JP2010283347A - アモルファスなタンタル−イリジウム拡散バリアを用いた銅相互接続構造、その形成方法、および該方法による半導体デバイス製造方法 - Google Patents
アモルファスなタンタル−イリジウム拡散バリアを用いた銅相互接続構造、その形成方法、および該方法による半導体デバイス製造方法 Download PDFInfo
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- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
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- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
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- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
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Abstract
【解決手段】半導体デバイス製造に用いる拡散バリアを形成する方法は、物理蒸着(PVD)工程によって、パターン形成された中間誘電体(ILD)層の上に、イリジウム・ドープされたタンタル・ベースのバリア層を堆積するステップを含み、該バリア層は、原子量で少なくとも60%のイリジウム濃度で、バリア層が結果としてアモルファス構造を有するように堆積される。
【選択図】図2
Description
104 中間誘電体(ILD)層
106 形成パターン
108 Taバリア層
110 銅シード層
Claims (13)
- 半導体デバイス製造で用いられる拡散バリアを形成する方法であって、該方法は、
物理蒸着(PVD)工程によって、パターン形成された中間誘電体(ILD)層の上にイリジウム・ドープされたタンタル・ベースのバリア層を堆積するステップを含み、
前記バリア層は、原子量で少なくとも60%のイリジウム濃度で、前記バリア層が結果としてアモルファス構造を有するように堆積される、
前記方法。 - 前記バリア層は、アモルファスなイリジウム−タンタル(α−TaIr)層およびアモルファスなイリジウム−タンタル窒化物(α−TaNIr)層のうちの一つを含む、請求項1に記載の方法。
- PVDによって、前記バリア層上に銅シード層を形成するステップをさらに含む、請求項1に記載の方法。
- 前記パターン形成されるILD層は、前記バリア層が堆積されることになる、下部金属層の上面部を露出させる、デュアル・ダマシン構造にパターン形成される、請求項1に記載の方法。
- 半導体デバイスのための拡散バリア構造体であって、
パターン形成された中間誘電体(ILD)層の上に形成されたイリジウム・ドープされたタンタル・ベースのバリア層を含み、
前記バリア層は、原子量で少なくとも60%のイリジウム濃度で、前記バリア層が結果としてアモルファス構造を有するように形成される、
前記拡散バリア構造体。 - 半導体デバイスを形成する方法であって、前記方法は、
中間誘電体(ILD)層中にデュアル・ダマシン溝およびビア構造の一つ以上のパターンを形成するステップであって、前記中間誘電体層は下部導電体層の上に形成される、前記形成するステップと、
物理蒸着(PVD)工程によって、前記パターン形成されたILD層と前記下部導電体層の露出部分との上に犠牲層を堆積するステップであって、前記犠牲層はイリジウム・ドープされたタンタル・ベースの第一層を包含する、前記堆積するステップと、
前記犠牲層の水平面を選択的に除去し、前記下部導電体層中に削り凹部を形成するステップと、
PVDによって、前記ILD層、前記犠牲層の残存垂直部分、および前記削り凹部に対応する前記下部導電体層の前記露出部分の上にバリア層を堆積するステップであって、前記バリア層は、イリジウム・ドープされたタンタル・ベースの第二層を包含する、前記堆積するステップと、
を含み、
前記犠牲層およびバリア層の双方は、原子量で少なくとも60%のイリジウム濃度で、結果としてアモルファス構造を有するように堆積される、
前記方法。 - 前記犠牲層は、アモルファスなイリジウム−タンタル(α−TaIr)層およびアモルファスなイリジウム−タンタル窒化物(α−TaNIr)層のうちの一つを含む、請求項6に記載の方法。
- 前記バリア層は、アモルファスなイリジウム−タンタル窒化物(α−TaNIr)層を含む、請求項7に記載の方法。
- PVDによって、前記バリア層上に銅シード層を形成するステップをさらに含む、請求項7に記載の方法。
- 半導体デバイスを形成する方法であって、前記方法は、
中間誘電体(ILD)層中にビア・パターンを形成するステップであって、前記中間誘電体層は下部導電体層の上に形成される、前記形成するステップと、
物理蒸着(PVD)工程によって、前記パターン形成されたILD層と前記下部導電体層の露出部分との上に犠牲層を堆積するステップであって、前記犠牲層はイリジウム・ドープされたタンタル・ベースの第一層を包含する、前記堆積するステップと、
前記犠牲層の水平面を選択的に除去し、前記下部導電体層中に削り凹部を形成するステップと、
前記ILD中に一つ以上の溝をパターン形成するステップと、
PVDによって、前記ILD層、前記犠牲層の残存垂直部分、および前記削り凹部に対応する前記下部導電体層の前記露出部分の上に犠牲層を堆積するステップであって、前記バリア層は、イリジウム・ドープされたタンタル・ベースの第二層を包含する、前記堆積するステップと、
を含み、
前記犠牲層およびバリア層の双方は、原子量で少なくとも60%のイリジウム濃度で、結果としてアモルファス構造を有するように堆積される、
前記方法。 - 前記犠牲層は、アモルファスなイリジウム−タンタル(α−TaIr)層およびアモルファスなイリジウム−タンタル窒化物(α−TaNIr)層のうちの一つを含む、請求項10に記載の方法。
- 前記バリア層は、アモルファスなイリジウム−タンタル窒化物(α−TaNIr)層を含む、請求項11に記載の方法。
- PVDによって、前記バリア層上に銅シード層を形成するステップをさらに含む、請求項11に記載の方法。
