BRPI0717885A2 - Soluções de poli-imidas ou poliamidaimidas bloqueadas - Google Patents

Soluções de poli-imidas ou poliamidaimidas bloqueadas

Info

Publication number
BRPI0717885A2
BRPI0717885A2 BRPI0717885-9A2A BRPI0717885A BRPI0717885A2 BR PI0717885 A2 BRPI0717885 A2 BR PI0717885A2 BR PI0717885 A BRPI0717885 A BR PI0717885A BR PI0717885 A2 BRPI0717885 A2 BR PI0717885A2
Authority
BR
Brazil
Prior art keywords
polyimide
locked
polyamideimide
solutions
polyamideimide solutions
Prior art date
Application number
BRPI0717885-9A2A
Other languages
English (en)
Portuguese (pt)
Inventor
Rolf Gertzmann
Beate Baumbach
Reinhard Halpaap
Wolfram Kuettner
Original Assignee
Bayer Materialscience Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer Materialscience Ag filed Critical Bayer Materialscience Ag
Publication of BRPI0717885A2 publication Critical patent/BRPI0717885A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/60—Polyamides or polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/34—Carboxylic acids; Esters thereof with monohydroxyl compounds
    • C08G18/343—Polycarboxylic acids having at least three carboxylic acid groups
    • C08G18/345—Polycarboxylic acids having at least three carboxylic acid groups having three carboxylic acid groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/80—Masked polyisocyanates
    • C08G18/8061—Masked polyisocyanates masked with compounds having only one group containing active hydrogen
    • C08G18/807—Masked polyisocyanates masked with compounds having only one group containing active hydrogen with nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/80—Masked polyisocyanates
    • C08G18/8061—Masked polyisocyanates masked with compounds having only one group containing active hydrogen
    • C08G18/807—Masked polyisocyanates masked with compounds having only one group containing active hydrogen with nitrogen containing compounds
    • C08G18/8074—Lactams
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1035—Preparatory processes from tetracarboxylic acids or derivatives and diisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
BRPI0717885-9A2A 2006-11-03 2007-10-24 Soluções de poli-imidas ou poliamidaimidas bloqueadas BRPI0717885A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006052240A DE102006052240A1 (de) 2006-11-03 2006-11-03 Lösungen blockierter Polyimide bzw. Polyamidimide
PCT/EP2007/009211 WO2008052688A2 (de) 2006-11-03 2007-10-24 Lösungen blockerter polyimide bzw. polyamidimide

Publications (1)

Publication Number Publication Date
BRPI0717885A2 true BRPI0717885A2 (pt) 2014-04-01

Family

ID=39204539

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0717885-9A2A BRPI0717885A2 (pt) 2006-11-03 2007-10-24 Soluções de poli-imidas ou poliamidaimidas bloqueadas

Country Status (11)

Country Link
US (1) US20080146764A1 (https=)
EP (1) EP2087023B1 (https=)
JP (1) JP2010508427A (https=)
KR (1) KR20090086426A (https=)
CN (1) CN101578310A (https=)
BR (1) BRPI0717885A2 (https=)
CA (1) CA2668174A1 (https=)
DE (1) DE102006052240A1 (https=)
MX (1) MX2009004560A (https=)
WO (1) WO2008052688A2 (https=)
ZA (1) ZA200902893B (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2408836B1 (en) * 2009-03-16 2014-12-10 Sun Chemical B.V. Liquid coverlays for flexible printed circuit boards
US9668360B2 (en) 2009-10-29 2017-05-30 Sun Chemical Corporation Polyamideimide adhesives for printed circuit boards
EP2576650B1 (de) * 2010-05-27 2014-05-14 Basf Se Werkstoffe, verfahren zu ihrer herstellung und komponenten dafür
WO2014112434A1 (ja) * 2013-01-18 2014-07-24 東洋紡株式会社 成形用ポリアミドイミド樹脂組成物
JP5733355B2 (ja) * 2013-07-26 2015-06-10 東レ株式会社 ポリイミド系樹脂水溶液
JP6776589B2 (ja) * 2015-04-10 2020-10-28 東洋紡株式会社 ポリイミド樹脂含有水性分散体組成物
CN108291005B (zh) * 2015-12-07 2021-10-15 昭和电工材料株式会社 聚酰胺酰亚胺树脂组合物及氟涂料
WO2017104461A1 (ja) * 2015-12-14 2017-06-22 日立化成株式会社 ポリアミドイミド樹脂及び塗料
EP3475324A4 (en) * 2016-06-27 2020-07-29 The Warner-Babcock Institute For Green Chemistry LLC CROSS-LINKED POLYMERIC COMPOSITIONS FREE OF BISPHENOL A
JP6062097B1 (ja) * 2016-07-07 2017-01-18 第一工業製薬株式会社 ポリイミド水分散体の製造方法
WO2018158877A1 (ja) * 2017-03-01 2018-09-07 日立化成株式会社 ポリアミドイミド樹脂及びその利用
JP6977379B2 (ja) * 2017-08-01 2021-12-08 昭和電工マテリアルズ株式会社 ポリアミドイミド樹脂組成物、フッ素塗料、及び導電性組成物
JP6915433B2 (ja) * 2017-08-01 2021-08-04 昭和電工マテリアルズ株式会社 ポリアミドイミド樹脂液及びその製造方法
JP7226507B2 (ja) * 2017-08-01 2023-02-21 株式会社レゾナック ポリアミドイミド樹脂組成物、フッ素塗料、及び導電性組成物
CN110818887A (zh) * 2019-12-06 2020-02-21 合众（佛山）化工有限公司 一种净味抗划伤改性醇酸树脂的制备方法
CN111333841A (zh) * 2020-03-20 2020-06-26 住井工业（湖南）有限公司 聚酰胺酰亚胺树脂、绝缘皮膜、绝缘电线、线圈及电动机
CA3190972A1 (en) * 2020-08-07 2022-02-10 Basf Se Caprolactam-modified liquid mdi and its use in polyurethanes
CN112694831B (zh) * 2020-12-22 2022-04-01 苏州太湖电工新材料股份有限公司 一种半无机硅钢片漆及其制备方法和应用
KR20230147687A (ko) * 2021-03-25 2023-10-23 엘란타스 유럽 에스.알.엘. 환경 친화적인 수계 엔지니어링 중합체 조성물
CN116478401B (zh) * 2023-03-31 2024-09-24 江苏环峰电工材料有限公司 一种高水溶性胺基聚氨酯改性树脂及其制备方法
CN121171696B (zh) * 2025-11-19 2026-03-17 佳腾电业(赣州)股份有限公司 一种绝缘电线、线圈和电子/电气设备

