JP3890306B2 - Module component and mounting method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a module component, in particular, a module component formed by a plurality of discrete components, and a method for mounting the module component on a circuit board.
[0002]
[Prior art]
An electronic or electrical circuit generally combines a plurality of active devices such as semiconductor integrated circuits (ICs) and passive components such as resistors and capacitors (hereinafter, these active devices and passive components are collectively referred to as individual components) to form a circuit board. It is formed by mounting on (printed wiring board). The mounting of these individual components on the circuit board, that is, the arrangement and connection are generally performed by previously applying a solder paste (cream solder) or the like to a predetermined connection portion of the circuit board and mounting each component (arranged at a predetermined position). Reflow soldering is performed by placing the solder paste in a reflow (high temperature) environment in which the solder paste melts or by irradiating the connection portion with heat rays such as infrared rays or laser beams to melt the solder paste.
[0003]
With recent advances in IC technology, it is possible to form a large number of elements or circuits in one package. However, in order to avoid overheating due to heat generated by the operation and to make a pair or set by aligning the electrical characteristics of a plurality of individual parts, a module part that selects and uses a plurality of individual parts as a set is required.
[0004]
Various techniques for mounting or arranging various electronic components on a printed wiring board have been proposed. For example, a mounting method for mounting a chip component, a deformed component, an IC package, and the like on a printed wiring board and an electronic component storage pallet are disclosed (for example, see Patent Document 1). According to Patent Document 1, a plurality of recesses are formed on the upper surface of a pallet, and chip parts, odd-shaped parts, IC packages, and the like are arranged in these recesses. A printed circuit board on which copper foil and solder paste are formed and deposited at predetermined positions on the bottom surface is placed on the top surface of the pallet, and the plurality of components described above are mounted together.
[0005]
Next, a general conventional module component mounting method will be described with reference to FIG. 4A is a perspective view of a conventional module component 10 having a suction case 12, and FIG. 4B is a taping (component accommodating portion) for supplying individual components 3 a and 3 b constituting the module component 10. Is a side view of 13).
[0006]
The conventional module component 10 includes a plurality of individual components 3a to 3d (hereinafter, these individual components 3a to 3d may be collectively referred to as individual components 3) mounted on an apparatus substrate (circuit board) 6. ing. The module component 10 has a suction case 12 having a substantially flat upper surface so that the circuit board of the device using the module component 10 can be automatically mounted by a suction nozzle (vacuum chuck or vacuum suction device).
[0007]
[Patent Document 1]
Japanese Patent Laid-Open No. 10-12992 (page 3, FIG. 1)
[0008]
[Problems to be solved by the invention]
The individual parts 3 constituting the module part 10 are supplied by a taping 13 including a commercially available individual part 3 as shown in FIG. However, because the module component 10 exhibits a predetermined performance, the individual component 3, particularly the active devices 3a and 3b such as ICs, may require a pair or set having matched characteristics (matched). However, if it is arbitrarily taken out from the individual parts 3 taped as described above and mounted, there are many cases where a predetermined performance cannot be exhibited. In addition, pairs (or sets) with uniform characteristics are sequentially arranged on the taping 13 in advance. It is practically difficult to supply. That is, when a mounting error occurs in one individual component of the pair having the same characteristics, for example, 3a after mounting the other individual component 3b, the already mounted individual component 3a is also removed, and the new characteristics are aligned. There was a problem that it was necessary to replace the individual parts.
[0009]
OBJECT OF THE INVENTION
The present invention has been made in view of the above-described problems of the prior art, and an object of the present invention is to provide a module component that ensures electrical characteristics and can be easily mounted on a circuit board, and a mounting method thereof.
[0010]
[Means for Solving the Problems]
In order to solve the above-described problems, the module component and the mounting method thereof according to the present invention adopt the following characteristic configuration.