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US12/477,389 US7951708B2 (en) | 2009-06-03 | 2009-06-03 | Copper interconnect structure with amorphous tantalum iridium diffusion barrier |
US12/477389 | 2009-06-03 |
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JP2010283347A true JP2010283347A (ja) | 2010-12-16 |
JP2010283347A5 JP2010283347A5 (ja) | 2013-09-12 |
JP5444124B2 JP5444124B2 (ja) | 2014-03-19 |
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JP (1) | JP5444124B2 (ja) |
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CN (1) | CN101908501A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014123605A (ja) * | 2012-12-20 | 2014-07-03 | Tokyo Electron Ltd | Cu配線の形成方法 |
WO2020006532A1 (en) * | 2018-06-30 | 2020-01-02 | Lam Research Corporation | Zincating and doping of metal liner for liner passivation and adhesion improvement |
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EP3231266B1 (en) * | 2014-12-09 | 2020-10-14 | Intel Corporation | Microelectronic substrates having copper alloy conductive route structures |
US9875958B1 (en) * | 2016-11-09 | 2018-01-23 | International Business Machines Corporation | Trace/via hybrid structure and method of manufacture |
KR102624631B1 (ko) | 2016-12-02 | 2024-01-12 | 삼성전자주식회사 | 반도체 장치 |
US10211052B1 (en) * | 2017-09-22 | 2019-02-19 | Lam Research Corporation | Systems and methods for fabrication of a redistribution layer to avoid etching of the layer |
US11195748B2 (en) | 2017-09-27 | 2021-12-07 | Invensas Corporation | Interconnect structures and methods for forming same |
JP2021144969A (ja) * | 2020-03-10 | 2021-09-24 | キオクシア株式会社 | 磁気記憶装置 |
US11107731B1 (en) | 2020-03-30 | 2021-08-31 | International Business Machines Corporation | Self-aligned repaired top via |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59193325A (ja) * | 1983-02-07 | 1984-11-01 | ザ ゼネラル エレクトリツク カンパニ−,ピ−.エル.シ−. | 温度感知器 |
JPH01302875A (ja) * | 1988-04-05 | 1989-12-06 | Philips Gloeilampenfab:Nv | 装置およびその製造方法 |
JPH08139091A (ja) * | 1994-11-10 | 1996-05-31 | Nec Corp | 配線層形成方法およびその装置 |
JP2008541428A (ja) * | 2005-05-05 | 2008-11-20 | アプライド マテリアルズ インコーポレイテッド | 導電性バリヤ層、特にルテニウムとタンタルの合金及びそのスパッタ堆積 |
JP2009147195A (ja) * | 2007-12-17 | 2009-07-02 | Nippon Mining & Metals Co Ltd | 銅拡散防止用バリア膜、同バリア膜の形成方法、ダマシン銅配線用シード層の形成方法及びダマシン銅配線を備えた半導体ウェハー |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8802873A (nl) * | 1988-11-22 | 1990-06-18 | Philips Nv | Zachtmagnetische multilaagfilm en magneetkop voorzien van een dergelijke zachtmagnetische multilaagfilm. |
DE69020864T2 (de) * | 1989-02-28 | 1995-12-14 | Canon Kk | TINTENSTRAHLKOPF MIT WäRMEERZEUGENDEM WIDERSTAND AUS EINER NON-MONOKRISTALLINER SUBSTANZ ENTHALTEND IRIDIUM, TANTALUM UND ALUMINIUM SOWIE TINTENSTRAHLDRUCKVORRICHTUNG AUSGERüSTET MIT SOLCHEM KOPF. |
