JP2010514139A - 陽イオン感受性層を含む複合品 - Google Patents
陽イオン感受性層を含む複合品 Download PDFInfo
- Publication number
- JP2010514139A JP2010514139A JP2009542916A JP2009542916A JP2010514139A JP 2010514139 A JP2010514139 A JP 2010514139A JP 2009542916 A JP2009542916 A JP 2009542916A JP 2009542916 A JP2009542916 A JP 2009542916A JP 2010514139 A JP2010514139 A JP 2010514139A
- Authority
- JP
- Japan
- Prior art keywords
- silicone
- substrate
- layer
- composite article
- sio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 0 Cc1ccc(*)cc1 Chemical compound Cc1ccc(*)cc1 0.000 description 4
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
- C03C17/30—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with silicon-containing compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/42—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating of an organic material and at least one non-metal coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/40—Coatings comprising at least one inhomogeneous layer
- C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
- C03C2217/46—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase
- C03C2217/465—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase having a specific shape
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/40—Coatings comprising at least one inhomogeneous layer
- C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
- C03C2217/46—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase
- C03C2217/47—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase consisting of a specific material
- C03C2217/475—Inorganic materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31609—Particulate metal or metal compound-containing
- Y10T428/31612—As silicone, silane or siloxane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US87095106P | 2006-12-20 | 2006-12-20 | |
| PCT/US2007/026030 WO2008079275A1 (en) | 2006-12-20 | 2007-12-19 | Composite article including a cation-sensitive layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010514139A true JP2010514139A (ja) | 2010-04-30 |
| JP2010514139A5 JP2010514139A5 (enExample) | 2011-02-03 |
Family
ID=39427573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009542916A Ceased JP2010514139A (ja) | 2006-12-20 | 2007-12-19 | 陽イオン感受性層を含む複合品 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20100051920A1 (enExample) |
| EP (1) | EP2095446A1 (enExample) |
| JP (1) | JP2010514139A (enExample) |
| KR (1) | KR20090092324A (enExample) |
| CN (1) | CN101589483B (enExample) |
| WO (1) | WO2008079275A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012074512A (ja) * | 2010-09-28 | 2012-04-12 | Sekisui Chem Co Ltd | 光半導体装置用ダイボンド材及びそれを用いた光半導体装置 |
| JP2014088513A (ja) * | 2012-10-30 | 2014-05-15 | Dow Corning Toray Co Ltd | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010519089A (ja) * | 2007-02-22 | 2010-06-03 | ダウ・コーニング・コーポレイション | 優れた耐火性及び耐衝撃性を有する複合品並びにそれの製造方法 |
| CN101652245A (zh) * | 2007-02-22 | 2010-02-17 | 陶氏康宁公司 | 具有优良耐火性的复合制品 |
| KR20090120468A (ko) * | 2007-02-22 | 2009-11-24 | 다우 코닝 코포레이션 | 우수한 내화성을 갖는 복합체 물품 |
| JP6680692B2 (ja) | 2014-04-16 | 2020-04-15 | ザ ケマーズ カンパニー エフシー リミテッド ライアビリティ カンパニー | より望ましいフルオロプロパン及びフルオロプロペンへのクロロフルオロプロパン及びクロロフルオロプロペンの変換 |
| JP6375226B2 (ja) * | 2014-12-26 | 2018-08-15 | 富士フイルム株式会社 | 硬化性組成物、転写フィルム、画像表示装置の前面板、前面板一体型センサー、画像表示装置および画像表示装置の前面板の製造方法 |
