JP2009533531A - 低熱変形シリコーン複合体モールド - Google Patents
低熱変形シリコーン複合体モールド Download PDFInfo
- Publication number
- JP2009533531A JP2009533531A JP2009505523A JP2009505523A JP2009533531A JP 2009533531 A JP2009533531 A JP 2009533531A JP 2009505523 A JP2009505523 A JP 2009505523A JP 2009505523 A JP2009505523 A JP 2009505523A JP 2009533531 A JP2009533531 A JP 2009533531A
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- Japan
- Prior art keywords
- silicon
- composition
- curable
- pattern
- elastomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 104
- 239000002131 composite material Substances 0.000 title description 12
- 239000000203 mixture Substances 0.000 claims abstract description 232
- 238000000034 method Methods 0.000 claims abstract description 102
- 239000002657 fibrous material Substances 0.000 claims abstract description 45
- 229920001971 elastomer Polymers 0.000 claims abstract description 30
- 239000000806 elastomer Substances 0.000 claims abstract description 23
- 229920000642 polymer Polymers 0.000 claims abstract description 21
- 239000004971 Cross linker Substances 0.000 claims abstract description 18
- 229920002050 silicone resin Polymers 0.000 claims description 135
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 99
- 229910052710 silicon Inorganic materials 0.000 claims description 93
- 239000010703 silicon Substances 0.000 claims description 93
- 239000003054 catalyst Substances 0.000 claims description 81
- 239000000758 substrate Substances 0.000 claims description 62
- 239000000835 fiber Substances 0.000 claims description 32
- 239000011521 glass Substances 0.000 claims description 18
- 238000000151 deposition Methods 0.000 claims description 16
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 12
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 10
- 229920002554 vinyl polymer Polymers 0.000 claims description 10
- 239000004744 fabric Substances 0.000 claims description 9
- 239000003112 inhibitor Substances 0.000 claims description 9
- 239000003431 cross linking reagent Substances 0.000 claims description 7
- 239000003365 glass fiber Substances 0.000 claims description 5
- 229920001843 polymethylhydrosiloxane Polymers 0.000 claims description 5
- KSLSOBUAIFEGLT-UHFFFAOYSA-N 2-phenylbut-3-yn-2-ol Chemical compound C#CC(O)(C)C1=CC=CC=C1 KSLSOBUAIFEGLT-UHFFFAOYSA-N 0.000 claims description 4
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 221
- 229920005989 resin Polymers 0.000 description 99
- 239000011347 resin Substances 0.000 description 99
- 239000010410 layer Substances 0.000 description 77
- 238000006459 hydrosilylation reaction Methods 0.000 description 75
- 125000003342 alkenyl group Chemical group 0.000 description 71
- -1 polydimethylsiloxane Polymers 0.000 description 71
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 61
- 239000010408 film Substances 0.000 description 59