US6181012B1 (en) * | 1998-04-27 | 2001-01-30 | International Business Machines Corporation | Copper interconnection structure incorporating a metal seed layer |
US6294836B1 (en) * | 1998-12-22 | 2001-09-25 | Cvc Products Inc. | Semiconductor chip interconnect barrier material and fabrication method |
US6812143B2 (en) * | 2002-04-26 | 2004-11-02 | International Business Machines Corporation | Process of forming copper structures |
US6787912B2 (en) * | 2002-04-26 | 2004-09-07 | International Business Machines Corporation | Barrier material for copper structures |
CN1756856B (zh) * | 2003-02-27 | 2011-10-12 | 希莫菲克斯公司 | 电介质阻挡层膜 |
US20050263891A1 (en) * | 2004-05-28 | 2005-12-01 | Bih-Huey Lee | Diffusion barrier for damascene structures |
JP4832807B2 (ja) * | 2004-06-10 | 2011-12-07 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US7999330B2 (en) * | 2005-06-24 | 2011-08-16 | Micron Technology, Inc. | Dynamic random access memory device and electronic systems |
US7727888B2 (en) * | 2005-08-31 | 2010-06-01 | International Business Machines Corporation | Interconnect structure and method for forming the same |
US8118984B2 (en) * | 2006-02-22 | 2012-02-21 | Jx Nippon Mining & Metals Corporation | Sintered sputtering target made of refractory metals |
-
2009
- 2009-06-03 US US12/477,389 patent/US7951708B2/en not_active Expired - Fee Related
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2010
- 2010-05-18 KR KR1020100046447A patent/KR101581050B1/ko not_active IP Right Cessation
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59193325A (ja) * | 1983-02-07 | 1984-11-01 | ザ ゼネラル エレクトリツク カンパニ−,ピ−.エル.シ−. | 温度感知器 |
JPH01302875A (ja) * | 1988-04-05 | 1989-12-06 | Philips Gloeilampenfab:Nv | 装置およびその製造方法 |
JPH08139091A (ja) * | 1994-11-10 | 1996-05-31 | Nec Corp | 配線層形成方法およびその装置 |
JP2008541428A (ja) * | 2005-05-05 | 2008-11-20 | アプライド マテリアルズ インコーポレイテッド | 導電性バリヤ層、特にルテニウムとタンタルの合金及びそのスパッタ堆積 |
JP2009147195A (ja) * | 2007-12-17 | 2009-07-02 | Nippon Mining & Metals Co Ltd | 銅拡散防止用バリア膜、同バリア膜の形成方法、ダマシン銅配線用シード層の形成方法及びダマシン銅配線を備えた半導体ウェハー |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014123605A (ja) * | 2012-12-20 | 2014-07-03 | Tokyo Electron Ltd | Cu配線の形成方法 |
WO2020006532A1 (en) * | 2018-06-30 | 2020-01-02 | Lam Research Corporation | Zincating and doping of metal liner for liner passivation and adhesion improvement |
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US7951708B2 (en) | 2011-05-31 |
US20100311236A1 (en) | 2010-12-09 |
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JP5444124B2 (ja) | 2014-03-19 |
KR20100130551A (ko) | 2010-12-13 |
KR101581050B1 (ko) | 2015-12-30 |
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