KR101315581B1 - 기판 처리 장치, 여과재의 재생 방법 및 기억 매체 - Google Patents

기판 처리 장치, 여과재의 재생 방법 및 기억 매체 Download PDF

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Publication number
KR101315581B1
KR101315581B1 KR1020100015653A KR20100015653A KR101315581B1 KR 101315581 B1 KR101315581 B1 KR 101315581B1 KR 1020100015653 A KR1020100015653 A KR 1020100015653A KR 20100015653 A KR20100015653 A KR 20100015653A KR 101315581 B1 KR101315581 B1 KR 101315581B1
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South Korea
Prior art keywords
filter medium
temperature
drying
gas
unit
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Expired - Fee Related
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KR1020100015653A
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English (en)
Korean (ko)
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KR20100100614A (ko
Inventor
히로노부 햐쿠타케
히데키 니시무라
히로시 다나카
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도쿄엘렉트론가부시키가이샤
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Publication of KR20100100614A publication Critical patent/KR20100100614A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means

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  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Filtering Of Dispersed Particles In Gases (AREA)
KR1020100015653A 2009-03-06 2010-02-22 기판 처리 장치, 여과재의 재생 방법 및 기억 매체 Expired - Fee Related KR101315581B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009053925A JP4862903B2 (ja) 2009-03-06 2009-03-06 基板処理装置、濾材の再生方法及び記憶媒体
JPJP-P-2009-053925 2009-03-06

Publications (2)

Publication Number Publication Date
KR20100100614A KR20100100614A (ko) 2010-09-15
KR101315581B1 true KR101315581B1 (ko) 2013-10-10

Family

ID=42676976

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KR1020100015653A Expired - Fee Related KR101315581B1 (ko) 2009-03-06 2010-02-22 기판 처리 장치, 여과재의 재생 방법 및 기억 매체

Country Status (3)

Country Link
US (1) US20100223805A1 (enExample)
JP (1) JP4862903B2 (enExample)
KR (1) KR101315581B1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016080729A1 (ko) * 2014-11-18 2016-05-26 주식회사 테라세미콘 기판 프로세싱 장치

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4527670B2 (ja) 2006-01-25 2010-08-18 東京エレクトロン株式会社 加熱処理装置、加熱処理方法、制御プログラムおよびコンピュータ読取可能な記憶媒体
EP2691720B1 (en) * 2011-03-29 2019-02-13 Kellogg Company Oven with heat recovery system
US10046371B2 (en) * 2013-03-29 2018-08-14 Semes Co., Ltd. Recycling unit, substrate treating apparatus and recycling method using the recycling unit
JP2017157800A (ja) * 2016-03-04 2017-09-07 東京エレクトロン株式会社 液処理方法、基板処理装置、及び記憶媒体
US10957529B2 (en) * 2016-11-28 2021-03-23 Taiwan Semiconductor Manufacturing Co., Ltd. Method for drying wafer with gaseous fluid
JP6762214B2 (ja) * 2016-12-02 2020-09-30 東京エレクトロン株式会社 基板液処理装置、および基板液処理方法
US10825698B2 (en) * 2017-06-15 2020-11-03 Samsung Electronics Co., Ltd. Substrate drying apparatus, facility of manufacturing semiconductor device, and method of drying substrate
KR102636979B1 (ko) * 2019-04-26 2024-02-14 삼성전자주식회사 멀티 챔버 장치
JP7314634B2 (ja) 2019-06-11 2023-07-26 東京エレクトロン株式会社 塗布装置及び塗布方法
JP7323674B1 (ja) 2022-04-27 2023-08-08 セメス株式会社 薬液ヒーティング装置およびそれを備える基板処理システム
CN115031509B (zh) * 2022-05-18 2023-06-30 扬州思普尔科技有限公司 一种升降式半导体晶圆干燥装置
US20250357099A1 (en) * 2024-05-16 2025-11-20 Tokyo Electron Limited Wafer cleaning method and system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000055543A (ja) 1998-08-07 2000-02-25 Tokyo Electron Ltd 蒸気処理装置及び蒸気処理方法
JP2004211183A (ja) 2003-01-07 2004-07-29 Shimadzu Corp 気化器
JP2007046838A (ja) 2005-08-10 2007-02-22 Tokyo Electron Ltd 蒸気乾燥方法及びその装置並びにその記録媒体

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US5313982A (en) * 1988-07-08 1994-05-24 Tadahiro Ohmi Gas supply piping device for a process apparatus
JPH06103686B2 (ja) * 1989-11-24 1994-12-14 シー エフ エム テクノロジーズ，インコーポレイテッド 表面乾燥処理方法および装置
JP4173349B2 (ja) * 2001-11-05 2008-10-29 東京エレクトロン株式会社 基板処理装置及び基板処理方法
DE10358275A1 (de) * 2003-12-11 2005-07-21 Wiessner Gmbh Vorrichtung und Verfahren zum Reinigen wenigstens einer Prozesskammer zum Beschichten wenigstens eines Substrats
US20060048808A1 (en) * 2004-09-09 2006-03-09 Ruckman Jack H Solar, catalytic, hydrogen generation apparatus and method
US20060117743A1 (en) * 2004-12-03 2006-06-08 Helmut Swars Regeneratable particle filter
US7637029B2 (en) * 2005-07-08 2009-12-29 Tokyo Electron Limited Vapor drying method, apparatus and recording medium for use in the method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000055543A (ja) 1998-08-07 2000-02-25 Tokyo Electron Ltd 蒸気処理装置及び蒸気処理方法
JP2004211183A (ja) 2003-01-07 2004-07-29 Shimadzu Corp 気化器
JP2007046838A (ja) 2005-08-10 2007-02-22 Tokyo Electron Ltd 蒸気乾燥方法及びその装置並びにその記録媒体

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016080729A1 (ko) * 2014-11-18 2016-05-26 주식회사 테라세미콘 기판 프로세싱 장치
KR20160059356A (ko) * 2014-11-18 2016-05-26 주식회사 테라세미콘 기판 프로세싱 장치
KR101661178B1 (ko) * 2014-11-18 2016-10-04 주식회사 테라세미콘 기판 프로세싱 장치

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Publication number Publication date
JP2010212293A (ja) 2010-09-24
KR20100100614A (ko) 2010-09-15
US20100223805A1 (en) 2010-09-09
JP4862903B2 (ja) 2012-01-25

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