JP2010192653A - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2010192653A
JP2010192653A JP2009035114A JP2009035114A JP2010192653A JP 2010192653 A JP2010192653 A JP 2010192653A JP 2009035114 A JP2009035114 A JP 2009035114A JP 2009035114 A JP2009035114 A JP 2009035114A JP 2010192653 A JP2010192653 A JP 2010192653A
Authority
JP
Japan
Prior art keywords
circuit board
semiconductor device
covering portion
mold body
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009035114A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010192653A5 (enExample
Inventor
Masahiro Ono
正浩 小野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2009035114A priority Critical patent/JP2010192653A/ja
Priority to US12/702,804 priority patent/US8247898B2/en
Publication of JP2010192653A publication Critical patent/JP2010192653A/ja
Publication of JP2010192653A5 publication Critical patent/JP2010192653A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/276—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2009035114A 2009-02-18 2009-02-18 半導体装置 Pending JP2010192653A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009035114A JP2010192653A (ja) 2009-02-18 2009-02-18 半導体装置
US12/702,804 US8247898B2 (en) 2009-02-18 2010-02-09 Semiconductor device and semiconductor device mounted structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009035114A JP2010192653A (ja) 2009-02-18 2009-02-18 半導体装置

Publications (2)

Publication Number Publication Date
JP2010192653A true JP2010192653A (ja) 2010-09-02
JP2010192653A5 JP2010192653A5 (enExample) 2012-02-23

Family

ID=42559184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009035114A Pending JP2010192653A (ja) 2009-02-18 2009-02-18 半導体装置

Country Status (2)

Country Link
US (1) US8247898B2 (enExample)
JP (1) JP2010192653A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017130545A (ja) * 2016-01-20 2017-07-27 ニチコン株式会社 フィルムコンデンサ
WO2018092529A1 (ja) * 2016-11-16 2018-05-24 株式会社村田製作所 高周波モジュール
CN108431946A (zh) * 2016-01-07 2018-08-21 赛灵思公司 具有加强件的堆叠的硅封装组件
WO2023139979A1 (ja) * 2022-01-20 2023-07-27 株式会社村田製作所 高周波モジュール、高周波モジュールの製造方法、及び、通信装置
US12389528B2 (en) 2020-06-10 2025-08-12 Murata Manufacturing Co., Ltd. Module
US12495485B2 (en) 2020-06-10 2025-12-09 Murata Manufacturing Co., Ltd. Module and component
US12684749B2 (en) 2021-11-10 2026-07-14 Murata Manufacturing Co., Ltd. Electronic component module

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130026062A (ko) * 2011-09-05 2013-03-13 삼성전자주식회사 인쇄회로기판 조립체 및 그 제조방법
US9202789B2 (en) * 2014-04-16 2015-12-01 Qualcomm Incorporated Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package
KR102508526B1 (ko) 2016-08-24 2023-03-09 삼성전자주식회사 반도체 패키지 제조 방법
WO2019181589A1 (ja) * 2018-03-23 2019-09-26 株式会社村田製作所 高周波モジュールおよび通信装置
WO2019181590A1 (ja) * 2018-03-23 2019-09-26 株式会社村田製作所 高周波モジュールおよび通信装置
CN109390242B (zh) * 2018-09-27 2020-04-28 日月光半导体（威海）有限公司 一种功率器件封装结构及其制备方法
JP2021106341A (ja) * 2019-12-26 2021-07-26 株式会社村田製作所 高周波モジュールおよび通信装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07326688A (ja) * 1994-05-31 1995-12-12 Nec Corp 半導体装置
JP2001210737A (ja) * 2000-01-27 2001-08-03 Tdk Corp 半導体チップパッケージおよびその製造方法
JP2003100924A (ja) * 2001-09-21 2003-04-04 Kyocera Corp 半導体装置
JP2005109306A (ja) * 2003-10-01 2005-04-21 Matsushita Electric Ind Co Ltd 電子部品パッケージおよびその製造方法
WO2006046713A1 (ja) * 2004-10-28 2006-05-04 Kyocera Corporation 電子部品モジュール及び無線通信機器
JP2008288610A (ja) * 2008-07-17 2008-11-27 Taiyo Yuden Co Ltd 回路モジュールの製造方法

