JP2010530619A - 垂直コンタクト部を備える電気回路 - Google Patents
垂直コンタクト部を備える電気回路 Download PDFInfo
- Publication number
- JP2010530619A JP2010530619A JP2010512588A JP2010512588A JP2010530619A JP 2010530619 A JP2010530619 A JP 2010530619A JP 2010512588 A JP2010512588 A JP 2010512588A JP 2010512588 A JP2010512588 A JP 2010512588A JP 2010530619 A JP2010530619 A JP 2010530619A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- conductive layer
- dielectric layer
- opening
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/482—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes for individual devices provided for in groups H10D8/00 - H10D48/00, e.g. for power transistors
- H10W20/484—Interconnections having extended contours, e.g. pads having mesh shape or interconnections comprising connected parallel stripes
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Junction Field-Effect Transistors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007028458 | 2007-06-18 | ||
| PCT/EP2008/004838 WO2008155085A1 (de) | 2007-06-18 | 2008-06-16 | Elektrische schaltung mit vertikaler kontaktierung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010530619A true JP2010530619A (ja) | 2010-09-09 |
| JP2010530619A5 JP2010530619A5 (https=) | 2011-07-28 |
Family
ID=39705044
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010512588A Pending JP2010530619A (ja) | 2007-06-18 | 2008-06-16 | 垂直コンタクト部を備える電気回路 |
| JP2010512589A Expired - Fee Related JP5586025B2 (ja) | 2007-06-18 | 2008-06-16 | 基板の平面を全面に渡って覆うバスを備えた半導体部品、その製造方法、及び半導体部品を備えた装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010512589A Expired - Fee Related JP5586025B2 (ja) | 2007-06-18 | 2008-06-16 | 基板の平面を全面に渡って覆うバスを備えた半導体部品、その製造方法、及び半導体部品を備えた装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US8748944B2 (https=) |
| EP (2) | EP2162912B1 (https=) |
| JP (2) | JP2010530619A (https=) |
| WO (2) | WO2008155085A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5748130B2 (ja) | 2010-09-08 | 2015-07-15 | 大日本印刷株式会社 | 照明装置、投射装置および投写型映像表示装置 |
| KR20130013189A (ko) | 2011-07-27 | 2013-02-06 | 삼성전자주식회사 | 파워 반도체 소자 |
| KR102008326B1 (ko) | 2015-02-20 | 2019-08-07 | 비샤이 제너럴 세미컨덕터 엘엘씨 | 큰 본드 패드 및 감소된 접촉 저항을 갖는 질화갈륨계 쇼트키 다이오드 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08139318A (ja) * | 1994-11-11 | 1996-05-31 | Fuji Electric Co Ltd | 横型電界効果トランジスタ |
| JPH08255908A (ja) * | 1994-11-02 | 1996-10-01 | Texas Instr Inc <Ti> | 厚い銅の相互接続を持つldmosダイオードを用いるesd保護構造 |
| WO2005079293A2 (en) * | 2004-02-12 | 2005-09-01 | International Rectifier Corporation | Integrated iii-nitride power devices |
| JP2006515956A (ja) * | 2002-10-08 | 2006-06-08 | グレイト・ウォール・セミコンダクター・コーポレイション | パワーmosfet |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4058822A (en) * | 1975-05-30 | 1977-11-15 | Sharp Kabushiki Kaisha | High voltage, low on-resistance diffusion-self-alignment metal oxide semiconductor device and manufacture thereof |
| US4290077A (en) * | 1979-05-30 | 1981-09-15 | Xerox Corporation | High voltage MOSFET with inter-device isolation structure |
| JPS5934666A (ja) * | 1982-08-20 | 1984-02-25 | Matsushita Electronics Corp | 半導体集積回路装置 |
| US4977108A (en) * | 1987-12-02 | 1990-12-11 | Advanced Micro Devices, Inc. | Method of making self-aligned, planarized contacts for semiconductor devices |
| US5283558A (en) * | 1989-10-16 | 1994-02-01 | Chan James K | Low-cost devices for touch control |
| CA2046554A1 (en) * | 1990-07-10 | 1992-01-11 | Masahiro Kugishima | Basic cell and arrangement structure thereof |
| JP3074003B2 (ja) * | 1990-08-21 | 2000-08-07 | 株式会社日立製作所 | 半導体集積回路装置 |
| JPH065842A (ja) * | 1992-06-16 | 1994-01-14 | Fujitsu Ltd | 半導体装置 |
| JPH06209015A (ja) * | 1992-10-26 | 1994-07-26 | Kobe Steel Ltd | ダイヤモンド接合型電界効果トランジスタ及びその製造方法 |
| US6150722A (en) * | 1994-11-02 | 2000-11-21 | Texas Instruments Incorporated | Ldmos transistor with thick copper interconnect |
| JPH10125782A (ja) * | 1996-10-15 | 1998-05-15 | Sony Corp | 半導体装置の製造方法 |
| US6140687A (en) * | 1996-11-28 | 2000-10-31 | Matsushita Electric Industrial Co., Ltd. | High frequency ring gate MOSFET |
| DE19705791C1 (de) * | 1997-02-14 | 1998-04-02 | Siemens Ag | Leistungs-MOSFET |
| JP3377727B2 (ja) * | 1997-08-20 | 2003-02-17 | 沖電気工業株式会社 | 半導体デバイスのコンタクト電極形成方法およびフォトトランジスタのコンタクト電極形成方法 |
