JP2012216452A - 光半導体装置およびその製造方法 - Google Patents

光半導体装置およびその製造方法 Download PDF

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Publication number
JP2012216452A
JP2012216452A JP2011081553A JP2011081553A JP2012216452A JP 2012216452 A JP2012216452 A JP 2012216452A JP 2011081553 A JP2011081553 A JP 2011081553A JP 2011081553 A JP2011081553 A JP 2011081553A JP 2012216452 A JP2012216452 A JP 2012216452A
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JP
Japan
Prior art keywords
film
organic
semiconductor device
optical semiconductor
vacuum ultraviolet
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Pending
Application number
JP2011081553A
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English (en)
Japanese (ja)
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JP2012216452A5 (enExample
Inventor
Toshiyuki Mine
利之 峰
Masashige Fujimori
正成 藤森
Tadashi Ohashi
直史 大橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Kokusai Denki Electric Inc
Original Assignee
Hitachi High Technologies Corp
Hitachi Kokusai Electric Inc
Hitachi High Tech Corp
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Filing date
Publication date
Application filed by Hitachi High Technologies Corp, Hitachi Kokusai Electric Inc, Hitachi High Tech Corp filed Critical Hitachi High Technologies Corp
Priority to JP2011081553A priority Critical patent/JP2012216452A/ja
Priority to TW101109488A priority patent/TW201301606A/zh
Priority to KR1020120029220A priority patent/KR101366449B1/ko
Priority to US13/432,678 priority patent/US20120248422A1/en
Priority to CN2012100974368A priority patent/CN102738408A/zh
Publication of JP2012216452A publication Critical patent/JP2012216452A/ja
Publication of JP2012216452A5 publication Critical patent/JP2012216452A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
JP2011081553A 2011-04-01 2011-04-01 光半導体装置およびその製造方法 Pending JP2012216452A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011081553A JP2012216452A (ja) 2011-04-01 2011-04-01 光半導体装置およびその製造方法
TW101109488A TW201301606A (zh) 2011-04-01 2012-03-20 光半導體裝置及該製造方法
KR1020120029220A KR101366449B1 (ko) 2011-04-01 2012-03-22 광 반도체 장치 및 그 제조 방법
US13/432,678 US20120248422A1 (en) 2011-04-01 2012-03-28 Optical semiconductor device and manufacturing method thereof
CN2012100974368A CN102738408A (zh) 2011-04-01 2012-03-30 光半导体装置及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011081553A JP2012216452A (ja) 2011-04-01 2011-04-01 光半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2012216452A true JP2012216452A (ja) 2012-11-08
JP2012216452A5 JP2012216452A5 (enExample) 2014-02-13

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Family Applications (1)

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JP2011081553A Pending JP2012216452A (ja) 2011-04-01 2011-04-01 光半導体装置およびその製造方法

Country Status (5)

Country Link
US (1) US20120248422A1 (enExample)
JP (1) JP2012216452A (enExample)
KR (1) KR101366449B1 (enExample)
CN (1) CN102738408A (enExample)
TW (1) TW201301606A (enExample)

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JP2016512651A (ja) * 2013-03-12 2016-04-28 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 薄膜封止用ｎ２ｏ希釈プロセスによるバリア膜性能の向上
KR20160068336A (ko) * 2014-12-05 2016-06-15 엘지디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
JP2020505727A (ja) * 2017-08-28 2020-02-20 クンシャン ゴー−ビシオノクス オプト−エレクトロニクス カンパニー リミテッドＫｕｎｓｈａｎ Ｇｏ−Ｖｉｓｉｏｎｏｘ Ｏｐｔｏ−Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．， Ｌｔｄ． 薄膜封止構造、製造方法及び当該構造の表示装置
JP2021533521A (ja) * 2018-08-16 2021-12-02 京東方科技集團股▲ふん▼有限公司Boe Technology Group Co., Ltd. 表示素子の封止構造及び表示装置

