JP2010508427A5 - - Google Patents

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Publication number
JP2010508427A5
JP2010508427A5 JP2009535593A JP2009535593A JP2010508427A5 JP 2010508427 A5 JP2010508427 A5 JP 2010508427A5 JP 2009535593 A JP2009535593 A JP 2009535593A JP 2009535593 A JP2009535593 A JP 2009535593A JP 2010508427 A5 JP2010508427 A5 JP 2010508427A5
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JP
Japan
Prior art keywords
amount
component
aqueous solution
nco
molar ratio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2009535593A
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English (en)
Japanese (ja)
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JP2010508427A (ja
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Publication date
Priority claimed from DE102006052240A external-priority patent/DE102006052240A1/de
Application filed filed Critical
Publication of JP2010508427A publication Critical patent/JP2010508427A/ja
Publication of JP2010508427A5 publication Critical patent/JP2010508427A5/ja
Ceased legal-status Critical Current

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JP2009535593A 2006-11-03 2007-10-24 キャップしたポリイミドまたはポリアミドイミドの溶液 Ceased JP2010508427A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006052240A DE102006052240A1 (de) 2006-11-03 2006-11-03 Lösungen blockierter Polyimide bzw. Polyamidimide
PCT/EP2007/009211 WO2008052688A2 (de) 2006-11-03 2007-10-24 Lösungen blockerter polyimide bzw. polyamidimide

Publications (2)

Publication Number Publication Date
JP2010508427A JP2010508427A (ja) 2010-03-18
JP2010508427A5 true JP2010508427A5 (https=) 2010-12-09

Family

ID=39204539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009535593A Ceased JP2010508427A (ja) 2006-11-03 2007-10-24 キャップしたポリイミドまたはポリアミドイミドの溶液

Country Status (11)

Country Link
US (1) US20080146764A1 (https=)
EP (1) EP2087023B1 (https=)
JP (1) JP2010508427A (https=)
KR (1) KR20090086426A (https=)
CN (1) CN101578310A (https=)
BR (1) BRPI0717885A2 (https=)
CA (1) CA2668174A1 (https=)
DE (1) DE102006052240A1 (https=)
MX (1) MX2009004560A (https=)
WO (1) WO2008052688A2 (https=)
ZA (1) ZA200902893B (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2408836B1 (en) * 2009-03-16 2014-12-10 Sun Chemical B.V. Liquid coverlays for flexible printed circuit boards
US9668360B2 (en) 2009-10-29 2017-05-30 Sun Chemical Corporation Polyamideimide adhesives for printed circuit boards
EP2576650B1 (de) * 2010-05-27 2014-05-14 Basf Se Werkstoffe, verfahren zu ihrer herstellung und komponenten dafür
WO2014112434A1 (ja) * 2013-01-18 2014-07-24 東洋紡株式会社 成形用ポリアミドイミド樹脂組成物
JP5733355B2 (ja) * 2013-07-26 2015-06-10 東レ株式会社 ポリイミド系樹脂水溶液
JP6776589B2 (ja) * 2015-04-10 2020-10-28 東洋紡株式会社 ポリイミド樹脂含有水性分散体組成物
CN108291005B (zh) * 2015-12-07 2021-10-15 昭和电工材料株式会社 聚酰胺酰亚胺树脂组合物及氟涂料
WO2017104461A1 (ja) * 2015-12-14 2017-06-22 日立化成株式会社 ポリアミドイミド樹脂及び塗料
EP3475324A4 (en) * 2016-06-27 2020-07-29 The Warner-Babcock Institute For Green Chemistry LLC CROSS-LINKED POLYMERIC COMPOSITIONS FREE OF BISPHENOL A
JP6062097B1 (ja) * 2016-07-07 2017-01-18 第一工業製薬株式会社 ポリイミド水分散体の製造方法
WO2018158877A1 (ja) * 2017-03-01 2018-09-07 日立化成株式会社 ポリアミドイミド樹脂及びその利用
JP6977379B2 (ja) * 2017-08-01 2021-12-08 昭和電工マテリアルズ株式会社 ポリアミドイミド樹脂組成物、フッ素塗料、及び導電性組成物
JP6915433B2 (ja) * 2017-08-01 2021-08-04 昭和電工マテリアルズ株式会社 ポリアミドイミド樹脂液及びその製造方法
JP7226507B2 (ja) * 2017-08-01 2023-02-21 株式会社レゾナック ポリアミドイミド樹脂組成物、フッ素塗料、及び導電性組成物
CN110818887A (zh) * 2019-12-06 2020-02-21 合众（佛山）化工有限公司 一种净味抗划伤改性醇酸树脂的制备方法
CN111333841A (zh) * 2020-03-20 2020-06-26 住井工业（湖南）有限公司 聚酰胺酰亚胺树脂、绝缘皮膜、绝缘电线、线圈及电动机
CA3190972A1 (en) * 2020-08-07 2022-02-10 Basf Se Caprolactam-modified liquid mdi and its use in polyurethanes
CN112694831B (zh) * 2020-12-22 2022-04-01 苏州太湖电工新材料股份有限公司 一种半无机硅钢片漆及其制备方法和应用
KR20230147687A (ko) * 2021-03-25 2023-10-23 엘란타스 유럽 에스.알.엘. 환경 친화적인 수계 엔지니어링 중합체 조성물
CN116478401B (zh) * 2023-03-31 2024-09-24 江苏环峰电工材料有限公司 一种高水溶性胺基聚氨酯改性树脂及其制备方法
CN121171696B (zh) * 2025-11-19 2026-03-17 佳腾电业(赣州)股份有限公司 一种绝缘电线、线圈和电子/电气设备