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1770202C3 (de) * 1968-04-13 1975-02-27 Bayer Ag, 5090 Leverkusen Verfahren zur Herstellung von hochmolekularen Polyamid-tmiden
US4259221A (en) * 1976-12-20 1981-03-31 General Electric Company Water-soluble polyamideimides
US4429073A (en) * 1980-09-23 1984-01-31 General Electric Company Polyetherimide compositions and processes for production
DE3249544C2 (de) * 1981-11-06 1985-07-11 Hitachi Chemical Co., Ltd., Tokio/Tokyo Isolierter Draht
JPS58208323A (ja) * 1982-05-28 1983-12-05 Hitachi Chem Co Ltd ポリアミドイミド樹脂の製造法
JPS5968108A (ja) * 1982-10-08 1984-04-18 日立化成工業株式会社 絶縁電線の製造法
JPS59126422A (ja) * 1983-01-10 1984-07-21 Hitachi Chem Co Ltd ポリアミドイミド樹脂組成物
DE3332033A1 (de) * 1983-09-06 1985-03-21 Bayer Ag, 5090 Leverkusen Neue polyamidimide und ihre verwendung
JPS62161835A (ja) * 1985-09-11 1987-07-17 Hitachi Chem Co Ltd ポリアミドイミド樹脂
DE19524437A1 (de) * 1995-07-05 1997-01-09 Bayer Ag Amid-/Imidgruppen-haltige blockierte Polyisocyanate für Drahtlacke
DE19615116A1 (de) * 1996-04-17 1997-10-23 Bayer Ag Wäßrige bzw. wasserverdünnbare blockierte Polyisocyanate für die Herstellung von wäßrigen 1K-PUR-Klarlacken mit wesentlich verringerter Thermovergilbung
DE19810660A1 (de) * 1998-03-12 1999-09-16 Bayer Ag Wäßrige Polyisocyanatvernetzer mit Hydroxypivalinsäure und Dimethylpyrazol-Blockierung
DE19914882A1 (de) * 1999-04-01 2000-10-05 Bayer Ag Selbstvernetzende Polyurethan-, Polyurethan-Polyharnstoff- bzw. Polyharnstoff-Dispersionen für Schlichten
DE10007820A1 (de) * 2000-02-21 2001-08-23 Bayer Ag Acylharnstoffgruppen enthaltende Polyisocyanatgemische
JP2005120134A (ja) * 2003-10-14 2005-05-12 Hitachi Chem Co Ltd 耐熱性樹脂組成物及び塗料
DE102004046308A1 (de) * 2004-09-24 2006-03-30 Bayer Materialscience Ag Neues Verfahren zur Herstellung von 3,5-Dimethylpyrazol-blockierten Polysocyanaten

Also Published As

Publication number Publication date
ZA200902893B (en) 2010-07-28
EP2087023B1 (de) 2013-06-05
KR20090086426A (ko) 2009-08-12
EP2087023A2 (de) 2009-08-12
CA2668174A1 (en) 2008-05-08
WO2008052688A2 (de) 2008-05-08
MX2009004560A (es) 2009-05-11
JP2010508427A (ja) 2010-03-18
CN101578310A (zh) 2009-11-11
WO2008052688A3 (de) 2008-06-19
US20080146764A1 (en) 2008-06-19
DE102006052240A1 (de) 2008-05-08

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Legal Events

Date Code Title Description
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2277 DE 26/08/2014.