- 229920002379 silicone rubber Polymers 0.000 description 59
- 229910052751 metal Inorganic materials 0.000 description 52
- 239000002184 metal Substances 0.000 description 52
- 125000001183 hydrocarbyl group Chemical group 0.000 description 43
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 43
- 239000004945 silicone rubber Substances 0.000 description 42
- 238000002174 soft lithography Methods 0.000 description 39
- 150000003961 organosilicon compounds Chemical class 0.000 description 38
- 239000003960 organic solvent Substances 0.000 description 31
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 27
- 125000005375 organosiloxane group Chemical group 0.000 description 25
- 239000000523 sample Substances 0.000 description 24
- 229910004283 SiO 4 Inorganic materials 0.000 description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 20
- 125000001931 aliphatic group Chemical group 0.000 description 19
- 229910004298 SiO 2 Inorganic materials 0.000 description 18
- 230000008901 benefit Effects 0.000 description 17
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 16
- 238000009833 condensation Methods 0.000 description 16
- 230000005494 condensation Effects 0.000 description 16
- 238000001723 curing Methods 0.000 description 16
- 229910052739 hydrogen Inorganic materials 0.000 description 15
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 15
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 15
- 238000006243 chemical reaction Methods 0.000 description 14
- 238000013461 design Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 14
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 description 13
- 239000001257 hydrogen Substances 0.000 description 12
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 11
- 239000004205 dimethyl polysiloxane Substances 0.000 description 11
- 229910052697 platinum Inorganic materials 0.000 description 11
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 9
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- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 238000000059 patterning Methods 0.000 description 8
- 229910000077 silane Inorganic materials 0.000 description 8
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 8
- 229910010271 silicon carbide Inorganic materials 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 150000001282 organosilanes Chemical class 0.000 description 7
- 150000002978 peroxides Chemical class 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- 239000011541 reaction mixture Substances 0.000 description 7
- 239000005060 rubber Substances 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 230000003197 catalytic effect Effects 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 229920000548 poly(silane) polymer Polymers 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 230000035484 reaction time Effects 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 239000002120 nanofilm Substances 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 238000003848 UV Light-Curing Methods 0.000 description 4