| US20180033614A1 (en) * | 2016-07-27 | 2018-02-01 | Versum Materials Us, Llc | Compositions and Methods Using Same for Carbon Doped Silicon Containing Films |
| JP6754318B2 (ja) * | 2017-05-10 | 2020-09-09 | 信越化学工業株式会社 | ダイボンディング用シリコーン樹脂組成物、ダイボンド材及び光半導体装置 |
| JP7003075B2 (ja) * | 2019-02-15 | 2022-01-20 | 信越化学工業株式会社 | ウェハーレベル光半導体デバイス用樹脂組成物及び該組成物を用いたウェハーレベル光半導体デバイス |
| TW202242913A (zh) * | 2021-04-23 | 2022-11-01 | 美商Ddp 特殊電子材料 Us 9有限責任公司 | 導電複合膜 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10202794A (ja) * | 1997-01-21 | 1998-08-04 | Toray Dow Corning Silicone Co Ltd | シリコーンエラストマーコーティングシート状物およびその製造方法 |
| JP2001098223A (ja) * | 1999-07-29 | 2001-04-10 | General Electric Co <Ge> | 耐破砕性白熱電球、シリコーンコーティング組成物、および方法 |
| JP2003531088A (ja) * | 2000-04-18 | 2003-10-21 | カール ツァイス シュティフトゥング | 強化されたガラス体 |
| JP2006193531A (ja) * | 2000-07-10 | 2006-07-27 | Procter & Gamble Co | 化粧品組成物 |
| EP1690839A1 (en) * | 2003-11-13 | 2006-08-16 | Sumitomo Corporation | Flexible substrate and coating liquid |
| WO2006088645A1 (en) * | 2005-02-16 | 2006-08-24 | Dow Corning Corporation | Reinforced silicone resin film and method of preparing same |
| JP2006299099A (ja) * | 2005-04-21 | 2006-11-02 | Shin Etsu Chem Co Ltd | 光半導体素子封止用樹脂組成物及び光半導体素子 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL131800C (enExample) * | 1965-05-17 | |||
| US4087585A (en) * | 1977-05-23 | 1978-05-02 | Dow Corning Corporation | Self-adhering silicone compositions and preparations thereof |
| US4260780A (en) * | 1979-11-27 | 1981-04-07 | The United States Of America As Represented By The Secretary Of The Air Force | Phenylmethylpolysilane polymers and process for their preparation |
| US4276424A (en) * | 1979-12-03 | 1981-06-30 | Petrarch Systems | Methods for the production of organic polysilanes |
| US4314956A (en) * | 1980-07-23 | 1982-02-09 | Dow Corning Corporation | High yield silicon carbide pre-ceramic polymers |
| US4324901A (en) * | 1981-04-29 | 1982-04-13 | Wisconsin Alumni Research Foundation | Soluble polysilastyrene and method for preparation |
| US4530879A (en) * | 1983-03-04 | 1985-07-23 | Minnesota Mining And Manufacturing Company | Radiation activated addition reaction |
| US4510094A (en) * | 1983-12-06 | 1985-04-09 | Minnesota Mining And Manufacturing Company | Platinum complex |
| FR2591587A1 (fr) * | 1985-12-17 | 1987-06-19 | Saint Gobain Vitrage | Film organo-mineral depose sur un substrat en verre eventuellement revetu d'une ou plusieurs couches metalliques minces. |
| US4766176A (en) * | 1987-07-20 | 1988-08-23 | Dow Corning Corporation | Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts |
| JPH0214244A (ja) * | 1988-06-30 | 1990-01-18 | Toray Dow Corning Silicone Co Ltd | 加熱硬化性オルガノポリシロキサン組成物 |
| JP3029680B2 (ja) * | 1991-01-29 | 2000-04-04 | 東レ・ダウコーニング・シリコーン株式会社 | オルガノペンタシロキサンおよびその製造方法 |
| US5266715A (en) * | 1991-03-06 | 1993-11-30 | Ciba-Geigy Corporation | Glass coating with improved adhesion and weather resistance |
| JPH06329914A (ja) * | 1993-05-18 | 1994-11-29 | Toray Dow Corning Silicone Co Ltd | 室温硬化性オルガノポリシロキサン組成物およびその製造方法 |
| US5469961A (en) * | 1994-08-15 | 1995-11-28 | Chang; Chun Y. | Combined minidisc box |
| IL126993A (en) * | 1996-07-10 | 2002-12-01 | Ibm | Siloxane and siloxane derivatives as encapsulants for organic light emitting devices |
| EP0932081B1 (en) * | 1997-08-08 | 2009-10-14 | Dai Nippon Printing Co., Ltd. | Pattern forming body, pattern forming method, and their applications |