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1770202C3 (de) * 1968-04-13 1975-02-27 Bayer Ag, 5090 Leverkusen Verfahren zur Herstellung von hochmolekularen Polyamid-tmiden
US4259221A (en) * 1976-12-20 1981-03-31 General Electric Company Water-soluble polyamideimides
US4429073A (en) * 1980-09-23 1984-01-31 General Electric Company Polyetherimide compositions and processes for production
DE3249544C2 (de) * 1981-11-06 1985-07-11 Hitachi Chemical Co., Ltd., Tokio/Tokyo Isolierter Draht
JPS58208323A (ja) * 1982-05-28 1983-12-05 Hitachi Chem Co Ltd ポリアミドイミド樹脂の製造法
JPS5968108A (ja) * 1982-10-08 1984-04-18 日立化成工業株式会社 絶縁電線の製造法
JPS59126422A (ja) * 1983-01-10 1984-07-21 Hitachi Chem Co Ltd ポリアミドイミド樹脂組成物
DE3332033A1 (de) * 1983-09-06 1985-03-21 Bayer Ag, 5090 Leverkusen Neue polyamidimide und ihre verwendung
JPS62161835A (ja) * 1985-09-11 1987-07-17 Hitachi Chem Co Ltd ポリアミドイミド樹脂
DE19524437A1 (de) * 1995-07-05 1997-01-09 Bayer Ag Amid-/Imidgruppen-haltige blockierte Polyisocyanate für Drahtlacke
DE19615116A1 (de) * 1996-04-17 1997-10-23 Bayer Ag Wäßrige bzw. wasserverdünnbare blockierte Polyisocyanate für die Herstellung von wäßrigen 1K-PUR-Klarlacken mit wesentlich verringerter Thermovergilbung
DE19810660A1 (de) * 1998-03-12 1999-09-16 Bayer Ag Wäßrige Polyisocyanatvernetzer mit Hydroxypivalinsäure und Dimethylpyrazol-Blockierung
DE19914882A1 (de) * 1999-04-01 2000-10-05 Bayer Ag Selbstvernetzende Polyurethan-, Polyurethan-Polyharnstoff- bzw. Polyharnstoff-Dispersionen für Schlichten
DE10007820A1 (de) * 2000-02-21 2001-08-23 Bayer Ag Acylharnstoffgruppen enthaltende Polyisocyanatgemische
JP2005120134A (ja) * 2003-10-14 2005-05-12 Hitachi Chem Co Ltd 耐熱性樹脂組成物及び塗料
DE102004046308A1 (de) * 2004-09-24 2006-03-30 Bayer Materialscience Ag Neues Verfahren zur Herstellung von 3,5-Dimethylpyrazol-blockierten Polysocyanaten

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