- 125000002015 acyclic group Chemical group 0.000 description 4
- 238000007259 addition reaction Methods 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
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- 229910052799 carbon Inorganic materials 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 125000004122 cyclic group Chemical group 0.000 description 4
- 238000007872 degassing Methods 0.000 description 4
- 239000003085 diluting agent Substances 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
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- 125000000524 functional group Chemical group 0.000 description 4
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- 238000003756 stirring Methods 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000005046 Chlorosilane Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 239000004651 Radiation Curable Silicone Substances 0.000 description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000002318 adhesion promoter Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 150000004759 cyclic silanes Chemical class 0.000 description 3
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
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- 229910052736 halogen Inorganic materials 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052741 iridium Inorganic materials 0.000 description 3
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 3
- 238000002356 laser light scattering Methods 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229910052762 osmium Inorganic materials 0.000 description 3
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
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- VEDJZFSRVVQBIL-UHFFFAOYSA-N trisilane Chemical compound [SiH3][SiH2][SiH3] VEDJZFSRVVQBIL-UHFFFAOYSA-N 0.000 description 3
- ZQTYRTSKQFQYPQ-UHFFFAOYSA-N trisiloxane Chemical compound [SiH3]O[SiH2]O[SiH3] ZQTYRTSKQFQYPQ-UHFFFAOYSA-N 0.000 description 3
- KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 2
- VLQZJOLYNOGECD-UHFFFAOYSA-N 2,4,6-trimethyl-1,3,5,2,4,6-trioxatrisilinane Chemical compound C[SiH]1O[SiH](C)O[SiH](C)O1 VLQZJOLYNOGECD-UHFFFAOYSA-N 0.000 description 2
- GVNVAWHJIKLAGL-UHFFFAOYSA-N 2-(cyclohexen-1-yl)cyclohexan-1-one Chemical compound O=C1CCCCC1C1=CCCCC1 GVNVAWHJIKLAGL-UHFFFAOYSA-N 0.000 description 2
- MAYUMUDTQDNZBD-UHFFFAOYSA-N 2-chloroethylsilane Chemical compound [SiH3]CCCl MAYUMUDTQDNZBD-UHFFFAOYSA-N 0.000 description 2
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- LHRBHFVFUACXIJ-UHFFFAOYSA-N C[SiH](C)C1=CC([SiH](C)C)=CC([SiH](C)C)=C1 Chemical compound C[SiH](C)C1=CC([SiH](C)C)=CC([SiH](C)C)=C1 LHRBHFVFUACXIJ-UHFFFAOYSA-N 0.000 description 2
