JP2010192653A5 - - Google Patents
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- Publication number
- JP2010192653A5 JP2010192653A5 JP2009035114A JP2009035114A JP2010192653A5 JP 2010192653 A5 JP2010192653 A5 JP 2010192653A5 JP 2009035114 A JP2009035114 A JP 2009035114A JP 2009035114 A JP2009035114 A JP 2009035114A JP 2010192653 A5 JP2010192653 A5 JP 2010192653A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- semiconductor device
- wiring electrode
- covering
- mold body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009035114A JP2010192653A (ja) | 2009-02-18 | 2009-02-18 | 半導体装置 |
| US12/702,804 US8247898B2 (en) | 2009-02-18 | 2010-02-09 | Semiconductor device and semiconductor device mounted structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009035114A JP2010192653A (ja) | 2009-02-18 | 2009-02-18 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010192653A JP2010192653A (ja) | 2010-09-02 |
| JP2010192653A5 true JP2010192653A5 (enExample) | 2012-02-23 |
Family
ID=42559184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009035114A Pending JP2010192653A (ja) | 2009-02-18 | 2009-02-18 | 半導体装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8247898B2 (enExample) |
| JP (1) | JP2010192653A (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130026062A (ko) * | 2011-09-05 | 2013-03-13 | 삼성전자주식회사 | 인쇄회로기판 조립체 및 그 제조방법 |
| US9202789B2 (en) * | 2014-04-16 | 2015-12-01 | Qualcomm Incorporated | Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package |
| CN108431946B (zh) * | 2016-01-07 | 2021-12-07 | 赛灵思公司 | 具有加强件的堆叠的硅封装组件 |
| JP6616692B2 (ja) * | 2016-01-20 | 2019-12-04 | ニチコン株式会社 | フィルムコンデンサ |
| KR102508526B1 (ko) | 2016-08-24 | 2023-03-09 | 삼성전자주식회사 | 반도체 패키지 제조 방법 |
| WO2018092529A1 (ja) | 2016-11-16 | 2018-05-24 | 株式会社村田製作所 | 高周波モジュール |
| WO2019181590A1 (ja) * | 2018-03-23 | 2019-09-26 | 株式会社村田製作所 | 高周波モジュールおよび通信装置 |
| CN214123862U (zh) * | 2018-03-23 | 2021-09-03 | 株式会社村田制作所 | 高频模块和通信装置 |
| CN109390242B (zh) * | 2018-09-27 | 2020-04-28 | 日月光半导体（威海）有限公司 | 一种功率器件封装结构及其制备方法 |
| JP2021106341A (ja) * | 2019-12-26 | 2021-07-26 | 株式会社村田製作所 | 高周波モジュールおよび通信装置 |
| WO2021251160A1 (ja) | 2020-06-10 | 2021-12-16 | 株式会社村田製作所 | モジュールおよび部品 |
| WO2021251045A1 (ja) | 2020-06-10 | 2021-12-16 | 株式会社村田製作所 | モジュール |
| WO2023139979A1 (ja) * | 2022-01-20 | 2023-07-27 | 株式会社村田製作所 | 高周波モジュール、高周波モジュールの製造方法、及び、通信装置 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2565300B2 (ja) * | 1994-05-31 | 1996-12-18 | 日本電気株式会社 | 半導体装置 |
| JP3241669B2 (ja) | 1998-11-09 | 2001-12-25 | 埼玉日本電気株式会社 | Ｉｃパッケージの補強構造 |
| JP2001210737A (ja) * | 2000-01-27 | 2001-08-03 | Tdk Corp | 半導体チップパッケージおよびその製造方法 |
| JP3793421B2 (ja) | 2001-04-10 | 2006-07-05 | アルプス電気株式会社 | 面実装型電子回路ユニット及び面実装型電子回路ユニットの製造方法 |
| US6856007B2 (en) * | 2001-08-28 | 2005-02-15 | Tessera, Inc. | High-frequency chip packages |
| JP2003100924A (ja) * | 2001-09-21 | 2003-04-04 | Kyocera Corp | 半導体装置 |
| JP3966172B2 (ja) | 2002-12-09 | 2007-08-29 | 松下電器産業株式会社 | モジュール部品の製造方法 |
| JP2005109306A (ja) * | 2003-10-01 | 2005-04-21 | Matsushita Electric Ind Co Ltd | 電子部品パッケージおよびその製造方法 |
| JP2005183430A (ja) | 2003-12-16 | 2005-07-07 | Matsushita Electric Ind Co Ltd | 電子部品内蔵モジュール |
| US7701728B2 (en) * | 2004-10-28 | 2010-04-20 | Kyocera Corporation | Electronic component module and radio comunications equipment |
| JP2006196857A (ja) | 2004-12-16 | 2006-07-27 | Murata Mfg Co Ltd | ケース付き複合回路基板及びその製造方法 |
| JP2006351952A (ja) | 2005-06-17 | 2006-12-28 | Nec Electronics Corp | 半導体装置 |
| JP2007207802A (ja) * | 2006-01-31 | 2007-08-16 | Sharp Corp | 電子回路モジュールとその製造方法 |
| JP2008251608A (ja) * | 2007-03-29 | 2008-10-16 | Casio Comput Co Ltd | 半導体装置およびその製造方法 |
| US20100103634A1 (en) * | 2007-03-30 | 2010-04-29 | Takuo Funaya | Functional-device-embedded circuit board, method for manufacturing the same, and electronic equipment |
| JP2009033114A (ja) | 2007-06-29 | 2009-02-12 | Tdk Corp | 電子モジュール、及び電子モジュールの製造方法 |
| US20090002967A1 (en) * | 2007-06-29 | 2009-01-01 | Tdk Corporation | Electronic module and fabrication method thereof |
| US20090315156A1 (en) * | 2008-06-20 | 2009-12-24 | Harper Peter R | Packaged integrated circuit having conformal electromagnetic shields and methods to form the same |
| JP2008288610A (ja) * | 2008-07-17 | 2008-11-27 | Taiyo Yuden Co Ltd | 回路モジュールの製造方法 |
| JP2011198866A (ja) * | 2010-03-18 | 2011-10-06 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
-
2009
- 2009-02-18 JP JP2009035114A patent/JP2010192653A/ja active Pending
-
2010
- 2010-02-09 US US12/702,804 patent/US8247898B2/en active Active