| DE19746620A1 (de) * | 1997-10-22 | 1999-05-06 | Siemens Ag | Halbleiterdiode |
| EP0923126A1 (en) * | 1997-12-05 | 1999-06-16 | STMicroelectronics S.r.l. | Integrated electronic device comprising a mechanical stress protection structure |
| US6265779B1 (en) * | 1998-08-11 | 2001-07-24 | International Business Machines Corporation | Method and material for integration of fuorine-containing low-k dielectrics |
| US6078100A (en) * | 1999-01-13 | 2000-06-20 | Micron Technology, Inc. | Utilization of die repattern layers for die internal connections |
| JP2000286254A (ja) * | 1999-03-31 | 2000-10-13 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
| US6617652B2 (en) * | 2001-03-22 | 2003-09-09 | Matsushita Electric Industrial Co., Ltd. | High breakdown voltage semiconductor device |
| US6624484B2 (en) * | 2001-07-31 | 2003-09-23 | Nokia Corporation | IGFET and tuning circuit |
| US7932603B2 (en) * | 2001-12-13 | 2011-04-26 | Megica Corporation | Chip structure and process for forming the same |
| US6673698B1 (en) * | 2002-01-19 | 2004-01-06 | Megic Corporation | Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layers |
| JP4175877B2 (ja) * | 2002-11-29 | 2008-11-05 | 株式会社半導体エネルギー研究所 | 半導体装置及びその作製方法 |
| US7067865B2 (en) * | 2003-06-06 | 2006-06-27 | Macronix International Co., Ltd. | High density chalcogenide memory cells |
| JP4155888B2 (ja) * | 2003-07-09 | 2008-09-24 | シャープ株式会社 | 環状型ゲート電極を備えたトランジスタ |
| JP2005109145A (ja) * | 2003-09-30 | 2005-04-21 | Toshiba Corp | 半導体装置 |
| US7183653B2 (en) * | 2003-12-17 | 2007-02-27 | Intel Corporation | Via including multiple electrical paths |
| KR101146449B1 (ko) * | 2003-12-29 | 2012-05-18 | 엘지디스플레이 주식회사 | 횡전계 방식의 액정표시장치 및 그 제조방법 |
| JP4002918B2 (ja) * | 2004-09-02 | 2007-11-07 | 株式会社東芝 | 窒化物含有半導体装置 |
| JP5116251B2 (ja) * | 2005-05-20 | 2013-01-09 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US7582556B2 (en) * | 2005-06-24 | 2009-09-01 | Megica Corporation | Circuitry component and method for forming the same |
| TWI339419B (en) * | 2005-12-05 | 2011-03-21 | Megica Corp | Semiconductor chip |
| JP2007180143A (ja) * | 2005-12-27 | 2007-07-12 | Toshiba Corp | 窒化物半導体素子 |
| US7821097B2 (en) * | 2006-06-05 | 2010-10-26 | International Business Machines Corporation | Lateral passive device having dual annular electrodes |
| US7453151B2 (en) * | 2006-07-27 | 2008-11-18 | International Business Machines Corporation | Methods for lateral current carrying capability improvement in semiconductor devices |
| US7662722B2 (en) * | 2007-01-24 | 2010-02-16 | International Business Machines Corporation | Air gap under on-chip passive device |
-
2008
- 2008-06-16 WO PCT/EP2008/004838 patent/WO2008155085A1/de not_active Ceased
- 2008-06-16 JP JP2010512588A patent/JP2010530619A/ja active Pending
- 2008-06-16 WO PCT/EP2008/004839 patent/WO2008155086A1/de not_active Ceased
- 2008-06-16 EP EP08801466.7A patent/EP2162912B1/de active Active
- 2008-06-16 EP EP08773469.5A patent/EP2165363B1/de not_active Not-in-force
- 2008-06-16 US US12/664,318 patent/US8748944B2/en active Active
- 2008-06-16 JP JP2010512589A patent/JP5586025B2/ja not_active Expired - Fee Related
- 2008-06-16 US US12/664,328 patent/US20100182073A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08255908A (ja) * | 1994-11-02 | 1996-10-01 | Texas Instr Inc <Ti> | 厚い銅の相互接続を持つldmosダイオードを用いるesd保護構造 |
| JPH08139318A (ja) * | 1994-11-11 | 1996-05-31 | Fuji Electric Co Ltd | 横型電界効果トランジスタ |
| JP2006515956A (ja) * | 2002-10-08 | 2006-06-08 | グレイト・ウォール・セミコンダクター・コーポレイション | パワーmosfet |
| WO2005079293A2 (en) * | 2004-02-12 | 2005-09-01 | International Rectifier Corporation | Integrated iii-nitride power devices |
Also Published As
| Publication number | Publication date |
|---|---|
| US8748944B2 (en) | 2014-06-10 |
| EP2162912A1 (de) | 2010-03-17 |
| WO2008155085A8 (de) | 2009-07-30 |
| EP2162912B1 (de) | 2019-12-04 |
| WO2008155086A1 (de) | 2008-12-24 |
| US20100182073A1 (en) | 2010-07-22 |
| EP2165363B1 (de) | 2020-07-29 |
| US20100230727A1 (en) | 2010-09-16 |
| JP2010530620A (ja) | 2010-09-09 |
| WO2008155085A1 (de) | 2008-12-24 |
| EP2165363A1 (de) | 2010-03-24 |
| JP5586025B2 (ja) | 2014-09-10 |
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