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JP3241669B2 (ja) 1998-11-09 2001-12-25 埼玉日本電気株式会社 Ｉｃパッケージの補強構造
JP3793421B2 (ja) 2001-04-10 2006-07-05 アルプス電気株式会社 面実装型電子回路ユニット及び面実装型電子回路ユニットの製造方法
US6856007B2 (en) * 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
JP3966172B2 (ja) 2002-12-09 2007-08-29 松下電器産業株式会社 モジュール部品の製造方法
JP2005183430A (ja) 2003-12-16 2005-07-07 Matsushita Electric Ind Co Ltd 電子部品内蔵モジュール
JP2006196857A (ja) 2004-12-16 2006-07-27 Murata Mfg Co Ltd ケース付き複合回路基板及びその製造方法
JP2006351952A (ja) 2005-06-17 2006-12-28 Nec Electronics Corp 半導体装置
JP2007207802A (ja) 2006-01-31 2007-08-16 Sharp Corp 電子回路モジュールとその製造方法
JP2008251608A (ja) * 2007-03-29 2008-10-16 Casio Comput Co Ltd 半導体装置およびその製造方法
JPWO2008120755A1 (ja) * 2007-03-30 2010-07-15 日本電気株式会社 機能素子内蔵回路基板及びその製造方法、並びに電子機器
EP2009692A1 (en) 2007-06-29 2008-12-31 TDK Corporation Electronic module and fabrication method thereof
JP2009033114A (ja) 2007-06-29 2009-02-12 Tdk Corp 電子モジュール、及び電子モジュールの製造方法
US20090315156A1 (en) * 2008-06-20 2009-12-24 Harper Peter R Packaged integrated circuit having conformal electromagnetic shields and methods to form the same
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Patent Citations (6)

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Publication number Priority date Publication date Assignee Title
JPH07326688A (ja) * 1994-05-31 1995-12-12 Nec Corp 半導体装置
JP2001210737A (ja) * 2000-01-27 2001-08-03 Tdk Corp 半導体チップパッケージおよびその製造方法
JP2003100924A (ja) * 2001-09-21 2003-04-04 Kyocera Corp 半導体装置
JP2005109306A (ja) * 2003-10-01 2005-04-21 Matsushita Electric Ind Co Ltd 電子部品パッケージおよびその製造方法
WO2006046713A1 (ja) * 2004-10-28 2006-05-04 Kyocera Corporation 電子部品モジュール及び無線通信機器
JP2008288610A (ja) * 2008-07-17 2008-11-27 Taiyo Yuden Co Ltd 回路モジュールの製造方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108431946A (zh) * 2016-01-07 2018-08-21 赛灵思公司 具有加强件的堆叠的硅封装组件
JP2019501534A (ja) * 2016-01-07 2019-01-17 ザイリンクス インコーポレイテッドＸｉｌｉｎｘ Ｉｎｃｏｒｐｏｒａｔｅｄ 改良された補剛材を有する積層シリコンパッケージアセンブリ
US10840192B1 (en) 2016-01-07 2020-11-17 Xilinx, Inc. Stacked silicon package assembly having enhanced stiffener
CN108431946B (zh) * 2016-01-07 2021-12-07 赛灵思公司 具有加强件的堆叠的硅封装组件
JP2017130545A (ja) * 2016-01-20 2017-07-27 ニチコン株式会社 フィルムコンデンサ
WO2018092529A1 (ja) * 2016-11-16 2018-05-24 株式会社村田製作所 高周波モジュール
US10952310B2 (en) 2016-11-16 2021-03-16 Murata Manufacturing Co., Ltd. High-frequency module
US12389528B2 (en) 2020-06-10 2025-08-12 Murata Manufacturing Co., Ltd. Module
US12495485B2 (en) 2020-06-10 2025-12-09 Murata Manufacturing Co., Ltd. Module and component
US12684749B2 (en) 2021-11-10 2026-07-14 Murata Manufacturing Co., Ltd. Electronic component module
WO2023139979A1 (ja) * 2022-01-20 2023-07-27 株式会社村田製作所 高周波モジュール、高周波モジュールの製造方法、及び、通信装置

Also Published As

Publication number Publication date
US20100207264A1 (en) 2010-08-19
US8247898B2 (en) 2012-08-21

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