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- 238000001157 Fourier transform infrared spectrum Methods 0.000 description 2
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- YKSADNUOSVJOAS-UHFFFAOYSA-N [bis[(dimethyl-$l^{3}-silanyl)oxy]-phenylsilyl]oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](O[Si](C)C)(O[Si](C)C)C1=CC=CC=C1 YKSADNUOSVJOAS-UHFFFAOYSA-N 0.000 description 2
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- SCTQCPWFWDWNTC-UHFFFAOYSA-N diphenylsilyloxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[SiH](C=1C=CC=CC=1)O[SiH](C=1C=CC=CC=1)C1=CC=CC=C1 SCTQCPWFWDWNTC-UHFFFAOYSA-N 0.000 description 2
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- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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Abstract
Description
(Vi2MeSiO1/2)0.25(PhSiO3/2)0.75、(ViMe2SiO1/2)0.25(PhSiO3/2)0.75、(ViMe2SiO1/2)0.25(MeSiO3/2)0.25(PhSiO3/2)0.50、(ViMe2SiO1/2)0.15(PhSiO3/2)0.75(SiO4/2)0.1、及び(Vi2MeSiO1/2)0.15(ViMe2SiO1/2)0.1(PhSiO3/2)0.75の式(式中、Meはメチルであり、Viはビニルであり、Phはフェニルであり、また括弧の外の下付き数字はモル分率を指す)で表される樹脂が含まれるが、これらに限定されない。また、上記式において、単位の順番は不特定である。
(gは1から6である)から選択される式で表される)で表すことができる。R1で表されるヒドロカルビル基及びハロゲン置換ヒドロカルビル基は、成分(A)のシリコーン樹脂に対して上で定義され例示された通りである。
−CH2CH2SiMe2H、
−CH2CH2SiMe2CnH2nSiMe2H、
−CH2CH2SiMe2CnH2nSiMePhH、
−CH2CH2SiMePhH、
−CH2CH2SiPh2H、
−CH2CH2SiMePhCnH2nSiPh2H、
−CH2CH2SiMePhCnH2nSiMe2H、
−CH2CH2SiMePhOSiMePhH、及び
−CH2CH2SiMePhOSiPh(OSiMePhH)2の式(式中、Meはメチルであり、Phはフェニルであり、下付き文字nは2から10の値を有する)で表される基が含まれるが、これらに限定されない。
((HMe2SiC6H4SiMe2CH2CH2)2MeSiO1/2)0.12(PhSiO3/2)0.88、
((HMe2SiC6H4SiMe2CH2CH2)2MeSiO1/2)0.17(PhSiO3/2)0.83、
((HMe2SiC6H4SiMe2CH2CH2)2MeSiO1/2)0.17(MeSiO3/2)0.17(PhSiO3/2)0.66、
((HMe2SiC6H4SiMe2CH2CH2)2MeSiO1/2)0.15(PhSiO3/2)0.75(SiO4/2)0.10、及び
((HMe2SiC6H4SiMe2CH2CH2)2MeSiO1/2)0.08((HMe2SiC6H4SiMe2CH2CH2)Me2SiO1/2)0.06(PhSiO3/2)0.86の式(式中、Meはメチルであり、Phはフェニルであり、C6H4はパラ−フェニレン基を指し、また括弧の外の下付き数字はモル分率を指す)で表される樹脂が含まれるが、これらに限定されない。また、上記式において、単位の順番は不特定である。
(HMe2SiO1/2)0.25(PhSiO3/2)0.75、(HMeSiO2/2)0.3(PhSiO3/2)0.6(MeSiO3/2)0.1、及び(Me3SiO1/2)0.1(H2SiO2/2)0.1(MeSiO3/2)0.4(PhSiO3/2)0.4(式中、Meはメチルであり、Phはフェニルであり、括弧の外の下付き数字はモル分率を指す)の式で表される樹脂が含まれるが、これらに限定されない。また、上記式において、単位の順番は不特定である。
Vi4Si、PhSiVi3、MeSiVi3、PhMeSiVi2、Ph2SiVi2、及びPhSi(CH2CH=CH2)3(式中、Meはメチルであり、Phはフェニルであり、Viはビニルである)の式で表されるシランが含まれるが、これらに限定されない。
PhSi(OSiMe2H)3、Si(OSiMe2H)4、MeSi(OSiMe2H)3、及びPh2Si(OSiMe2H)2(式中、Meはメチルであり、Phはフェニルである)の式で表されるシロキサンが含まれるが、これらに限定されない。
ViMe2SiO(Me2SiO)aSiMe2Vi、ViMe2SiO(Ph2SiO)aSiMe2Vi、及びViMe2SiO(PhMeSiO)aSiMe2Vi(式中、Meはメチルであり、Phはフェニルであり、Viはビニルであり、下付き文字aは1から4の値を有する)の式で表されるシリコーンゴムが含まれるが、これらに限定されない。
HMe2SiO(Me2SiO)bSiMe2H、HMe2SiO(Ph2SiO)bSiMe2H、HMe2SiO(PhMeSiO)bSiMe2H及びHMe2SiO(Ph2SiO)2(Me2SiO)2SiMe2H(式中、Meはメチルであり、Phはフェニルであり、下付き文字bは1から4の値を有する)の式で表されるシリコーンゴムが含まれるが、これらに限定されない。
HMe2SiO(Me2SiO)50SiMe2H、HMe2SiO(Me2SiO)10SiMe2H、HMe2SiO(PhMeSiO)25SiMe2H、及びMe3SiO(MeHSiO)10SiMe3(式中、Meはメチルであり、Phはフェニルであり、下付き数字はシロキサン単位の各種類の数を示す)の式で表されるシリコーンゴムが含まれるが、これらに限定されない。