| TW439308B (en) * | 1998-12-16 | 2001-06-07 | Battelle Memorial Institute | Environmental barrier material for organic light emitting device and method of making |
| JP2000302487A (ja) * | 1999-04-23 | 2000-10-31 | Nippon Sheet Glass Co Ltd | ガラス基板およびその製造方法 |
| US6534581B1 (en) * | 2000-07-20 | 2003-03-18 | Dow Corning Corporation | Silicone composition and electrically conductive silicone adhesive formed therefrom |
| CN1389085A (zh) * | 2000-08-23 | 2003-01-01 | 出光兴产株式会社 | 有机el显示装置 |
| US6664137B2 (en) * | 2001-03-29 | 2003-12-16 | Universal Display Corporation | Methods and structures for reducing lateral diffusion through cooperative barrier layers |
| JP2003163078A (ja) * | 2001-11-28 | 2003-06-06 | Hitachi Ltd | 表示装置 |
| JP3906985B2 (ja) * | 2002-05-24 | 2007-04-18 | 三井化学株式会社 | 金属拡散バリア膜、金属拡散バリア膜の形成方法および半導体装置 |
| JP4621020B2 (ja) * | 2002-06-05 | 2011-01-26 | ダウ コーニング コーポレーション | ポリシロキサンフィルム及びその製造方法 |
| KR20050115268A (ko) * | 2003-03-04 | 2005-12-07 | 다우 코닝 코포레이션 | 유기 발광 다이오드 |
| JP2004361692A (ja) * | 2003-04-07 | 2004-12-24 | Dow Corning Asia Ltd | 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法 |
| JP4163567B2 (ja) * | 2003-07-09 | 2008-10-08 | 株式会社 日立ディスプレイズ | 発光型表示装置 |
| US20050237462A1 (en) * | 2004-04-26 | 2005-10-27 | Eastman Kodak Company | Alignment layer for liquid crystal display |
| US7960030B2 (en) * | 2004-05-14 | 2011-06-14 | Dow Corning Corporation | Free films made of cured organopolysiloxane resins, process for production thereof, and laminated films |
| ES2375370T3 (es) * | 2005-02-16 | 2012-02-29 | Dow Corning Corporation | Pel�?cula de resina de silicona reforzada y procedimiento para su preparación. |
| EP1963409A2 (en) * | 2005-10-05 | 2008-09-03 | Dow Corning Corporation | Coated substrates and methods for their preparation |
| KR101447272B1 (ko) * | 2010-12-31 | 2014-10-08 | 제일모직주식회사 | 폴리카보네이트 수지 조성물 및 이를 포함하는 성형품 |
| KR101997921B1 (ko) * | 2011-09-05 | 2019-07-08 | 엘지전자 주식회사 | 태양전지 모듈 |
-
2007
- 2007-12-19 CN CN2007800504054A patent/CN101589483B/zh not_active Expired - Fee Related
- 2007-12-19 JP JP2009542916A patent/JP2010514139A/ja not_active Ceased
- 2007-12-19 KR KR1020097014761A patent/KR20090092324A/ko not_active Ceased
- 2007-12-19 US US12/520,307 patent/US20100051920A1/en not_active Abandoned
- 2007-12-19 WO PCT/US2007/026030 patent/WO2008079275A1/en not_active Ceased
- 2007-12-19 EP EP07867877A patent/EP2095446A1/en not_active Withdrawn
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10202794A (ja) * | 1997-01-21 | 1998-08-04 | Toray Dow Corning Silicone Co Ltd | シリコーンエラストマーコーティングシート状物およびその製造方法 |
| JP2001098223A (ja) * | 1999-07-29 | 2001-04-10 | General Electric Co <Ge> | 耐破砕性白熱電球、シリコーンコーティング組成物、および方法 |
| JP2003531088A (ja) * | 2000-04-18 | 2003-10-21 | カール ツァイス シュティフトゥング | 強化されたガラス体 |
| JP2006193531A (ja) * | 2000-07-10 | 2006-07-27 | Procter & Gamble Co | 化粧品組成物 |
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Also Published As
| Publication number | Publication date |
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| CN101589483A (zh) | 2009-11-25 |
| US20100051920A1 (en) | 2010-03-04 |
| EP2095446A1 (en) | 2009-09-02 |
| KR20090092324A (ko) | 2009-08-31 |
| CN101589483B (zh) | 2012-06-06 |
| WO2008079275A1 (en) | 2008-07-03 |
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