CN102738408A - 光半导体装置及其制造方法 - Google Patents

光半导体装置及其制造方法 Download PDF

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Publication number
CN102738408A
CN102738408A CN2012100974368A CN201210097436A CN102738408A CN 102738408 A CN102738408 A CN 102738408A CN 2012100974368 A CN2012100974368 A CN 2012100974368A CN 201210097436 A CN201210097436 A CN 201210097436A CN 102738408 A CN102738408 A CN 102738408A
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CN
China
Prior art keywords
film
semiconductor device
organic
optical semiconductor
vacuum ultraviolet
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CN2012100974368A
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English (en)
Chinese (zh)
Inventor
峰利之
藤森正成
大桥直史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Kokusai Denki Electric Inc
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Hitachi Ltd
Hitachi Kokusai Electric Inc
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Application filed by Hitachi Ltd, Hitachi Kokusai Electric Inc filed Critical Hitachi Ltd
Publication of CN102738408A publication Critical patent/CN102738408A/zh
Pending legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • H10K50/8445Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/85Arrangements for extracting light from the devices
    • H10K50/858Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60Forming conductive regions or layers, e.g. electrodes

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
CN2012100974368A 2011-04-01 2012-03-30 光半导体装置及其制造方法 Pending CN102738408A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-081553 2011-04-01
JP2011081553A JP2012216452A (ja) 2011-04-01 2011-04-01 光半導体装置およびその製造方法

Publications (1)

Publication Number Publication Date
CN102738408A true CN102738408A (zh) 2012-10-17

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CN2012100974368A Pending CN102738408A (zh) 2011-04-01 2012-03-30 光半导体装置及其制造方法

Country Status (5)

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US (1) US20120248422A1 (enExample)
JP (1) JP2012216452A (enExample)
KR (1) KR101366449B1 (enExample)
CN (1) CN102738408A (enExample)
TW (1) TW201301606A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103811525A (zh) * 2012-11-14 2014-05-21 乐金显示有限公司 有机发光显示设备及制造该有机发光显示设备的方法
CN104659054A (zh) * 2013-11-15 2015-05-27 三星显示有限公司 柔性显示设备及其制造方法
CN104752441A (zh) * 2015-03-20 2015-07-01 京东方科技集团股份有限公司 一种阵列基板及其制备方法、显示面板和显示装置
CN105679787A (zh) * 2014-11-18 2016-06-15 群创光电股份有限公司 有机发光二极管显示装置及其制造方法
CN106575664A (zh) * 2014-08-09 2017-04-19 乐金显示有限公司 可卷曲有机发光二极管显示装置
CN109326738A (zh) * 2018-09-30 2019-02-12 云谷(固安)科技有限公司 显示面板、显示装置及显示面板的制造方法
CN110783495A (zh) * 2018-07-24 2020-02-11 三星显示有限公司 显示装置制造方法及显示装置制造系统
CN111863883A (zh) * 2019-04-29 2020-10-30 三星显示有限公司 显示装置及其制造方法

