JP2010093241A5 - - Google Patents
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- Publication number
- JP2010093241A5 JP2010093241A5 JP2009207362A JP2009207362A JP2010093241A5 JP 2010093241 A5 JP2010093241 A5 JP 2010093241A5 JP 2009207362 A JP2009207362 A JP 2009207362A JP 2009207362 A JP2009207362 A JP 2009207362A JP 2010093241 A5 JP2010093241 A5 JP 2010093241A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- insulating film
- forming
- glass substrate
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 29
- 239000004065 semiconductor Substances 0.000 claims 19
- 239000011521 glass Substances 0.000 claims 15
- 238000004519 manufacturing process Methods 0.000 claims 9
- 238000000034 method Methods 0.000 claims 9
- 229910052581 Si3N4 Inorganic materials 0.000 claims 4
- 230000002093 peripheral effect Effects 0.000 claims 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 4
- 150000002500 ions Chemical class 0.000 claims 3
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 3
- 229910052721 tungsten Inorganic materials 0.000 claims 3
- 239000010937 tungsten Substances 0.000 claims 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009207362A JP5478166B2 (ja) | 2008-09-11 | 2009-09-08 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008233270 | 2008-09-11 | ||
| JP2008233270 | 2008-09-11 | ||
| JP2009207362A JP5478166B2 (ja) | 2008-09-11 | 2009-09-08 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010093241A JP2010093241A (ja) | 2010-04-22 |
| JP2010093241A5 true JP2010093241A5 (enExample) | 2012-09-06 |
| JP5478166B2 JP5478166B2 (ja) | 2014-04-23 |
Family
ID=41799647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009207362A Expired - Fee Related JP5478166B2 (ja) | 2008-09-11 | 2009-09-08 | 半導体装置の作製方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8415228B2 (enExample) |
| JP (1) | JP5478166B2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120042365A (ko) * | 2010-10-25 | 2012-05-03 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
| TWI570809B (zh) * | 2011-01-12 | 2017-02-11 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| JPWO2012124281A1 (ja) * | 2011-03-11 | 2014-07-17 | シャープ株式会社 | 薄膜トランジスタ基板の製造方法およびその方法により製造された薄膜トランジスタ基板、表示装置 |
| JP6032963B2 (ja) * | 2012-06-20 | 2016-11-30 | キヤノン株式会社 | Ｓｏｉ基板、ｓｏｉ基板の製造方法および半導体装置の製造方法 |
| US8717202B1 (en) | 2013-03-14 | 2014-05-06 | Aimpad, LLC | Force sensitive input devices and methods |
| CN103928499A (zh) * | 2014-04-22 | 2014-07-16 | 西安神光皓瑞光电科技有限公司 | 一种缓冲型衬底结构及其上的侧向外延生长方法 |
| TWI755773B (zh) | 2014-06-30 | 2022-02-21 | 日商半導體能源研究所股份有限公司 | 發光裝置，模組，及電子裝置 |
| JP6784031B2 (ja) | 2016-02-15 | 2020-11-11 | セイコーエプソン株式会社 | 電気光学装置、電気光学装置の製造方法、および電子機器 |
| US10515905B1 (en) * | 2018-06-18 | 2019-12-24 | Raytheon Company | Semiconductor device with anti-deflection layers |
| US11061482B2 (en) | 2019-01-04 | 2021-07-13 | Aimpad, LLC | Force sensitive input devices and methods |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2061796C (en) * | 1991-03-28 | 2002-12-24 | Kalluri R. Sarma | High mobility integrated drivers for active matrix displays |
| US6146970A (en) * | 1998-05-26 | 2000-11-14 | Motorola Inc. | Capped shallow trench isolation and method of formation |
| JP2000012864A (ja) * | 1998-06-22 | 2000-01-14 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| JP4476390B2 (ja) * | 1998-09-04 | 2010-06-09 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US7235810B1 (en) * | 1998-12-03 | 2007-06-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of fabricating the same |
| US7245018B1 (en) * | 1999-06-22 | 2007-07-17 | Semiconductor Energy Laboratory Co., Ltd. | Wiring material, semiconductor device provided with a wiring using the wiring material and method of manufacturing thereof |
| EP1170801B1 (en) * | 1999-10-14 | 2006-07-26 | Shin-Etsu Handotai Company Limited | Bonded wafer producing method |
| JP4776752B2 (ja) * | 2000-04-19 | 2011-09-21 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP4831885B2 (ja) * | 2001-04-27 | 2011-12-07 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US7119365B2 (en) * | 2002-03-26 | 2006-10-10 | Sharp Kabushiki Kaisha | Semiconductor device and manufacturing method thereof, SOI substrate and display device using the same, and manufacturing method of the SOI substrate |
| JP4772258B2 (ja) | 2002-08-23 | 2011-09-14 | シャープ株式会社 | Ｓｏｉ基板の製造方法 |
| US6949451B2 (en) * | 2003-03-10 | 2005-09-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | SOI chip with recess-resistant buried insulator and method of manufacturing the same |
| JP2004281878A (ja) | 2003-03-18 | 2004-10-07 | Seiko Epson Corp | 半導体基板の製造方法及びこれにより製造される半導体基板、電気光学装置並びに電子機器 |
| JP2005044864A (ja) * | 2003-07-23 | 2005-02-17 | Seiko Epson Corp | 複合半導体基板の製造方法、複合半導体基板、デバイスの製造方法、デバイス、電気光学装置並びに電子機器 |
| US7402520B2 (en) * | 2004-11-26 | 2008-07-22 | Applied Materials, Inc. | Edge removal of silicon-on-insulator transfer wafer |
| JP4963175B2 (ja) * | 2005-11-21 | 2012-06-27 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法、半導体装置、及び電子機器 |
| JP2007317988A (ja) * | 2006-05-29 | 2007-12-06 | Shin Etsu Handotai Co Ltd | 貼り合わせウエーハの製造方法 |
| US7755113B2 (en) * | 2007-03-16 | 2010-07-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, semiconductor display device, and manufacturing method of semiconductor device |
| WO2008123116A1 (en) * | 2007-03-26 | 2008-10-16 | Semiconductor Energy Laboratory Co., Ltd. | Soi substrate and method for manufacturing soi substrate |
| US7846817B2 (en) * | 2007-03-26 | 2010-12-07 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP2007201502A (ja) * | 2007-04-20 | 2007-08-09 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| FR2920912B1 (fr) * | 2007-09-12 | 2010-08-27 | S O I Tec Silicon On Insulator Tech | Procede de fabrication d'une structure par transfert de couche |
-
2009
- 2009-09-08 JP JP2009207362A patent/JP5478166B2/ja not_active Expired - Fee Related
- 2009-09-09 US US12/555,825 patent/US8415228B2/en not_active Expired - Fee Related
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