or chemical plating over the ends of the press fit passive component. Surface mount components may then be soldered or otherwise attached to the plating.
- press fit passive components may provide a substantial savings in component space on the printed circuit board since the press fit passive component would take up no surface area on the board. However, even in embodiments in which the solderable end(s) of the press fit passive component protrude out of the printed circuit board on either or both sides, the press fit passive component may still take up far less horizontal surface area on the board than do conventional surface mount devices. Thus, press fit passive components may provide a substantial advantage to printed circuit board designers and manufacturers by reducing component surface area, which may allow smaller and/or more densely populated circuit boards to be produced.
- the printed circuit board may be tested for any faults prior to packaging and shipment to a customer.
- installed press fit passive components may be tested before other components are installed on the printed circuit board.
- a step 210 of testing the press fit passive components may be included prior to placement of any surface mount components. Where the solderable terminals of the press fit passive component are exposed (e.g., the press fit passive component extends above the surface of the printed circuit board or, even if the press fit passive component is soldered flush with the printed circuit board, no component is placed above it), the press fit passive component may be easily tested with a clamshell tester or by probing from both sides of the printed circuit board simultaneously.
- the press fit passive component is placed underneath a surface mount component pad (i.e., is concealed), other methods of testing may be required.
- the concealed press fit passive component may be tested using x-ray technology. X-ray testing is currently preferred if, for example, the press fit passive component is placed between two surface mount devices located on the top and bottom surface of the printed circuit board.
- a thin wire may be guided, using a theoretically guided program, underneath the surface mount component to a designated pin on either side of the printed circuit board simultaneously so as to test the press fit passive component.
- a rework process may be implemented to replace the component.
- FIG. 15 there is illustrated a flow diagram of one example of a rework process to replace a press fit passive component. The steps in the rework process may vary depending on whether or not the press fit passive component is located beneath a surface mount component, as indicated by block 212 .
- each side of the press fit passive component may be easily de-soldered (step 214 ). This de-soldering may be accomplished using tools and techniques known in the art. After the press fit passive component has been de-soldered, it may be removed from the via (step 216 ). As is currently preferred, removal of the press fit passive component may be achieved without damaging the printed circuit board. If the press fit passive component is located underneath a surface mount pad, the surface mount device would have to be removed first. Removal of the surface mount component (step 218 ) may be achieved using conventional tools and techniques, as known to those skilled in the art.
- a tool for removing press fit passive components may include a shaped piece of metal with a hole in the center to support the bottom of the printed circuit board, and a punch that would push the press fit passive component out of its via.
- the shaped piece of metal may be cylindrical. If only a few press fit passive components need to be removed, the tool may be implemented as a hand tool.
- the printed circuit board may be held stationary in a fixture, and a computer driven machine may manipulate the tool to remove the press fit passive component. For example, the machine may manipulate the cylindrical metal piece both vertically and horizontally under the printed circuit board in unison, with the punch on either the top or bottom of the printed circuit board.
- removal of the press fit passive component may include dissolving the dielectric collar, for example, using a chemical solvent.
- the dielectric collar may serve to secure the press fit passive component within the via. Therefore, when the dielectric collar is dissolved, the press fit passive component may be more easily removed from the via.
- a failed press fit passive component may be replaced by inserting a new press fit passive component into the via and soldering the solderable terminals (step 218 ). If appropriate for the design, the same (or a new) surface mount component may be soldered above the press fit passive component (step 220 ), for example, by using the double soldering and/or plating techniques discussed above.
Abstract
Description
Claims (14)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/969,401 US8064214B2 (en) | 2008-01-04 | 2008-01-04 | Press fit passive component |
PCT/US2008/088607 WO2009088906A1 (en) | 2008-01-04 | 2008-12-31 | Press fit passive component |
US13/243,251 US9137898B2 (en) | 2008-01-04 | 2011-09-23 | Method of manufacturing a printed circuit board including a component located in a via |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/969,401 US8064214B2 (en) | 2008-01-04 | 2008-01-04 | Press fit passive component |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US13/243,251 Division US9137898B2 (en) | 2008-01-04 | 2011-09-23 | Method of manufacturing a printed circuit board including a component located in a via |
Publications (2)
Publication Number | Publication Date |
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US20090175012A1 US20090175012A1 (en) | 2009-07-09 |
US8064214B2 true US8064214B2 (en) | 2011-11-22 |
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Application Number | Title | Priority Date | Filing Date |
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US11/969,401 Expired - Fee Related US8064214B2 (en) | 2008-01-04 | 2008-01-04 | Press fit passive component |
US13/243,251 Active 2030-10-27 US9137898B2 (en) | 2008-01-04 | 2011-09-23 | Method of manufacturing a printed circuit board including a component located in a via |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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US13/243,251 Active 2030-10-27 US9137898B2 (en) | 2008-01-04 | 2011-09-23 | Method of manufacturing a printed circuit board including a component located in a via |
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US9185807B2 (en) | 2014-01-03 | 2015-11-10 | Globalfoundries U.S. 2 Llc | Integrated circuit structures having off-axis in-hole capacitor |
US9078373B1 (en) | 2014-01-03 | 2015-07-07 | International Business Machines Corporation | Integrated circuit structures having off-axis in-hole capacitor and methods of forming |
US20170290162A1 (en) * | 2016-04-02 | 2017-10-05 | Intel Corporation | Circuit board having a passive device inside a via |
US10798821B2 (en) * | 2016-04-02 | 2020-10-06 | Intel Corporation | Circuit board having a passive device inside a via |
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Also Published As
Publication number | Publication date |
---|---|
US20120005892A1 (en) | 2012-01-12 |
WO2009088906A1 (en) | 2009-07-16 |
US20090175012A1 (en) | 2009-07-09 |
US9137898B2 (en) | 2015-09-15 |
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