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101410102B1 (ko) * 2012-11-20 2014-06-27 삼성디스플레이 주식회사 유기발광 표시장치
US9692010B2 (en) 2012-11-20 2017-06-27 Samsung Display Co., Ltd. Organic light emitting display device
KR101502206B1 (ko) 2012-11-20 2015-03-12 삼성디스플레이 주식회사 발광효율이 향상된 유기발광 표시장치
US9349988B2 (en) 2012-11-20 2016-05-24 Samsung Display Co., Ltd. Organic light emitting display device
KR102092557B1 (ko) * 2012-12-12 2020-03-24 엘지디스플레이 주식회사 유기 발광 장치 및 유기 발광 장치 제조 방법
JP6054763B2 (ja) 2013-02-12 2016-12-27 株式会社ジャパンディスプレイ 有機el表示装置
TWI578592B (zh) * 2013-03-12 2017-04-11 應用材料股份有限公司 有機發光二極體元件及包括其之封裝結構的沉積方法
CN105720207B (zh) * 2013-06-29 2017-09-15 艾克斯特朗欧洲公司 用于高性能涂层的沉积的方法以及封装的电子器件
US20150014663A1 (en) * 2013-07-11 2015-01-15 Korea Institute Of Science And Technology Organic light emitting display apparatus and the method for manufacturing the same
KR101588298B1 (ko) * 2013-07-11 2016-02-12 한국과학기술연구원 유기 발광 표시 장치 및 이의 제조 방법
DE102014102565B4 (de) * 2014-02-27 2019-10-24 Osram Oled Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
KR102203910B1 (ko) * 2014-10-22 2021-01-14 엘지디스플레이 주식회사 롤러블 유기 발광 표시 장치
KR20160036722A (ko) * 2014-09-25 2016-04-05 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
TWI595692B (zh) * 2014-11-18 2017-08-11 群創光電股份有限公司 有機發光二極體顯示裝置及其製造方法
KR102392604B1 (ko) * 2014-12-05 2022-04-28 엘지디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
US9450203B2 (en) 2014-12-22 2016-09-20 Apple Inc. Organic light-emitting diode display with glass encapsulation and peripheral welded plastic seal
KR102330331B1 (ko) * 2015-07-17 2021-11-25 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
JP2017105013A (ja) * 2015-12-08 2017-06-15 株式会社リコー ガスバリア性積層体、半導体装置、表示素子、表示装置、システム
DE102016109485B4 (de) * 2016-05-24 2025-12-04 Pictiva Displays International Limited Verfahren zum herstellen eines optoelektronischen bauelements, optoelektronisches bauelement und schutzschicht
WO2018085715A2 (en) * 2016-11-06 2018-05-11 Orbotech LT Solar, LLC. Method and apparatus for encapsulation of an organic light emitting diode
CN109427992B (zh) * 2017-08-28 2019-10-18 昆山国显光电有限公司 薄膜封装结构及具有其的显示装置
JP6663400B2 (ja) * 2017-09-11 2020-03-11 株式会社Kokusai Electric 半導体装置の製造方法、基板処理装置およびプログラム
US10134709B1 (en) * 2017-12-21 2018-11-20 Industrial Technology Research Institute Substrateless light emitting diode (LED) package for size shrinking and increased resolution of display device
CN208722925U (zh) * 2018-08-16 2019-04-09 京东方科技集团股份有限公司 一种显示器件的封装结构、显示装置
CN114365263A (zh) * 2019-09-10 2022-04-15 应用材料公司 用于显示封装应用的高密度等离子体cvd
US12439744B2 (en) * 2019-12-23 2025-10-07 Ams-Osram Ag Semiconductor device with a bond pad and a sandwich passivation layer and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080026198A1 (en) * 2003-04-17 2008-01-31 Minoru Komada Barrier film and laminated material, container for wrapping and image display medium using the saw, and manufacturing method for barrier film
US20080284331A1 (en) * 2007-05-17 2008-11-20 Seiko Epson Corporation Electro-luminescence device and method of manufacturing electro-luminescence device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4171258B2 (ja) * 2002-07-25 2008-10-22 三洋電機株式会社 有機elパネル
JP4138672B2 (ja) * 2003-03-27 2008-08-27 セイコーエプソン株式会社 電気光学装置の製造方法
JP2005267984A (ja) * 2004-03-17 2005-09-29 Sanyo Electric Co Ltd 有機el表示装置
JP4631683B2 (ja) * 2005-01-17 2011-02-16 セイコーエプソン株式会社 発光装置、及び電子機器
JP4763400B2 (ja) * 2005-09-22 2011-08-31 株式会社巴川製紙所 粘土薄膜基板、電極付き粘土薄膜基板、及びそれらを用いた表示素子
JP4600254B2 (ja) * 2005-11-22 2010-12-15 セイコーエプソン株式会社 発光装置および電子機器
ES2624177T3 (es) * 2006-07-07 2017-07-13 University Of Miami Plataformas de cultivo celular potenciadas en oxigeno
JP2008153004A (ja) * 2006-12-15 2008-07-03 Konica Minolta Holdings Inc 有機エレクトロルミネッセンス素子
CN101697343B (zh) * 2009-10-27 2011-06-15 苏州纳科显示技术有限公司 一种薄膜封装方法
US20110244128A1 (en) * 2010-03-31 2011-10-06 Tokyo Electron Limited Flow plate utilization in filament assisted chemical vapor deposition
US9299956B2 (en) * 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080026198A1 (en) * 2003-04-17 2008-01-31 Minoru Komada Barrier film and laminated material, container for wrapping and image display medium using the saw, and manufacturing method for barrier film
US20080284331A1 (en) * 2007-05-17 2008-11-20 Seiko Epson Corporation Electro-luminescence device and method of manufacturing electro-luminescence device

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103811525A (zh) * 2012-11-14 2014-05-21 乐金显示有限公司 有机发光显示设备及制造该有机发光显示设备的方法
CN103811525B (zh) * 2012-11-14 2016-12-28 乐金显示有限公司 有机发光显示设备及制造该有机发光显示设备的方法
US9570517B2 (en) 2012-11-14 2017-02-14 Lg Display Co., Ltd. Organic light emitting display device and method of manufacturing the same
CN104659054A (zh) * 2013-11-15 2015-05-27 三星显示有限公司 柔性显示设备及其制造方法
CN106575664B (zh) * 2014-08-09 2019-09-10 乐金显示有限公司 可卷曲有机发光二极管显示装置
US10186681B2 (en) 2014-08-09 2019-01-22 Lg Display Co., Ltd. Rollable organic light emitting diode display device
CN106575664A (zh) * 2014-08-09 2017-04-19 乐金显示有限公司 可卷曲有机发光二极管显示装置
CN105679787B (zh) * 2014-11-18 2018-09-25 群创光电股份有限公司 有机发光二极管显示装置及其制造方法
CN105679787A (zh) * 2014-11-18 2016-06-15 群创光电股份有限公司 有机发光二极管显示装置及其制造方法
CN104752441B (zh) * 2015-03-20 2018-03-16 京东方科技集团股份有限公司 一种阵列基板及其制备方法、显示面板和显示装置
CN104752441A (zh) * 2015-03-20 2015-07-01 京东方科技集团股份有限公司 一种阵列基板及其制备方法、显示面板和显示装置
CN110783495A (zh) * 2018-07-24 2020-02-11 三星显示有限公司 显示装置制造方法及显示装置制造系统
US12058919B2 (en) 2018-07-24 2024-08-06 Samsung Display Co., Ltd. Display apparatus manufacturing method and display apparatus manufacturing system
CN109326738A (zh) * 2018-09-30 2019-02-12 云谷(固安)科技有限公司 显示面板、显示装置及显示面板的制造方法
CN109326738B (zh) * 2018-09-30 2020-02-11 云谷(固安)科技有限公司 显示面板、显示装置及显示面板的制造方法
US11469398B2 (en) 2018-09-30 2022-10-11 Yungu (Gu'an) Technology Co., Ltd. Display panel, display device and method of manufacturing display panel
CN111863883A (zh) * 2019-04-29 2020-10-30 三星显示有限公司 显示装置及其制造方法

Also Published As

Publication number Publication date
US20120248422A1 (en) 2012-10-04
TW201301606A (zh) 2013-01-01
KR20120112056A (ko) 2012-10-11
KR101366449B1 (ko) 2014-02-25
JP2012216452A (ja) 2012-11-08

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Application publication date: 20121017