[0011]
(1) In a module component that is formed by a plurality of individual components and is mounted on a circuit board in a predetermined positional relationship,
Provided is a holder in which a recess corresponding to at least the size and shape of the top of each of the plurality of individual parts is formed on the bottom surface in the predetermined positional relationship, and the top of the plurality of individual parts is fitted and temporarily held in the recess of the holder. A module part that taps a plurality of individual parts in a state where the plurality of individual parts are temporarily held by the holder .
[0012]
(2) The module component according to (1), wherein the depth of the concave portion of the holder is adjusted so that the bottom surfaces of the plurality of individual components temporarily held in the concave portion of the holder are substantially the same surface.
[0013]
(3) The module component according to (1) or (2), wherein at least a substantially central portion of the upper surface of the holder is formed flat and can be sucked by a suction nozzle.
[0014]
(4) The module component according to (1), (2), or (3), wherein the holder has a recess or opening such as another component mounted in the vicinity of the module component.
[0016]
( 5 ) In a module component mounting method for mounting a module component formed of a plurality of individual components on a circuit board in a predetermined positional relationship,
Comprising: providing a holder having a plurality of recesses are formed in said predetermined positional relationship in accordance with the plurality of individual parts dimensions,
A step of temporarily held by fitting the top of the plurality of discrete components in the recess of the holder,
Taping a plurality of holders in which the plurality of individual components are temporarily held in the recess;
Adsorbing and holding the upper surface of the taped holder and mounting it at a predetermined position of the circuit board, and connecting the individual components to the circuit board;
A module component mounting method comprising: removing the holder from the individual component connected to the circuit board .
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the configuration and operation of a preferred embodiment of a module component and its mounting method according to the present invention will be described in detail with reference to the accompanying drawings.
[0021]
First, with reference to FIGS. 1A to 1C and FIGS. 2A and 2B, a method for mounting a module component according to the present invention will be described. As shown in FIG. 1A, a holder 1 made of a heat resistant material that can withstand the high temperature of reflow solder, such as engineering plastic or rubber, is prepared. On one surface (for example, the bottom surface) of the holder 1, concave portions 2a to 2d having dimensions corresponding to the top dimensions of the individual components 3a to 3d are formed at predetermined positions where the individual components 3a to 3d are arranged. . Further, as will be described later, the other surface (upper surface) of the holder 1, that is, the surface opposite to the surface on which the above-described recess 2 is formed, is at least partially flat as an attachment reference position, and is sucked by a suction nozzle. enable.
[0022]
Next, as shown in FIG. 1 (B), the tops of the corresponding individual parts 3a to 3d are fitted into the recesses 2a to 2d of the holder 1 and temporarily held. Connection parts (not shown) such as a plurality of pads are provided on the bottom surfaces of the individual components 3. It should be noted that the depths of the recesses 2a to 2d of the holder 1 are adjusted according to the height of the individual component 3 so that the connecting portions of the bottom surfaces of these individual components 3 are flush with each other. In addition, since these individual parts 3 need to have the same electrical characteristics, those prepared as a set (or pair) part by measuring the electrical characteristics in advance are used.
[0023]
FIG. 1C shows the taping 4 with a plurality of individual parts 3 constituting a module part in a state having a plurality of corresponding individual parts 3a to 3d fitted into the plurality of recesses 2a to 2d of the holder 1 as described above. Store and store, and supply to the manufacturing and assembly site. At the assembly site, a set of a plurality of individual parts having the same characteristics and guaranteed electrical performance from the taping 4 is sucked by the suction nozzle 5 and can be automatically mounted on a circuit board (not shown).