ViMe2SiO(Me2SiO)50SiMe2Vi、ViMe2SiO(Me2SiO)10SiMe2Vi、ViMe2SiO(PhMeSiO)25SiMe2Vi、及びVi2MeSiO(PhMeSiO)25SiMe2Vi(式中、Meはメチルであり、Phはフェニルであり、Viはビニルであり、下付き数字はシロキサン単位の各種類の数を示す)の式で表されるシリコーンゴムが含まれるが、これらに限定されない。
(ViMeSiO)3、(ViMeSiO)4、(ViMeSiO)5、(ViMeSiO)6、(ViPhSiO)3、(ViPhSiO)4、(ViPhSiO)5、(ViPhSiO)6、ViMe2SiO(ViMeSiO)nSiMe2Vi、Me3SiO(ViMeSiO)nSiMe3、及び(ViMe2SiO)4Si(式中、Meはメチルであり、Phはフェニルであり、Viはビニルであり、下付き文字nは、有機シロキサンが25℃で0.001Pa・sから2Pa・sの粘度を有するような値を有する)の式で表される有機シロキサンが含まれるが、これらに限定されない。
PhSi(OSiMe2H)3、Si(OSiMe2H)4、MeSi(OSiMe2H)3、(HMe2SiO)3SiOSi(OSiMe2H)3、及び(HMe2SiO)3SiOSi(Ph)(OSiMe2H)2(式中、Meはメチルであり、Phはフェニルである)の式で表される有機水素シロキサンが含まれるが、これらに限定されない。
Claims (34)
- 揮発成分除去ポリマーと少なくとも1種の揮発成分除去架橋剤とを使用して形成される硬化性弾性シリコーン組成物を含む、組成物。
- 前記揮発成分除去ポリマーが、ポリマーから揮発成分を除去するために真空及び熱のうち少なくとも1つに曝露されたポリマーを含む、請求項1に記載の組成物。
- 前記揮発成分除去ポリマーが、揮発成分除去ビニル官能性シロキサンポリマーを含む、請求項2に記載の組成物。
- 前記揮発成分除去架橋剤が、架橋剤から揮発成分を除去するために真空及び熱のうち少なくとも1つに曝露された架橋剤を含む、請求項1に記載の組成物。
- 前記少なくとも1種の揮発成分除去架橋剤が、SiH官能基を有する揮発成分除去メチル水素シロキサンポリマーを含む、請求項4に記載の組成物。
- 少なくとも1種の阻害剤を含む、請求項1に記載の組成物。
- 前記少なくとも1種の阻害剤が、2−フェニル−3−ブチン−2−オール(PBO)を含む、請求項6に記載の組成物。
- 少なくとも1種の触媒を含む、請求項6に記載の組成物。
- 前記触媒が0.1ppmから1000ppmの濃度を有し、前記阻害剤が約0wt.%から10wt.%の濃度を有する、請求項8に記載の組成物。
- エラストマーの第1の側面にパターンを形成するステップであって、前記エラストマーは、前記エラストマーの第2の側面の近くで繊維性材料で含浸されているステップを含む方法。
- 前記エラストマーを前記繊維性材料で含浸するステップを含む、請求項10に記載の方法。
- 前記エラストマーを含浸するステップが、前記繊維性材料中又は該材料上に硬化性ケイ素含有組成物を堆積させるステップを含む、請求項11に記載の方法。
- 前記繊維性材料中又は該材料上に硬化性ケイ素含有組成物を堆積させるステップが、その間の複数のすきまに複数のガラス繊維を含むガラス布中又は該ガラス布上に硬化性ケイ素含有組成物を堆積させるステップを含む、請求項12に記載の方法。
- 前記エラストマーに前記パターンを形成するステップが、
前記硬化性ケイ素含有組成物の一部をマスターパターンに接触させるステップと、
少なくとも部分的に前記ケイ素含有組成物を硬化させるステップと、
前記マスターパターンを、前記少なくとも部分的に硬化されたケイ素含有組成物との接触から解除するステップと
を含む、請求項11に記載の方法。 - 前記エラストマーを形成するために、前記少なくとも部分的に硬化されたケイ素含有組成物を硬化させるステップを含む、請求項14に記載の方法。
- 前記エラストマーに形成された前記パターンを使用して基板上にパターンを形成するステップを含む、請求項15に記載の方法。
- 少なくとも部分的に硬化された繊維強化フィルムを形成するステップと、
エラストマーにパターンを形成するステップであって、前記エラストマーの一部は前記繊維強化フィルムに隣接しているステップと
を含む方法。 - 前記繊維強化フィルムを形成するステップが、
ケイ素含有組成物の第1の層を形成するステップと、
繊維性材料の第1の側面が前記第1の層に隣接するように前記繊維性材料を配置するステップと、
前記繊維性材料の第2の側面に隣接してケイ素含有組成物の第2の層を形成するステップであって、前記第2の側面は前記第1の側面に対置するステップと、
前記第1及び第2の層を少なくとも部分的に硬化させるステップと
を含む、請求項17に記載の方法。 - 前記第1の層を形成するステップが、シリコーン樹脂を使用して前記第1の層を形成するステップを含む、請求項18に記載の方法。
- 前記第1の層を形成するステップが、揮発成分除去ポリマーと少なくとも1種の揮発成分除去架橋剤とを使用して形成された硬化性弾性シリコーン組成物を使用して前記第1の層を形成するステップを含む、請求項17に記載の方法。
- 前記繊維性材料を配置するステップが、複数のガラス繊維とその間の複数のすきまとを含むガラス布を配置するステップを含む、請求項17に記載の方法。
- 前記エラストマーに前記パターンを形成するステップが、前記繊維強化フィルムの一部に隣接して硬化性ケイ素含有組成物を堆積させるステップを含む、請求項17に記載の方法。
- 前記硬化性ケイ素含有組成物を堆積させるステップが、前記繊維強化フィルムの一部に隣接して、シリコーン樹脂と架橋剤とを含む組成物を堆積させるステップを含む、請求項22に記載の方法。
- 前記エラストマーに前記パターンを形成するステップが、
前記硬化性ケイ素含有組成物の一部をマスターパターンに接触させるステップと、
少なくとも部分的に前記ケイ素含有組成物を硬化させるステップと、
前記マスターパターンを、前記少なくとも部分的に硬化されたケイ素含有組成物との接触から解除するステップと
を含む、請求項22に記載の方法。 - 前記繊維強化フィルムと前記エラストマーとを硬化させるステップを含む、請求項17に記載の方法。
- 前記硬化されたエラストマーに形成された前記パターンを使用して、基板上にパターンを形成するステップを含む、請求項25に記載の方法。
