JP2012216452A5 - - Google Patents

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Publication number
JP2012216452A5
JP2012216452A5 JP2011081553A JP2011081553A JP2012216452A5 JP 2012216452 A5 JP2012216452 A5 JP 2012216452A5 JP 2011081553 A JP2011081553 A JP 2011081553A JP 2011081553 A JP2011081553 A JP 2011081553A JP 2012216452 A5 JP2012216452 A5 JP 2012216452A5
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JP
Japan
Prior art keywords
film
semiconductor device
optical semiconductor
emitting layer
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011081553A
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English (en)
Japanese (ja)
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JP2012216452A (ja
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Publication date
Application filed filed Critical
Priority to JP2011081553A priority Critical patent/JP2012216452A/ja
Priority claimed from JP2011081553A external-priority patent/JP2012216452A/ja
Priority to TW101109488A priority patent/TW201301606A/zh
Priority to KR1020120029220A priority patent/KR101366449B1/ko
Priority to US13/432,678 priority patent/US20120248422A1/en
Priority to CN2012100974368A priority patent/CN102738408A/zh
Publication of JP2012216452A publication Critical patent/JP2012216452A/ja
Publication of JP2012216452A5 publication Critical patent/JP2012216452A5/ja
Pending legal-status Critical Current

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JP2011081553A 2011-04-01 2011-04-01 光半導体装置およびその製造方法 Pending JP2012216452A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011081553A JP2012216452A (ja) 2011-04-01 2011-04-01 光半導体装置およびその製造方法
TW101109488A TW201301606A (zh) 2011-04-01 2012-03-20 光半導體裝置及該製造方法
KR1020120029220A KR101366449B1 (ko) 2011-04-01 2012-03-22 광 반도체 장치 및 그 제조 방법
US13/432,678 US20120248422A1 (en) 2011-04-01 2012-03-28 Optical semiconductor device and manufacturing method thereof
CN2012100974368A CN102738408A (zh) 2011-04-01 2012-03-30 光半导体装置及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011081553A JP2012216452A (ja) 2011-04-01 2011-04-01 光半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2012216452A JP2012216452A (ja) 2012-11-08
JP2012216452A5 true JP2012216452A5 (enExample) 2014-02-13

Family

ID=46926025

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011081553A Pending JP2012216452A (ja) 2011-04-01 2011-04-01 光半導体装置およびその製造方法

Country Status (5)