[0024]
Next, as shown in FIG. 2A, a holder 1 on which a plurality of individual parts 3 constituting module parts are temporarily held from a taping 4 by using a suction nozzle 5 is temporarily mounted on a circuit board (or device board). 6 is moved to a predetermined position. In other words, a set of a plurality of individual parts 3 constituting a module part with uniform characteristics or guaranteed electrical characteristics is automatically mounted together with the holder 1 at a predetermined position of the circuit board 6 by using the suction nozzle 5. To do. Then, a reflow process for melting the solder paste previously applied to the connection part of the circuit board 6 is performed, and the connection pad (not shown) of the circuit board 6 and the connection part (connection pad or terminal) of the individual component 3 are formed. Connect electrically. At this time, since all the connection parts of the individual parts 3 formed on the bottom surfaces of the plurality of individual parts 3 are on the same surface as the connection pads of the circuit board 6 described above, they are in contact with each other at the same time, and appropriate soldering is performed. Note also that an electrical connection is possible.
[0025]
Finally, as shown in FIG. 2B, the holder 1 is removed from the plurality of individual components 3 constituting the module component connected to the circuit board 6. Thereby, a plurality of individual parts having different dimensional shapes, for example, heights can be collectively mounted on the circuit board 6. Moreover, since the holder 1 is removed after mounting, the circuit board 6 on which a large number of components are mounted can be reduced in height and weight.
[0026]
Next, another embodiment of the present invention will be described with reference to FIG. FIG. 3A shows a second embodiment of the module component mounting method according to the present invention. This figure shows a holder 1A used in a module component mounting method and a plurality of individual components 3a to 3d temporarily held by the holder 1A.
[0027]
The holder 1A is not substantially rectangular like the holder 1 shown in FIGS. 1 and 2 described above, and has a complicated plan view. By selecting the holder 1A in such a specific shape, when another component 7 unrelated to the module component is already mounted on the circuit board 6 in the vicinity of the module component as shown in FIG. Applicable when implemented later. Even in this embodiment, the holder 1A is removed from the individual parts 3 after the individual parts 3 are reflow soldered.
[0028]
Next, a third embodiment of the present invention will be described with reference to FIGS. 3 (C) and 3 (D). Although this embodiment is not directly related to the module parts, the other individual parts 9a and 9b mounted in the vicinity thereof can be simultaneously mounted simultaneously with the plurality of individual parts 3a to 3d constituting the module part. . Therefore, as shown in FIG. 3C, the holder 1B includes not only the recesses 2a to 2d for the plurality of individual parts 3a to 3d constituting the module part, but also the recesses 8a for the other parts 9a and 9b described above. And 8b are formed. The other parts 9a and 9b are temporarily held in the recesses 8a and 8b of the holder 1B in the same manner as the plurality of individual parts 3a to 3d constituting the Joule parts. That is, the depths of the recesses 8a and 8b are adjusted so that the connection pads (not shown) on the bottom surfaces of the separate components 9a and 9b are flush with the connection pads on the bottom surfaces of the individual components 3a to 3d. Thereby, it is possible to improve the mounting work efficiency.
[0029]
Although not shown in the drawings, as another embodiment of the present invention, when the other components 9a and 9b described above are mounted on the circuit board 6 before the module components for some reason, or other components 9a and 9b. However, in the case of being fixed in advance on the circuit board 6, in order to avoid interference with these parts instead of the above-described recesses 8a and 8b of the holder 1B, It may be a relatively large and deep recess or opening. As a result, it is possible to mount the module component by using a substantially rectangular holder and avoiding interference with other components mounted or arranged in the vicinity of the module component.
[0030]
The configuration and operation of several embodiments of the module component and the mounting method according to the present invention have been described above in detail. However, it should be understood that such embodiments are merely examples of the present invention and do not limit the present invention in any way. Those skilled in the art will readily understand that various modifications and changes can be made according to a specific application without departing from the gist of the present invention.
[0031]
【The invention's effect】
As apparent from the above description, according to the module component and the mounting method of the present invention, the following remarkable effects in practical use can be obtained. First, it is possible to hold and supply a plurality of individual parts constituting a module part as a pair or set having a predetermined characteristic.