- 硬質シリコーン樹脂フィルムを形成するステップと、
エラストマーにパターンを形成するステップであって、前記エラストマーの一部は前記硬質シリコーン樹脂フィルムに隣接しているステップと
を含む方法。 - 前記硬質シリコーン樹脂フィルムを形成するステップが、基板の上に硬化性組成物を堆積させるステップを含む、請求項27に記載の方法。
- 前記硬化性組成物を堆積させるステップが、シリコーン樹脂を含む硬化性組成物を堆積させるステップを含む、請求項28に記載の方法。
- 前記硬化性組成物を硬化させるステップを含む、請求項29に記載の方法。
- 前記エラストマーに前記パターンを形成するステップが、前記硬質シリコーン樹脂フィルムの一部に隣接して硬化性ケイ素含有組成物を堆積させるステップを含む、請求項27に記載の方法。
- 前記硬化性ケイ素含有組成物を堆積させるステップが、前記硬質シリコーン樹脂フィルムの一部に隣接して、シリコーン樹脂と架橋剤とを含む組成物を堆積させるステップを含む、請求項31に記載の方法。
- 前記エラストマーに前記パターンを形成するステップが、
前記硬化性ケイ素含有組成物の一部をマスターパターンに接触させるステップと、
少なくとも部分的に前記ケイ素含有組成物を硬化させるステップと、
前記マスターパターンを、前記少なくとも部分的に硬化されたケイ素含有組成物との接触から解除するステップと
を含む、請求項31に記載の方法。 - 前記エラストマーに形成された前記パターンを使用して基板上にパターンを形成するステップを含む、請求項33に記載の方法。
Applications Claiming Priority (3)
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US79118206P | 2006-04-11 | 2006-04-11 | |
US60/791,182 | 2006-04-11 | ||
PCT/US2007/063651 WO2007121006A2 (en) | 2006-04-11 | 2007-03-09 | Low thermal distortion silicone composite molds |
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JP2009533531A true JP2009533531A (ja) | 2009-09-17 |
JP5520044B2 JP5520044B2 (ja) | 2014-06-11 |
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US (2) | US8795560B2 (ja) |
EP (1) | EP2005248A2 (ja) |
JP (1) | JP5520044B2 (ja) |
KR (1) | KR101358066B1 (ja) |
CN (1) | CN101449206A (ja) |
WO (1) | WO2007121006A2 (ja) |
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WO2020203472A1 (ja) * | 2019-03-29 | 2020-10-08 | 大日本印刷株式会社 | インプリント用光硬化性樹脂組成物、インプリント用光硬化性樹脂組成物の製造方法、およびパターン形成体の製造方法 |
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JP2010253753A (ja) * | 2009-04-23 | 2010-11-11 | Dainippon Printing Co Ltd | インプリント用モールドおよびその製造方法 |
JP2015513328A (ja) * | 2012-01-16 | 2015-05-07 | ダウ コーニング コーポレーションDow Corning Corporation | 光学物品及び形成方法 |
JP2013248749A (ja) * | 2012-05-30 | 2013-12-12 | Toshiba Mach Co Ltd | 型および型の製造方法 |
KR20190034592A (ko) * | 2016-07-27 | 2019-04-02 | 코닌클리케 필립스 엔.브이. | 폴리오르가노실록산-기반 스탬프 제조 방법, 폴리오르가노실록산-기반 스탬프, 인쇄 공정을 위한 이의 용도, 및 이를 사용하는 임프린팅 방법 |
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KR102380203B1 (ko) | 2016-07-27 | 2022-03-29 | 코닌클리케 필립스 엔.브이. | 폴리오르가노실록산-기반 스탬프 제조 방법, 폴리오르가노실록산-기반 스탬프, 인쇄 공정을 위한 이의 용도, 및 이를 사용하는 임프린팅 방법 |
WO2020203472A1 (ja) * | 2019-03-29 | 2020-10-08 | 大日本印刷株式会社 | インプリント用光硬化性樹脂組成物、インプリント用光硬化性樹脂組成物の製造方法、およびパターン形成体の製造方法 |
JP7472904B2 (ja) | 2019-03-29 | 2024-04-23 | 大日本印刷株式会社 | インプリント用光硬化性樹脂組成物、インプリント用光硬化性樹脂組成物の製造方法、およびパターン形成体の製造方法 |
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US20100200146A1 (en) | 2010-08-12 |
US20140305500A1 (en) | 2014-10-16 |
JP5520044B2 (ja) | 2014-06-11 |
WO2007121006A2 (en) | 2007-10-25 |
CN101449206A (zh) | 2009-06-03 |
US8795560B2 (en) | 2014-08-05 |
WO2007121006A3 (en) | 2008-04-24 |
EP2005248A2 (en) | 2008-12-24 |
KR101358066B1 (ko) | 2014-02-06 |
KR20090005172A (ko) | 2009-01-12 |
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