JPS5999788A - Method of mounting ultrafine electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention] (al Technical Field of the Invention The present invention relates to a method for mounting microelectronic components on a printed circuit board. (bl Prior art and problems) As the technology develops, there is a growing trend to increase the packaging density of electronic devices as much as possible to improve their performance and make them smaller.

Along with this, electronic components such as semiconductor integrated circuit chip components have become even smaller, and the wiring density of the printed circuit boards on which they are mounted has also become denser, requiring detailed work to mount these microelectronic components. It's starting to look like this.

Picking up the semiconductor integrated circuit chip components and the like with tweezers and placing them in a predetermined position on a printed circuit board requires skill, and accurate positioning is not easy. For leadless microelectronic components, it is customary to apply solder flux to the connection terminal surface in advance, so once a microelectronic component is placed in an incorrect position, even if the position is corrected, it may remain in an unnecessary location. Since there is a risk that the solder may flow, the troublesome work of wiping off the solder flux described above is added.

There has been a demand for the development of a method for transporting microelectronic components as described above and mounting them all at once at predetermined positions on a printed circuit board.

(C1 Object of the Invention The present invention has been made in view of the above-mentioned points, and it is an object of the present invention to provide a method for mounting a large number of microelectronic components at accurate positions on a printed circuit board at once.

(dl)Structure of the Invention The object of the invention is to provide a positioning tool that includes a recess that can form a mirror arrangement with a predetermined arrangement of the microelectronic components on a printed circuit board, and a holding means that holds the microelectronic components accommodated in the recess. into the recess of the tool.

After housing and holding the corresponding microelectronic components,
The positioning jig is placed at a predetermined position on the printed circuit board, and then the holding function of the holding means is released to mount the microelectronic components at respective predetermined positions on the printed circuit board. This can be easily achieved using a method for mounting microelectronic components.

tel Embodiments of the Invention Below, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a printed circuit board 1 in which a plurality of microelectronic components 2 such as semiconductor integrated circuit chips and chip resistors are arranged at predetermined positions. In order to mount it on a printed circuit board 1 as shown in FIG.

FIG. 3 is a perspective view showing a positioning jig 3 devised based on the present invention. As is clear from the figure, the recess 4 for accommodating the microelectronic components 2 forms a mirror pattern (inverted pattern) with the arrangement pattern of the microelectronic components shown in FIG. They are formed on the surface of the positioning jig 3 according to the shape of each microelectronic component 2.

A vacuum chuck method is the simplest way to hold the microelectronic component accommodated in the recess 4 within the recess 4. Suction holes 5 are arranged in each of the recesses 4 as shown in the figure, and each suction hole 5 is combined into one exhaust hole and connected to an exhaust joint 6.
This constitutes a means for holding the microelectronic component 2 housed in the recess 4 by evacuating the inside of the recess 4 through an exhaust device (not shown) to reduce the pressure inside the recess 4.

Now, in order to mount the microelectronic component 2 on the printed circuit board 1, the following steps are performed.

First, as shown in FIG. 3 (al), each predetermined microelectronic component 2 is placed on the four parts 4 on the surface of the positioning jig 3 with the surface to be bonded to the printed circuit board facing up (the microelectronic component 2 is placed upside down). ), and the exhaust device is operated to attract and hold the microelectronic component 2 on the positioning jig 3.

Thereafter, as shown in FIG.
By introducing normal pressure air into each recess 4 through The printed circuit board 10 is simultaneously mounted at a predetermined position.

In the above embodiment, an example was given in which the vacuum suction method was used to hold the microelectronic component 2 on the positioning jig 3, but it is of course possible to use a method such as a magnetic chuck depending on the situation.

ff) Effects of the Invention As is clear from the above explanation, when a large number of microelectronic components are mounted on a printed circuit board using the method based on the present invention, the mounting work can be completed in an extremely short time.
This has the effect of reducing the cost of the electronic device.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a printed circuit board 1 in which a plurality of microelectronic components 2 such as semiconductor integrated circuit chips and chip resistors are arranged at predetermined positions, and FIG. FIG. 3 is a perspective view showing an embodiment of the positioning jig devised based on the present invention for mounting the microelectronic component 2 on the printed circuit board 1. FIG. FIG. 2 is a conceptual explanatory diagram using a cross-sectional view showing an example of a step of mounting on a substrate. In the figure, 1 is a printed circuit board, 2 is a microelectronic component, and 3 is a printed circuit board.
is a positioning jig, 4 is a recess, and 5 is a suction hole. 6 indicates exhaust hole joints.

Claims (1)

[Claims] When mounting microelectronic components on a printed circuit board. The positioning jig includes a recess that can mirror the predetermined arrangement of the microelectronic components on the printed circuit board, and a holding means for holding the microelectronic components accommodated in the recess. After housing and holding the electronic components, the positioning jig is placed on the printed circuit board at a predetermined position. A method for mounting microelectronic components, comprising: thereafter releasing the holding function of the holding means of the positioning jig and mounting the microelectronic components at respective predetermined positions on a printed circuit board.