[0032]
Secondly, a plurality of individual parts constituting the module parts are temporarily held in a predetermined predetermined positional relationship, and automatically arranged at predetermined positions on the circuit board by using a suction nozzle or the like, and reflow soldering is performed. And can be implemented efficiently. Further, at this time, since the concave portions of the holder are formed according to the shape and dimensions of a plurality of individual parts constituting the module part, regardless of the shape and dimensions of these individual parts, for example, even if their upper surfaces are non-flat surfaces Automatic mounting is possible with a suction nozzle.
[0033]
Third, when other components are arranged in the vicinity of the module component, it is possible to mount these other components all together or avoid interference with these other components. . Fourth, after mounting a plurality of individual parts constituting these module parts (along with other parts as necessary), it is possible to reduce the height and weight of the circuit board by removing the holder. .
[0034]
Fifth, it is possible to tap multiple individual parts that make up the module parts (along with other parts mounted nearby if necessary) for management or transport to the manufacturing and assembly site, resulting in good workability It is.
[Brief description of the drawings]
1A and 1B show the first half of a method for mounting module parts according to the present invention, in which FIG. 1A shows preparation of a holder, FIG. 1B shows fitting of a plurality of individual parts into a recess of the holder, and FIG. This is a taping process for accommodating a plurality of holders in which is inserted.
FIGS. 2A and 2B show the latter half of the module component mounting method according to the present invention, wherein FIG. 2A shows mounting of a holder temporarily holding a plurality of individual components on a circuit board, and FIG. 2B shows individual mounting on a circuit board. This is a process of removing the holder from the component.
3A and 3B show another embodiment of a module component mounting method according to the present invention, in which FIG. 3A is a holder for avoiding interference with another nearby component and a plurality of individual components temporarily held by the holder; ) Is a state in which the module component shown in (A) is mounted on a circuit board, (C) is a holder capable of temporarily holding another individual component arranged nearby, and (D) is a module formed in the holder of (C). The state which temporarily hold | maintained the individual component for and other individual components is shown.
4A and 4B show conventional module parts, where FIG. 4A is an overall configuration diagram of the module parts, and FIG. 4B is a state where a plurality of module parts of FIG.
[Explanation of symbols]
1, 1A, 1B Holders 2a to 2d, 8a to 8b Recesses 3a to 3d Individual parts constituting the module 4 Taping 5 Suction nozzle 6 Circuit boards 7, 9a to 9b Other individual parts

Claims (5)

In module parts that are formed by a plurality of individual parts and are mounted on a circuit board in a predetermined positional relationship,
Provided is a holder in which a concave portion corresponding to at least the dimensional shape of the plurality of individual parts is formed on the bottom surface in the predetermined positional relationship, and the top parts of the plurality of individual parts are fitted and temporarily held in the concave portions of the holder. A module component , wherein the plurality of individual components are taped in a state where the plurality of individual components are temporarily held by the holder .   The depth of the said recessed part of the said holder is adjusted so that the bottom face of the said several components temporarily hold | maintained at the said recessed part of the said holder may become substantially the same surface. Module parts.   The module component according to claim 1, wherein at least a substantially central portion of the upper surface of the holder is formed flat and can be sucked by a suction nozzle.   The module part according to claim 1, 2 or 3, wherein the holder has a recess or an opening of another part or the like mounted in the vicinity of the module part. In a module component mounting method for mounting a module component formed by a plurality of individual components on a circuit board in a predetermined positional relationship,
Preparing a holder in which a plurality of recesses are formed in the predetermined positional relationship according to the dimensional shape of the plurality of individual parts;
Fitting and temporarily holding the tops of the plurality of individual parts in the recesses of the holder; and
Taping a plurality of holders in which the plurality of individual parts are temporarily held in the recess;
Attaching the individual parts to the circuit board by adsorbing and holding the upper surface of the taped holder and mounting the tape on a predetermined position of the circuit board;
A method of mounting a module component, comprising: removing the holder from the individual component connected to the circuit board.

Images