JP2010192653A5 - - Google Patents

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Publication number
JP2010192653A5
JP2010192653A5 JP2009035114A JP2009035114A JP2010192653A5 JP 2010192653 A5 JP2010192653 A5 JP 2010192653A5 JP 2009035114 A JP2009035114 A JP 2009035114A JP 2009035114 A JP2009035114 A JP 2009035114A JP 2010192653 A5 JP2010192653 A5 JP 2010192653A5
Authority
JP
Japan
Prior art keywords
circuit board
semiconductor device
wiring electrode
covering
mold body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009035114A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010192653A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009035114A priority Critical patent/JP2010192653A/ja
Priority claimed from JP2009035114A external-priority patent/JP2010192653A/ja
Priority to US12/702,804 priority patent/US8247898B2/en
Publication of JP2010192653A publication Critical patent/JP2010192653A/ja
Publication of JP2010192653A5 publication Critical patent/JP2010192653A5/ja
Pending legal-status Critical Current

Links

JP2009035114A 2009-02-18 2009-02-18 半導体装置 Pending JP2010192653A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009035114A JP2010192653A (ja) 2009-02-18 2009-02-18 半導体装置
US12/702,804 US8247898B2 (en) 2009-02-18 2010-02-09 Semiconductor device and semiconductor device mounted structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009035114A JP2010192653A (ja) 2009-02-18 2009-02-18 半導体装置

Publications (2)

Publication Number Publication Date
JP2010192653A JP2010192653A (ja) 2010-09-02
JP2010192653A5 true JP2010192653A5 (enExample) 2012-02-23

Family

ID=42559184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009035114A Pending JP2010192653A (ja) 2009-02-18 2009-02-18 半導体装置

Country Status (2)

Country Link
US (1) US8247898B2 (enExample)
JP (1) JP2010192653A (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130026062A (ko) * 2011-09-05 2013-03-13 삼성전자주식회사 인쇄회로기판 조립체 및 그 제조방법
US9202789B2 (en) * 2014-04-16 2015-12-01 Qualcomm Incorporated Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package
EP3357085B1 (en) * 2016-01-07 2024-10-09 Xilinx, Inc. Stacked silicon package assembly having enhanced stiffener
JP6616692B2 (ja) * 2016-01-20 2019-12-04 ニチコン株式会社 フィルムコンデンサ
KR102508526B1 (ko) 2016-08-24 2023-03-09 삼성전자주식회사 반도체 패키지 제조 방법
WO2018092529A1 (ja) 2016-11-16 2018-05-24 株式会社村田製作所 高周波モジュール
WO2019181590A1 (ja) * 2018-03-23 2019-09-26 株式会社村田製作所 高周波モジュールおよび通信装置
DE212019000227U1 (de) * 2018-03-23 2020-11-02 Murata Manufacturing Co., Ltd. Hochfrequenzmodul und Kommunikationsgerät
CN109390242B (zh) * 2018-09-27 2020-04-28 日月光半导体（威海）有限公司 一种功率器件封装结构及其制备方法
JP2021106341A (ja) * 2019-12-26 2021-07-26 株式会社村田製作所 高周波モジュールおよび通信装置
CN219066804U (zh) 2020-06-10 2023-05-23 株式会社村田制作所 模块
WO2021251160A1 (ja) 2020-06-10 2021-12-16 株式会社村田製作所 モジュールおよび部品
WO2023139979A1 (ja) * 2022-01-20 2023-07-27 株式会社村田製作所 高周波モジュール、高周波モジュールの製造方法、及び、通信装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2565300B2 (ja) * 1994-05-31 1996-12-18 日本電気株式会社 半導体装置
JP3241669B2 (ja) 1998-11-09 2001-12-25 埼玉日本電気株式会社 Ｉｃパッケージの補強構造
JP2001210737A (ja) * 2000-01-27 2001-08-03 Tdk Corp 半導体チップパッケージおよびその製造方法
JP3793421B2 (ja) 2001-04-10 2006-07-05 アルプス電気株式会社 面実装型電子回路ユニット及び面実装型電子回路ユニットの製造方法
US6856007B2 (en) * 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
JP2003100924A (ja) * 2001-09-21 2003-04-04 Kyocera Corp 半導体装置
JP3966172B2 (ja) 2002-12-09 2007-08-29 松下電器産業株式会社 モジュール部品の製造方法
JP2005109306A (ja) * 2003-10-01 2005-04-21 Matsushita Electric Ind Co Ltd 電子部品パッケージおよびその製造方法
JP2005183430A (ja) 2003-12-16 2005-07-07 Matsushita Electric Ind Co Ltd 電子部品内蔵モジュール
CN101996962B (zh) * 2004-10-28 2013-01-16 京瓷株式会社 电子部件模块以及无线通信设备
JP2006196857A (ja) 2004-12-16 2006-07-27 Murata Mfg Co Ltd ケース付き複合回路基板及びその製造方法
JP2006351952A (ja) 2005-06-17 2006-12-28 Nec Electronics Corp 半導体装置
JP2007207802A (ja) * 2006-01-31 2007-08-16 Sharp Corp 電子回路モジュールとその製造方法
JP2008251608A (ja) * 2007-03-29 2008-10-16 Casio Comput Co Ltd 半導体装置およびその製造方法
US20100103634A1 (en) * 2007-03-30 2010-04-29 Takuo Funaya Functional-device-embedded circuit board, method for manufacturing the same, and electronic equipment
JP2009033114A (ja) 2007-06-29 2009-02-12 Tdk Corp 電子モジュール、及び電子モジュールの製造方法
EP2009692A1 (en) * 2007-06-29 2008-12-31 TDK Corporation Electronic module and fabrication method thereof
US20090315156A1 (en) * 2008-06-20 2009-12-24 Harper Peter R Packaged integrated circuit having conformal electromagnetic shields and methods to form the same
JP2008288610A (ja) * 2008-07-17 2008-11-27 Taiyo Yuden Co Ltd 回路モジュールの製造方法
JP2011198866A (ja) * 2010-03-18 2011-10-06 Renesas Electronics Corp 半導体装置およびその製造方法

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