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US8921842B2 (en) * 2012-11-14 2014-12-30 Lg Display Co., Ltd. Organic light emitting display device and method of manufacturing the same
KR101410102B1 (ko) * 2012-11-20 2014-06-27 삼성디스플레이 주식회사 유기발광 표시장치
US9692010B2 (en) 2012-11-20 2017-06-27 Samsung Display Co., Ltd. Organic light emitting display device
KR101502206B1 (ko) 2012-11-20 2015-03-12 삼성디스플레이 주식회사 발광효율이 향상된 유기발광 표시장치
US9349988B2 (en) 2012-11-20 2016-05-24 Samsung Display Co., Ltd. Organic light emitting display device
KR102092557B1 (ko) * 2012-12-12 2020-03-24 엘지디스플레이 주식회사 유기 발광 장치 및 유기 발광 장치 제조 방법
JP6054763B2 (ja) 2013-02-12 2016-12-27 株式会社ジャパンディスプレイ 有機ｅｌ表示装置
CN105720207B (zh) * 2013-06-29 2017-09-15 艾克斯特朗欧洲公司 用于高性能涂层的沉积的方法以及封装的电子器件
US20150014663A1 (en) * 2013-07-11 2015-01-15 Korea Institute Of Science And Technology Organic light emitting display apparatus and the method for manufacturing the same
KR101588298B1 (ko) * 2013-07-11 2016-02-12 한국과학기술연구원 유기 발광 표시 장치 및 이의 제조 방법
KR102136790B1 (ko) * 2013-11-15 2020-07-23 삼성디스플레이 주식회사 플렉서블 디스플레이 장치와, 이의 제조 방법
DE102014102565B4 (de) * 2014-02-27 2019-10-24 Osram Oled Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
KR102203910B1 (ko) * 2014-10-22 2021-01-14 엘지디스플레이 주식회사 롤러블 유기 발광 표시 장치
WO2016024742A1 (en) 2014-08-09 2016-02-18 LG Display Co.,Ltd. Rollable organic light emitting diode display device
KR20160036722A (ko) * 2014-09-25 2016-04-05 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
CN105679787B (zh) * 2014-11-18 2018-09-25 群创光电股份有限公司 有机发光二极管显示装置及其制造方法
TWI595692B (zh) * 2014-11-18 2017-08-11 群創光電股份有限公司 有機發光二極體顯示裝置及其製造方法
US9450203B2 (en) 2014-12-22 2016-09-20 Apple Inc. Organic light-emitting diode display with glass encapsulation and peripheral welded plastic seal
CN104752441B (zh) * 2015-03-20 2018-03-16 京东方科技集团股份有限公司 一种阵列基板及其制备方法、显示面板和显示装置
KR102330331B1 (ko) * 2015-07-17 2021-11-25 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
JP2017105013A (ja) * 2015-12-08 2017-06-15 株式会社リコー ガスバリア性積層体、半導体装置、表示素子、表示装置、システム
DE102016109485B4 (de) * 2016-05-24 2025-12-04 Pictiva Displays International Limited Verfahren zum herstellen eines optoelektronischen bauelements, optoelektronisches bauelement und schutzschicht
WO2018085715A2 (en) * 2016-11-06 2018-05-11 Orbotech LT Solar, LLC. Method and apparatus for encapsulation of an organic light emitting diode
JP6663400B2 (ja) * 2017-09-11 2020-03-11 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置およびプログラム
US10134709B1 (en) * 2017-12-21 2018-11-20 Industrial Technology Research Institute Substrateless light emitting diode (LED) package for size shrinking and increased resolution of display device
KR102659437B1 (ko) * 2018-07-24 2024-04-23 삼성디스플레이 주식회사 디스플레이 장치 제조 방법 및 디스플레이 장치 제조 시스템
CN109326738B (zh) 2018-09-30 2020-02-11 云谷（固安）科技有限公司 显示面板、显示装置及显示面板的制造方法
KR102343148B1 (ko) * 2019-04-29 2021-12-27 삼성디스플레이 주식회사 디스플레이 장치 및 그 제조방법
CN114365263A (zh) * 2019-09-10 2022-04-15 应用材料公司 用于显示封装应用的高密度等离子体cvd
US12439744B2 (en) * 2019-12-23 2025-10-07 Ams-Osram Ag Semiconductor device with a bond pad and a sandwich passivation layer and manufacturing method thereof

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Cited By (6)

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Publication number Priority date Publication date Assignee Title
JP2016512651A (ja) * 2013-03-12 2016-04-28 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 薄膜封止用ｎ２ｏ希釈プロセスによるバリア膜性能の向上
KR20160068336A (ko) * 2014-12-05 2016-06-15 엘지디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
KR102392604B1 (ko) * 2014-12-05 2022-04-28 엘지디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
JP2020505727A (ja) * 2017-08-28 2020-02-20 クンシャン ゴー−ビシオノクス オプト−エレクトロニクス カンパニー リミテッドＫｕｎｓｈａｎ Ｇｏ−Ｖｉｓｉｏｎｏｘ Ｏｐｔｏ−Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．， Ｌｔｄ． 薄膜封止構造、製造方法及び当該構造の表示装置
US11251402B2 (en) 2017-08-28 2022-02-15 Kunshan Go-Visionox Opto-Electronics Co., Ltd. Thin-film encapsulation structures, manufacturing methods, and display apparatus therewith
JP2021533521A (ja) * 2018-08-16 2021-12-02 京東方科技集團股▲ふん▼有限公司Boe Technology Group Co., Ltd. 表示素子の封止構造及び表示装置

Also Published As

Publication number Publication date
US20120248422A1 (en) 2012-10-04
TW201301606A (zh) 2013-01-01
CN102738408A (zh) 2012-10-17
KR20120112056A (ko) 2012-10-11
KR101366449B1 (ko) 2014-02-25

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