JP2010212293A5 - - Google Patents

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Publication number
JP2010212293A5
JP2010212293A5 JP2009053925A JP2009053925A JP2010212293A5 JP 2010212293 A5 JP2010212293 A5 JP 2010212293A5 JP 2009053925 A JP2009053925 A JP 2009053925A JP 2009053925 A JP2009053925 A JP 2009053925A JP 2010212293 A5 JP2010212293 A5 JP 2010212293A5
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JP
Japan
Prior art keywords
filter medium
drying
gas
heating
temperature
Prior art date
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Application number
JP2009053925A
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English (en)
Japanese (ja)
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JP4862903B2 (ja
JP2010212293A (ja
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Application filed filed Critical
Priority to JP2009053925A priority Critical patent/JP4862903B2/ja
Priority claimed from JP2009053925A external-priority patent/JP4862903B2/ja
Priority to KR1020100015653A priority patent/KR101315581B1/ko
Priority to US12/718,008 priority patent/US20100223805A1/en
Publication of JP2010212293A publication Critical patent/JP2010212293A/ja
Publication of JP2010212293A5 publication Critical patent/JP2010212293A5/ja
Application granted granted Critical
Publication of JP4862903B2 publication Critical patent/JP4862903B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009053925A 2009-03-06 2009-03-06 基板処理装置、濾材の再生方法及び記憶媒体 Expired - Fee Related JP4862903B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009053925A JP4862903B2 (ja) 2009-03-06 2009-03-06 基板処理装置、濾材の再生方法及び記憶媒体
KR1020100015653A KR101315581B1 (ko) 2009-03-06 2010-02-22 기판 처리 장치, 여과재의 재생 방법 및 기억 매체
US12/718,008 US20100223805A1 (en) 2009-03-06 2010-03-05 Substrate processing device, recycling method of filtration material and recording medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009053925A JP4862903B2 (ja) 2009-03-06 2009-03-06 基板処理装置、濾材の再生方法及び記憶媒体

Publications (3)

Publication Number Publication Date
JP2010212293A JP2010212293A (ja) 2010-09-24
JP2010212293A5 true JP2010212293A5 (enExample) 2011-04-21
JP4862903B2 JP4862903B2 (ja) 2012-01-25

Family

ID=42676976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009053925A Expired - Fee Related JP4862903B2 (ja) 2009-03-06 2009-03-06 基板処理装置、濾材の再生方法及び記憶媒体

Country Status (3)

Country Link
US (1) US20100223805A1 (enExample)
JP (1) JP4862903B2 (enExample)
KR (1) KR101315581B1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4527670B2 (ja) * 2006-01-25 2010-08-18 東京エレクトロン株式会社 加熱処理装置、加熱処理方法、制御プログラムおよびコンピュータ読取可能な記憶媒体
MX350504B (es) * 2011-03-29 2017-09-07 Kellog Co Sistema de recuperación de calor.
US10046371B2 (en) * 2013-03-29 2018-08-14 Semes Co., Ltd. Recycling unit, substrate treating apparatus and recycling method using the recycling unit
KR101661178B1 (ko) * 2014-11-18 2016-10-04 주식회사 테라세미콘 기판 프로세싱 장치
JP2017157800A (ja) * 2016-03-04 2017-09-07 東京エレクトロン株式会社 液処理方法、基板処理装置、及び記憶媒体
US10957529B2 (en) * 2016-11-28 2021-03-23 Taiwan Semiconductor Manufacturing Co., Ltd. Method for drying wafer with gaseous fluid
JP6762214B2 (ja) * 2016-12-02 2020-09-30 東京エレクトロン株式会社 基板液処理装置、および基板液処理方法
US10825698B2 (en) * 2017-06-15 2020-11-03 Samsung Electronics Co., Ltd. Substrate drying apparatus, facility of manufacturing semiconductor device, and method of drying substrate
KR102636979B1 (ko) * 2019-04-26 2024-02-14 삼성전자주식회사 멀티 챔버 장치
JP7314634B2 (ja) * 2019-06-11 2023-07-26 東京エレクトロン株式会社 塗布装置及び塗布方法
JP7323674B1 (ja) 2022-04-27 2023-08-08 セメス株式会社 薬液ヒーティング装置およびそれを備える基板処理システム
CN115031509B (zh) * 2022-05-18 2023-06-30 扬州思普尔科技有限公司 一种升降式半导体晶圆干燥装置
US20250357099A1 (en) * 2024-05-16 2025-11-20 Tokyo Electron Limited Wafer cleaning method and system

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5313982A (en) * 1988-07-08 1994-05-24 Tadahiro Ohmi Gas supply piping device for a process apparatus
JPH06103686B2 (ja) * 1989-11-24 1994-12-14 シー エフ エム テクノロジーズ，インコーポレイテッド 表面乾燥処理方法および装置
JP3557599B2 (ja) * 1998-08-07 2004-08-25 東京エレクトロン株式会社 蒸気処理装置
JP4173349B2 (ja) * 2001-11-05 2008-10-29 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP4056888B2 (ja) 2003-01-07 2008-03-05 株式会社島津製作所 気化器
DE20321795U1 (de) * 2003-12-11 2010-03-04 Voith Patent Gmbh Vorrichtung zum Reinigen wenigsten einer Prozesskammer zum Beschichten wenigstens eines Substrats
US20060048808A1 (en) * 2004-09-09 2006-03-09 Ruckman Jack H Solar, catalytic, hydrogen generation apparatus and method
US20060117743A1 (en) * 2004-12-03 2006-06-08 Helmut Swars Regeneratable particle filter
JP4662352B2 (ja) * 2005-08-10 2011-03-30 東京エレクトロン株式会社 蒸気乾燥方法及びその装置並びにその記録媒体
US7637029B2 (en) * 2005-07-08 2009-12-29 Tokyo Electron Limited Vapor drying method, apparatus and recording medium for use in the method

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