JP4862903B2 - 基板処理装置、濾材の再生方法及び記憶媒体 - Google Patents
基板処理装置、濾材の再生方法及び記憶媒体 Download PDFInfo
- Publication number
- JP4862903B2 JP4862903B2 JP2009053925A JP2009053925A JP4862903B2 JP 4862903 B2 JP4862903 B2 JP 4862903B2 JP 2009053925 A JP2009053925 A JP 2009053925A JP 2009053925 A JP2009053925 A JP 2009053925A JP 4862903 B2 JP4862903 B2 JP 4862903B2
- Authority
- JP
- Japan
- Prior art keywords
- filter medium
- unit
- drying
- gas
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H10P72/0406—
-
- H10P72/0408—
-
- H10P72/3404—
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Filtering Of Dispersed Particles In Gases (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009053925A JP4862903B2 (ja) | 2009-03-06 | 2009-03-06 | 基板処理装置、濾材の再生方法及び記憶媒体 |
| KR1020100015653A KR101315581B1 (ko) | 2009-03-06 | 2010-02-22 | 기판 처리 장치, 여과재의 재생 방법 및 기억 매체 |
| US12/718,008 US20100223805A1 (en) | 2009-03-06 | 2010-03-05 | Substrate processing device, recycling method of filtration material and recording medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009053925A JP4862903B2 (ja) | 2009-03-06 | 2009-03-06 | 基板処理装置、濾材の再生方法及び記憶媒体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010212293A JP2010212293A (ja) | 2010-09-24 |
| JP2010212293A5 JP2010212293A5 (enExample) | 2011-04-21 |
| JP4862903B2 true JP4862903B2 (ja) | 2012-01-25 |
Family
ID=42676976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009053925A Expired - Fee Related JP4862903B2 (ja) | 2009-03-06 | 2009-03-06 | 基板処理装置、濾材の再生方法及び記憶媒体 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20100223805A1 (enExample) |
| JP (1) | JP4862903B2 (enExample) |
| KR (1) | KR101315581B1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4527670B2 (ja) * | 2006-01-25 | 2010-08-18 | 東京エレクトロン株式会社 | 加熱処理装置、加熱処理方法、制御プログラムおよびコンピュータ読取可能な記憶媒体 |
| TR201904859T4 (tr) * | 2011-03-29 | 2019-05-21 | Kellog Co | Isı geri kazanım sistemli fırın. |
| US10046371B2 (en) * | 2013-03-29 | 2018-08-14 | Semes Co., Ltd. | Recycling unit, substrate treating apparatus and recycling method using the recycling unit |
| KR101661178B1 (ko) * | 2014-11-18 | 2016-10-04 | 주식회사 테라세미콘 | 기판 프로세싱 장치 |
| JP2017157800A (ja) * | 2016-03-04 | 2017-09-07 | 東京エレクトロン株式会社 | 液処理方法、基板処理装置、及び記憶媒体 |
| US10957529B2 (en) * | 2016-11-28 | 2021-03-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for drying wafer with gaseous fluid |
| JP6762214B2 (ja) * | 2016-12-02 | 2020-09-30 | 東京エレクトロン株式会社 | 基板液処理装置、および基板液処理方法 |
| US10825698B2 (en) * | 2017-06-15 | 2020-11-03 | Samsung Electronics Co., Ltd. | Substrate drying apparatus, facility of manufacturing semiconductor device, and method of drying substrate |
| KR102636979B1 (ko) * | 2019-04-26 | 2024-02-14 | 삼성전자주식회사 | 멀티 챔버 장치 |
| JP7314634B2 (ja) * | 2019-06-11 | 2023-07-26 | 東京エレクトロン株式会社 | 塗布装置及び塗布方法 |
| JP7323674B1 (ja) | 2022-04-27 | 2023-08-08 | セメス株式会社 | 薬液ヒーティング装置およびそれを備える基板処理システム |
| CN115031509B (zh) * | 2022-05-18 | 2023-06-30 | 扬州思普尔科技有限公司 | 一种升降式半导体晶圆干燥装置 |
| US20250357099A1 (en) * | 2024-05-16 | 2025-11-20 | Tokyo Electron Limited | Wafer cleaning method and system |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5313982A (en) * | 1988-07-08 | 1994-05-24 | Tadahiro Ohmi | Gas supply piping device for a process apparatus |