Country Link
US (1) US20120248422A1 (enExample)
JP (1) JP2012216452A (enExample)
KR (1) KR101366449B1 (enExample)
CN (1) CN102738408A (enExample)
TW (1) TW201301606A (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8921842B2 (en) * 2012-11-14 2014-12-30 Lg Display Co., Ltd. Organic light emitting display device and method of manufacturing the same
KR101410102B1 (ko) * 2012-11-20 2014-06-27 삼성디스플레이 주식회사 유기발광 표시장치
US9692010B2 (en) 2012-11-20 2017-06-27 Samsung Display Co., Ltd. Organic light emitting display device
KR101502206B1 (ko) 2012-11-20 2015-03-12 삼성디스플레이 주식회사 발광효율이 향상된 유기발광 표시장치
US9349988B2 (en) 2012-11-20 2016-05-24 Samsung Display Co., Ltd. Organic light emitting display device
KR102092557B1 (ko) * 2012-12-12 2020-03-24 엘지디스플레이 주식회사 유기 발광 장치 및 유기 발광 장치 제조 방법
JP6054763B2 (ja) 2013-02-12 2016-12-27 株式会社ジャパンディスプレイ 有機ｅｌ表示装置
TWI578592B (zh) * 2013-03-12 2017-04-11 應用材料股份有限公司 有機發光二極體元件及包括其之封裝結構的沉積方法
CN105720207B (zh) * 2013-06-29 2017-09-15 艾克斯特朗欧洲公司 用于高性能涂层的沉积的方法以及封装的电子器件
US20150014663A1 (en) * 2013-07-11 2015-01-15 Korea Institute Of Science And Technology Organic light emitting display apparatus and the method for manufacturing the same
KR101588298B1 (ko) * 2013-07-11 2016-02-12 한국과학기술연구원 유기 발광 표시 장치 및 이의 제조 방법
KR102136790B1 (ko) * 2013-11-15 2020-07-23 삼성디스플레이 주식회사 플렉서블 디스플레이 장치와, 이의 제조 방법
DE102014102565B4 (de) * 2014-02-27 2019-10-24 Osram Oled Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
KR102203910B1 (ko) * 2014-10-22 2021-01-14 엘지디스플레이 주식회사 롤러블 유기 발광 표시 장치
WO2016024742A1 (en) 2014-08-09 2016-02-18 LG Display Co.,Ltd. Rollable organic light emitting diode display device
KR20160036722A (ko) * 2014-09-25 2016-04-05 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
CN105679787B (zh) * 2014-11-18 2018-09-25 群创光电股份有限公司 有机发光二极管显示装置及其制造方法
TWI595692B (zh) * 2014-11-18 2017-08-11 群創光電股份有限公司 有機發光二極體顯示裝置及其製造方法
KR102392604B1 (ko) * 2014-12-05 2022-04-28 엘지디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
US9450203B2 (en) 2014-12-22 2016-09-20 Apple Inc. Organic light-emitting diode display with glass encapsulation and peripheral welded plastic seal
CN104752441B (zh) * 2015-03-20 2018-03-16 京东方科技集团股份有限公司 一种阵列基板及其制备方法、显示面板和显示装置
KR102330331B1 (ko) * 2015-07-17 2021-11-25 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
JP2017105013A (ja) * 2015-12-08 2017-06-15 株式会社リコー ガスバリア性積層体、半導体装置、表示素子、表示装置、システム
DE102016109485B4 (de) * 2016-05-24 2025-12-04 Pictiva Displays International Limited Verfahren zum herstellen eines optoelektronischen bauelements, optoelektronisches bauelement und schutzschicht
WO2018085715A2 (en) * 2016-11-06 2018-05-11 Orbotech LT Solar, LLC. Method and apparatus for encapsulation of an organic light emitting diode
CN109427992B (zh) * 2017-08-28 2019-10-18 昆山国显光电有限公司 薄膜封装结构及具有其的显示装置
JP6663400B2 (ja) * 2017-09-11 2020-03-11 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置およびプログラム
US10134709B1 (en) * 2017-12-21 2018-11-20 Industrial Technology Research Institute Substrateless light emitting diode (LED) package for size shrinking and increased resolution of display device
KR102659437B1 (ko) * 2018-07-24 2024-04-23 삼성디스플레이 주식회사 디스플레이 장치 제조 방법 및 디스플레이 장치 제조 시스템
CN208722925U (zh) * 2018-08-16 2019-04-09 京东方科技集团股份有限公司 一种显示器件的封装结构、显示装置
CN109326738B (zh) 2018-09-30 2020-02-11 云谷（固安）科技有限公司 显示面板、显示装置及显示面板的制造方法
KR102343148B1 (ko) * 2019-04-29 2021-12-27 삼성디스플레이 주식회사 디스플레이 장치 및 그 제조방법
CN114365263A (zh) * 2019-09-10 2022-04-15 应用材料公司 用于显示封装应用的高密度等离子体cvd
US12439744B2 (en) * 2019-12-23 2025-10-07 Ams-Osram Ag Semiconductor device with a bond pad and a sandwich passivation layer and manufacturing method thereof

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4171258B2 (ja) * 2002-07-25 2008-10-22 三洋電機株式会社 有機ｅｌパネル
JP4138672B2 (ja) * 2003-03-27 2008-08-27 セイコーエプソン株式会社 電気光学装置の製造方法
US20080171184A9 (en) * 2003-04-17 2008-07-17 Minoru Komada Barrier film and laminated material, container for wrapping and image display medium using the saw, and manufacturing method for barrier film
JP2005267984A (ja) * 2004-03-17 2005-09-29 Sanyo Electric Co Ltd 有機ｅｌ表示装置
JP4631683B2 (ja) * 2005-01-17 2011-02-16 セイコーエプソン株式会社 発光装置、及び電子機器
JP4763400B2 (ja) * 2005-09-22 2011-08-31 株式会社巴川製紙所 粘土薄膜基板、電極付き粘土薄膜基板、及びそれらを用いた表示素子
JP4600254B2 (ja) * 2005-11-22 2010-12-15 セイコーエプソン株式会社 発光装置および電子機器
ES2624177T3 (es) * 2006-07-07 2017-07-13 University Of Miami Plataformas de cultivo celular potenciadas en oxigeno
JP2008153004A (ja) * 2006-12-15 2008-07-03 Konica Minolta Holdings Inc 有機エレクトロルミネッセンス素子
JP2008288012A (ja) * 2007-05-17 2008-11-27 Seiko Epson Corp エレクトロルミネッセンス装置とその製造方法
CN101697343B (zh) * 2009-10-27 2011-06-15 苏州纳科显示技术有限公司 一种薄膜封装方法
US20110244128A1 (en) * 2010-03-31 2011-10-06 Tokyo Electron Limited Flow plate utilization in filament assisted chemical vapor deposition
US9299956B2 (en) * 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices

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