JP2010530619A5 - - Google Patents

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Publication number
JP2010530619A5
JP2010530619A5 JP2010512588A JP2010512588A JP2010530619A5 JP 2010530619 A5 JP2010530619 A5 JP 2010530619A5 JP 2010512588 A JP2010512588 A JP 2010512588A JP 2010512588 A JP2010512588 A JP 2010512588A JP 2010530619 A5 JP2010530619 A5 JP 2010530619A5
Authority
JP
Japan
Prior art keywords
contact
dielectric layer
conductive layer
circuit according
electric circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010512588A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010530619A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/EP2008/004838 external-priority patent/WO2008155085A1/de
Publication of JP2010530619A publication Critical patent/JP2010530619A/ja
Publication of JP2010530619A5 publication Critical patent/JP2010530619A5/ja
Pending legal-status Critical Current

Links

JP2010512588A 2007-06-18 2008-06-16 垂直コンタクト部を備える電気回路 Pending JP2010530619A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007028458 2007-06-18
PCT/EP2008/004838 WO2008155085A1 (de) 2007-06-18 2008-06-16 Elektrische schaltung mit vertikaler kontaktierung

Publications (2)

Publication Number Publication Date
JP2010530619A JP2010530619A (ja) 2010-09-09
JP2010530619A5 true JP2010530619A5 (https=) 2011-07-28

Family

ID=39705044

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010512588A Pending JP2010530619A (ja) 2007-06-18 2008-06-16 垂直コンタクト部を備える電気回路
JP2010512589A Expired - Fee Related JP5586025B2 (ja) 2007-06-18 2008-06-16 基板の平面を全面に渡って覆うバスを備えた半導体部品、その製造方法、及び半導体部品を備えた装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2010512589A Expired - Fee Related JP5586025B2 (ja) 2007-06-18 2008-06-16 基板の平面を全面に渡って覆うバスを備えた半導体部品、その製造方法、及び半導体部品を備えた装置

Country Status (4)

Country Link
US (2) US8748944B2 (https=)
EP (2) EP2162912B1 (https=)
JP (2) JP2010530619A (https=)
WO (2) WO2008155085A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5748130B2 (ja) 2010-09-08 2015-07-15 大日本印刷株式会社 照明装置、投射装置および投写型映像表示装置
KR20130013189A (ko) 2011-07-27 2013-02-06 삼성전자주식회사 파워 반도체 소자
KR102008326B1 (ko) 2015-02-20 2019-08-07 비샤이 제너럴 세미컨덕터 엘엘씨 큰 본드 패드 및 감소된 접촉 저항을 갖는 질화갈륨계 쇼트키 다이오드

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