| JPH06103686B2 (ja) * | 1989-11-24 | 1994-12-14 | シー エフ エム テクノロジーズ,インコーポレイテッド | 表面乾燥処理方法および装置 |
| JP3557599B2 (ja) * | 1998-08-07 | 2004-08-25 | 東京エレクトロン株式会社 | 蒸気処理装置 |
| JP4173349B2 (ja) * | 2001-11-05 | 2008-10-29 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
| JP4056888B2 (ja) | 2003-01-07 | 2008-03-05 | 株式会社島津製作所 | 気化器 |
| DE10358275A1 (de) * | 2003-12-11 | 2005-07-21 | Wiessner Gmbh | Vorrichtung und Verfahren zum Reinigen wenigstens einer Prozesskammer zum Beschichten wenigstens eines Substrats |
| US20060048808A1 (en) * | 2004-09-09 | 2006-03-09 | Ruckman Jack H | Solar, catalytic, hydrogen generation apparatus and method |
| US20060117743A1 (en) * | 2004-12-03 | 2006-06-08 | Helmut Swars | Regeneratable particle filter |
| JP4662352B2 (ja) * | 2005-08-10 | 2011-03-30 | 東京エレクトロン株式会社 | 蒸気乾燥方法及びその装置並びにその記録媒体 |
| US7637029B2 (en) * | 2005-07-08 | 2009-12-29 | Tokyo Electron Limited | Vapor drying method, apparatus and recording medium for use in the method |
-
2009
- 2009-03-06 JP JP2009053925A patent/JP4862903B2/ja not_active Expired - Fee Related
-
2010
- 2010-02-22 KR KR1020100015653A patent/KR101315581B1/ko not_active Expired - Fee Related
- 2010-03-05 US US12/718,008 patent/US20100223805A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010212293A (ja) | 2010-09-24 |
| KR20100100614A (ko) | 2010-09-15 |
| US20100223805A1 (en) | 2010-09-09 |
| KR101315581B1 (ko) | 2013-10-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4862903B2 (ja) | 基板処理装置、濾材の再生方法及び記憶媒体 | |
| KR102783796B1 (ko) | 기판 처리 장치의 파티클 제거 방법 및 기판 처리 장치 | |
| JP3194036B2 (ja) | 乾燥処理装置及び乾燥処理方法 | |
| KR102701372B1 (ko) | 반도체 시스템의 습도 제어 | |
| KR101506203B1 (ko) | 기판 처리 장치, 기판 처리 방법 및 기억 매체 | |
| TWI584390B (zh) | A substrate processing apparatus, a substrate processing method, and a memory medium | |
| KR20180063831A (ko) | 기판 처리 장치의 세정 방법 및 기판 처리 장치의 세정 시스템 | |
| JP7355615B2 (ja) | 基板洗浄装置及び基板洗浄方法 | |
| CN110858559B (zh) | 缓存单元及用于用该单元处理基板的装置和方法 | |
| JP5015847B2 (ja) | 基板処理装置、基板処理方法、プログラムならびに記録媒体 | |
| CN107533998A (zh) | 基板处理装置以及清洗腔室的方法 | |
| KR20210008549A (ko) | 버퍼 유닛, 그리고 이를 가지는 기판 처리 장치 및 방법 | |
| US20240203757A1 (en) | Control unit and semiconductor manufacturing equipment including the same | |
| JPWO1998044542A1 (ja) | 基板処理方法および基板処理装置 | |
| JP2003115519A (ja) | 半導体装置の製造方法、半導体製造装置、ロードロック室、基板収納ケース、ストッカ | |
| JP5184477B2 (ja) | 乾燥室、洗浄・乾燥処理装置、乾燥処理方法、および記録媒体 | |
| KR102300977B1 (ko) | 기판 처리 장치, 기판 처리 방법 및 기억 매체 | |
| JP5362503B2 (ja) | 洗浄・乾燥処理方法、洗浄・乾燥処理装置、および記録媒体 | |
| CN114695190B (zh) | 用于处理基板的设备和方法 | |
| US12272543B2 (en) | Apparatus for treating substrate and method for treating substrate | |
| JP2017212341A (ja) | フッ素含有有機溶剤の回収装置および基板処理装置 | |
| KR20110003470U (ko) | 클리닝 장치를 구비하는 소스가스 공급시스템 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110303 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110303 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110707 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110719 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110914 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20111011 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20111024 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141118 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 4862903 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |