WO2008106245A2 - Method of forming soft lithographic molds with fluorine modified elastomers - Google Patents
Method of forming soft lithographic molds with fluorine modified elastomers Download PDFInfo
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- WO2008106245A2 WO2008106245A2 PCT/US2008/051124 US2008051124W WO2008106245A2 WO 2008106245 A2 WO2008106245 A2 WO 2008106245A2 US 2008051124 W US2008051124 W US 2008051124W WO 2008106245 A2 WO2008106245 A2 WO 2008106245A2
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- polyalkylmethylsiloxane
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
Abstract
The present invention provides an elastomeric stamp or mold. The elastomeric stamp or mold may be formed by a process including depositing a curable fluorine-containing polyalkylmethylsiloxane composition adjacent a master pattern and curing, at least partially, the curable fluorine-containing polyalkylmethylsiloxane composition. The process may also include removing the at least partially cured fluorine-containing polyalkylmethylsiloxane composition from the master pattern.
Description
METHOD OF FORMING SOFT LITHOGRAPHIC MOLDS WITH FLUORINE
MODIFIED ELASTOMERS
BACKGROUND OF THE INVENTION 1. FIELD OF THE INVENTION
This invention relates generally to lithography, and, more particularly, to soft lithography.
2. DESCRIPTION OF THE RELATED ART Soft lithography is a patterning technique used in micro-fabrication to produce microstructures by transferring a pattern from a master to a substrate using a patterned elastomer. For example, patterns may be transferred by printing, molding, or embossing with a polydimethylsiloxane (PDMS) elastomeric stamp. For another example, patterns may be formed by depositing a curable composition over a polydimethylsiloxane (PDMS) elastomeric mold, curing the composition, and then removing the structure formed of the cured composition from the PDMS mold. Representative soft lithographic techniques include contact printing, replica molding, transfer molding, micro-molding in capillaries, solvent assisted micro-molding, and the like. These soft lithographic techniques may be useful for fabricating a variety of functional components and devices that may be used in areas including optics, microelectronics, microanalysis, micro-electro-mechanical systems, microfluidics, and the like.
Silicones are conventionally used for soft lithography applications such as for the stamp and/or mold, at least in part because stamps and/or molds formed from silicones have low surface energy, excellent conformability, and generally good compatibility with water.
For example, silicone elastomers may be used in soft lithography to form micro-structures
such as waveguides because of its low surface energy, excellent conformability, and generally good compatibility with water. Silicone elastomers may be formed of platinum- catalyzed hydros ilylation-cured formulations composed of vinylated silicone resin, vinyl- terminated polydimethylsiloxane, and Pt and trimethylsilyl-terminated (dimethyl)-co- (Methylhydrogen) siloxane polymer.
An elastomeric stamp or mold can be prepared by casting a curable silicone composition against a master that has been patterned by conventional photolithographic techniques. For example, a silicon-containing elastomer stamp or mold can be formed by spin-casting a curable composition including polydimethylsiloxane onto a master, curing the composition, and then removing the silicon-containing elastomer stamp or mold. The stamp or mold may then be used to transfer patterns using soft lithographic techniques, as discussed above.
However, silicones tend to swell in organic solvents such as toluene and to absorb proteins from the water phase, which may prevent utilization of silicone stamps or molds in applications such as microfluidics. For example, polydimethylsiloxane compositions swell in organic solvents (e.g., toluene), leading to deformation of the formed structure and degradation of performance. In addition, elastomeric stamps formed from silicone containing compositions tend to adhere to conventional silicone-containing molding materials or substrates, which may reduce the lifetime of the stamp and/or mold because repeated use may degrade the quality of the features imprinted on the stamp or mold. For example, when a silicone mold/stamp formed from silicone-containing compositions is used in soft lithography to fabricate silicone structures, insufficient release of the mold from the silicone structures causes rough surfaces, leading to defects in the structure of the mold or stamp.
SUMMARY OF THE INVENTION
The present invention is directed to addressing the effects of one or more of the problems set forth above. The following presents a simplified summary of the invention in order to provide a basic understanding of some aspects of the invention. This summary is not an exhaustive overview of the invention. It is not intended to identify key or critical elements of the invention or to delineate the scope of the invention. Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is discussed later.
In one embodiment of the instant invention, an elastomeric stamp or mold is provided.
The elastomeric stamp or mold may be formed by a process including depositing a curable fluorine-containing polyalkylmethylsiloxane composition adjacent a master pattern and curing, at least partially, the curable fluorine-containing polyalkylmethylsiloxane composition. The process may also include removing the at least partially cured fluorine- containing polyalkylmethylsiloxane composition from the master pattern.
In another embodiment of the present invention, a method is provided for forming an elastomeric stamp or mold. The method may include depositing a curable fluorine- containing polyalkylmethylsiloxane composition adjacent a master pattern and curing, at least partially, the curable fluorine-containing polyalkylmethylsiloxane composition. The method may also include removing the at least partially cured fluorine-containing polyalkylmethylsiloxane composition from the master pattern.
In another embodiment of the present invention, an apparatus is provided. The apparatus may include at least one of a stamp and a mold comprising a curable fluorine- containing polyalkylmethylsiloxane composition cured, at least partially, while adjacent a master pattern.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention may be understood by reference to the following description taken in conjunction with the accompanying drawings, in which like reference numerals identify like elements, and in which:
Figures IA, IB, and 1C conceptually illustrate one exemplary embodiment of a method of forming an elastomeric stamp or mold, in accordance with the present invention.
While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof have been shown by way of example in the drawings and are herein described in detail. It should be understood, however, that the description herein of specific embodiments is not intended to limit the invention to the particular forms disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.
DETAILED DESCRIPTION OF SPECIFIC EMBODIMENTS Illustrative embodiments of the invention are described below. In the interest of clarity, not all features of an actual implementation are described in this specification. It will of course be appreciated that in the development of any such actual embodiment, numerous
implementation-specific decisions should be made to achieve the developers' specific goals, such as compliance with system-related and business-related constraints, which will vary from one implementation to another. Moreover, it will be appreciated that such a development effort might be complex and time-consuming, but would nevertheless be a routine undertaking for those of ordinary skill in the art having the benefit of this disclosure.
The present invention will now be described with reference to the attached figures. Various structures, systems and devices are schematically depicted in the drawings for purposes of explanation only and so as to not obscure the present invention with details that are well known to those skilled in the art. Nevertheless, the attached drawings are included to describe and explain illustrative examples of the present invention. The words and phrases used herein should be understood and interpreted to have a meaning consistent with the understanding of those words and phrases by those skilled in the relevant art. No special definition of a term or phrase, i.e., a definition that is different from the ordinary and custom- ary meaning as understood by those skilled in the art, is intended to be implied by consistent usage of the term or phrase herein. To the extent that a term or phrase is intended to have a special meaning, i.e., a meaning other than that understood by skilled artisans, such a special definition will be expressly set forth in the specification in a definitional manner that directly and unequivocally provides the special definition for the term or phrase.
Figures IA, IB, and 1C conceptually illustrate one exemplary embodiment of a method 100 of forming a stamp or mold 105. As used herein, the terms "stamp" and "mold" will be understood to refer to a structure having a pattern formed therein or thereon such that the stamp or mold may be used to impress the pattern in or on another material. For example,
a curable composition may be applied to the stamp/mold or to a substrate and the pattern may be impressed on the curable composition by bringing the stamp/mold and the substrate together such that the curable composition is intermediate the stamp/mold and the substrate. Although the function of a stamp and a mold may be quite similar, persons of ordinary skill in the art may use the terms "stamp" and "mold" in different contexts. The term "stamp" is typically used to refer to a structure that is pressed down on to a material to impress the pattern on the material, whereas the term "mold" is typically used to refer to a structure that may have material applied to it so that the pattern in the mold is reproduced in or on the material.
In the illustrated embodiment, the stamp or mold 105 is an elastomeric stamp or mold 105. As used herein, the term "elastomeric stamp or mold" is defined as a stamp or a mold formed of an elastomer. As used herein, the term "elastomer" is defined as a polymer which can return to its initial dimensions when deformed by an external force. A polymer is considered an elastomer when the polymer meets the following standard. A sample of the polymer in its solid state and having an initial linear dimension of D° is subjected to a force such that the dimension is changed by about 10%. If the dimension of an elastomer assumes a value De, where De = D° ± 0.0 W once the force is no longer applied, the polymer is considered an elastomer.
Figure IA shows a curable composition 105 that has been deposited adjacent a master pattern 110. The curable composition 105 may be deposited adjacent the master pattern 110 using any technique including, but not limited to, spin coating, extrusion, dipping, spraying, applying using an inkjet, a screen print, a stencil print, meniscus techniques, gravure
techniques, evaporation, and the like. These techniques may be used under conditions of atmospheric pressure, partial vacuum, or full vacuum. Persons of ordinary skill in the art having benefit of the present disclosure should appreciate that, in some embodiments, layers such as release layers (not shown) may be formed between the master pattern 110 and the curable composition 105. Accordingly, the term "adjacent" will be understood herein to encompass embodiments in which the curable composition 105 is deposited directly on the master pattern 110 and embodiments in which one or more layers are formed intermediate the curable composition 105 and the master pattern 110.
Conventional curable compositions 105 include silicone-containing curable compositions. For example, the curable silicone-containing composition 105 may be formed by mixing 110 parts of a mixture containing a 32:68 ratio of dimethylvinyl-terminated siloxane resins and dimethylvinyl-terminated polydimethylsiloxane polymer; 6 parts trimethylsilyl-terminated (dimethyl)-co-(Methylhydrogen) siloxane polymer, 0.2 parts tetramethyl-tetravinyl-tetracyclosiloxane, and 0.07 parts Karstedt's catalyst. The components may be mixed in a dental mixer for 30 seconds and poured onto the mold 110. In one embodiment, the curable silicone-containing composition 105 and the mold 110 may be allowed to degas at about 7OC for about 1 hour under vacuum.
The curable silicone-containing composition 105 may then be cured, at least partially, as shown in Figure IB. In the illustrated embodiment, the curable silicone-containing composition 105 is cured by exposure to heat 115. For example, the curable silicone- containing composition 105 may be placed in an oven kept at a temperature of about 150C for about 30 min. However, as will be discussed in detail below, the curable silicone-
containing composition 105 may be cured using any curing technique including exposure to heat, radiation, and the like. The partially or fully cured silicone-containing composition 120, which may also be referred to as the cured elastomer 120, may then be removed from the master pattern 110, as shown in Figure 1C, and used as a stamp or a mold, as will be discussed in detail below.
The cured elastomer 120 may be tested for solvent swell by the following method. A piece of the cured elastomer 120 is weighed and submerged in a beaker filled with a solvent (e.g. , water, methanol, hexane, toluene, chloroform, and the like) for about 24 hours at room temperature. At the end of 24 hours the cured elastomer 120 is removed and the surface of cured elastomer 120 dried by careful blotting using a cloth. The cured elastomer 120 is weighed and the increase in weight before and after submersion in the solvent is used to calculate a % increase in the weight of the cured elastomer 120. Table 1 shows the percentage of fluorine content (F-content) in each composition and the percentage increase in the weight of the cured elastomer 120 when submerged in various solvents (e.g., water, methanol, hexane, toluene, and chloroform). For example, in the illustrated embodiment, the weight of the cured elastomer 120 increased by 194% for toluene.
Table 1
In a first embodiment in accordance with the present invention, the curable composition 105 includes a curable fluorine-containing polyalkylmethylsiloxane composition. As used herein, the term "fluorine-containing polyalkylmethylsiloxane composition" will be understood to refer to a composition that comprises polysiloxane polymers or copolymers that contain (perfluoroalkyl)alkyl-methylsiloxy groups. (Perfluoroalkyl)alkyl- is represented by the formula Rfx - (CH2)y where Rf can be heptadecafluorooctyl, nonafluorobutyl, tridecafluorooctyl, or trifluoromethyl; x can be 1-10 and y can be 2-4. For example, the curable fluorine-containing polyalkylmethylsiloxane composition 105 may be a modified formulation of the silicone composition discussed above where some of the dimethylvinyl-terminated polydimethylsiloxane polymer is replaced by dimethylvinyl-terminated (trifluoropropylmethyl)-co-(dimethyl)siloxane polymer. The curable fluorine-containing polyalkylmethylsiloxane composition 105 (referred to as 18308- 27A in Table 1) may therefore be prepared by combining 43.15 parts of a 49:51 mixture of dimethylvinyl-terminated siloxane resin and dimethylvinyl-terminated polydimethylsiloxane polymer, 5 parts of dimethylvinyl-terminated (trifluoropropylmethyl)-co-(dimethyl) siloxane, 0.05 parts of Karstedt's catalyst, 1 part of 5-hexenyldimethyl-terminated polydimethylsiloxane, 3 parts of dimethylhydrogen-terminated siloxane resins, and 0.17 parts of tetramethyl-tetravinyl-tetracyclosiloxane.
The components of the curable fluorine-containing polyalkylmethylsiloxane composition 105 may be mixed in a dental mixer for about 30 seconds and poured onto the
mold 110, as shown in Figure IA. In one embodiment, the curable fluorine-containing polyalkylmethylsiloxane composition 105 and the mold 110 may be allowed to degas at about 7OC for about 1 hour under vacuum. The curable fluorine-containing polyalkylmethylsiloxane composition 105 may then be cured, at least partially, as shown in Figure IB and discussed above, and the partially or fully cured curable fluorine-containing polyalkylmethylsiloxane composition 120 may be removed from the master pattern 110, as shown in Figure 1C. The cured fluorine-containing polyalkylmethylsiloxane elastomer 120 may be tested for swelling by immersion in various solvents. For example the weight of the cured fluorine-containing polyalkylmethylsiloxane elastomer 120 increased by 168% after immersion in toluene, as shown in Table 1.
In a second embodiment in accordance with the present invention, the curable composition 105 includes a curable composition including a fluorine-containing polyalkylmethylsiloxane composition that is a modified formulation of the first embodiment of the curable composition including a fluorine-containing polyalkylmethylsiloxane composition described above where the concentration of dimethylvinyl-terminated (trifluoropropylmethyl)-co(dimethyl)siloxane polymer was increased. The second embodiment of the curable fluorine-containing polyalkylmethylsiloxane composition 105 (referred to as 18308-27B in Table 1) may be prepared by combining 43.2 parts of 49:51 mixture of dimethylvinyl-terminated siloxane resin and dimethylvinyl-terminated polydimethylsiloxane polymer, 10 parts of dimethylvinyl-terminated (trifluoropropylmethyl)- co-(dimethyl) siloxane, 0.04 parts of Karstedt's catalyst, 1 part of 5-hexenyldimethyl- terminated polydimethylsiloxane, 3.5 parts of dimethylhydrogen-terminated siloxane resins, and 0.17 parts of tetramethyl-tetravinyl-tetracyclosiloxane.
The components of the second embodiment of the curable fluorine-containing polyalkylmethylsiloxane composition 105 may be mixed in a dental mixer for about 30 seconds and poured onto the mold 110, as shown in Figure IA. In one embodiment, the second embodiment of the curable fluorine-containing polyalkylmethylsiloxane composition
105 and the mold 110 may be allowed to degas at about 7OC for about 1 hour under vacuum. The second embodiment of the curable fluorine-containing polyalkylmethylsiloxane composition 105 may then be cured, at least partially, as shown in Figure IB and discussed above, and the partially or fully cured curable fluorine-containing polyalkylmethylsiloxane composition 120 may be removed from the master pattern 110, as shown in Figure 1C. The cured fluorine-containing polyalkylmethylsiloxane elastomer 120 may be tested for swelling by immersion in various solvents. For example the weight of the second embodiment of the cured fluorine-containing polyalkylmethylsiloxane elastomer 120 increased by 141% after immersion in toluene, as shown in Table 1.
In a third embodiment in accordance with the present invention, the curable composition 105 includes a curable composition including a fluorine-containing polyalkylmethylsiloxane composition that is a modified formulation of the second embodiment discussed above where some dimethylhydrogen-terminated (trifluoropropylmethyl)-co-(dimethyl)siloxane polymer was added to increase fluorine content. The third embodiment of the curable fluorine-containing polyalkylmethylsiloxane composition 105 (referred to as 18308-27D in Table 1) may be prepared by combining 43.15 parts of a 49:51 mixture of dimethylvinyl-terminated siloxane resin and dimethylvinyl- terminated polydimethylsiloxane polymer, 5 parts of dimethylvinyl-terminated
(trifluoropropylmethyl)-co-(dimethyl) siloxane, 0.04 parts of Karstedt's catalyst, 1 part of 5- hexenyldimethyl-terminated polydimethylsiloxane, 3 parts of dimethylhydrogen-terminated siloxane resins, 1 part diemthylhydrogen-terminated (trifluoropropyl)-co-(dimethyl)siloxane, and 0.17 parts of tetramethyl-tetravinyl-tetracyclosiloxane.
The components of the third embodiment of the curable curable fluorine-containing polyalkylmethylsiloxane composition 105 may be mixed in a dental mixer for about 30 seconds and poured onto the mold 110, as shown in Figure IA. In the third embodiment, the curable curable fluorine-containing polyalkylmethylsiloxane composition 105 and the mold 110 may be allowed to degas at about 7OC for about 1 hour under vacuum. The third embodiment of the curable curable fluorine-containing polyalkylmethylsiloxane composition 105 may then be cured, at least partially, as shown in Figure IB and discussed above, and the partially or fully cured curable fluorine-containing polyalkylmethylsiloxane composition 120 may be removed from the master pattern 110, as shown in Figure 1C. The cured fluorine- containing polyalkylmethylsiloxane elastomer 120 may be tested for swelling by immersion in various solvents. For example the weight of the third embodiment of the cured fluorine- containing polyalkylmethylsiloxane elastomer 120 increased by 145% after immersion in toluene, as shown in Table 1.
In a fourth embodiment in accordance with the present invention, the curable composition 105 includes a curable composition including a fluorine-containing polyalkylmethylsiloxane composition that is a modified formulation of the second embodiment discussed above where the dimethylvinyl-terminated (trifluoropropyl)-co- (dimethyl) siloxane was eliminated, thus reducing the fluorine content. The fourth
embodiment of the curable fluorine-containing polyalkylmethylsiloxane composition 105 (referred to as 18308-27C in Table 1) may be prepared by combining 43.15 parts of a 49:51 mixture of dimethylvinyl-terminated siloxane resin and dimethylvinyl-terminated polydimethylsiloxane polymer, 0.04 parts of Karstedt's catalyst, 1 part of 5-hexenyldimethyl- terminated polydimethylsiloxane, 2.5 parts of dimethylhydrogen-terminated siloxane resins, 1 part diemthylhydrogen-terminated (trifluoropropyl)-co-(dimethyl)siloxane, and 0.17 parts of tetramethyl-tetravinyl-tetracyclosiloxane. The components were mixed and cured as discussed above and tested for solvent swelling. The weight of the fourth embodiment of the curable fluorine-containing polyalkylmethylsiloxane elastomer 120 increased by 158%.
In a fifth embodiment in accordance with the present invention, the curable composition 105 includes a curable composition including a fluorine-containing polyalkylmethylsiloxane composition that is a modified formulation of the second embodiment discussed above where the trimethyl-terminated (dimethyl)-co- (Methylhydrogen) polymer is replaced by a perfluorobutylethyl-functional polymer. The fifth embodiment of the curable fluorine-containing polyalkylmethylsiloxane composition 105 (not shown in Table 1) may be prepared by combining 103.66 parts of a 33:67 mixture of dimethylvinyl-terminated siloxane resin and dimethylvinyl-terminated polydimethylsiloxane polymer, 0.07 parts Karstedt's catalyst, 0.2 parts tetramethyl-tetravinyl-tetracyclosiloxane, and 10.4 parts trimethyl-terminated (perfluorobutylethylmethyl)-co-(methylhydrogen) siloxane polymer, as discussed above. The fifth embodiment of the cured elastomer 120 has a hardness (shore A) of about 39.5 and elongation at break (%) of 114.3 (31.8)). The weight of the fifth embodiment of the curable fluorine-containing polyalkylmethylsiloxane elastomer 120 increased by 120%.
In a sixth embodiment in accordance with the present invention, the curable composition 105 includes a curable composition including a fluorine-containing polyalkylmethylsiloxane composition that is a modified formulation of the second embodiment discussed above. The sixth embodiment of the curable composition 105 has a larger cross-linker density and a higher modulus than the second embodiment, resulting in a tighter network and improved solvent resistance. The sixth embodiment of the curable composition 105 may be formed by replacing some of the dimethylvinyl-terminated polydimethylsiloxane polymer in the second embodiment with Tetrakis (omega- dimethylvinylpolydimethylsiloxy) silane. For example, the sixth embodiment of the curable fluorine-containing polyalkylmethylsiloxane composition 105 (not shown in Table 1) may be prepared by combining 103.66 parts of a 45:55 mixture of dimethylvinyl-terminated siloxane resin: Tetrakis (omega-dimethylvinylpolydimethylsiloxy) silane, 0.07 parts Karstedt's catalyst, 0.2 parts tetramethyl-tetravinyl-tetracyclosiloxane, and 10.4 parts trimethyl- terminated (perfluorobutylethylmethyl)-co-(methylhydrogen) siloxane polymer, as discussed above. The sixth embodiment of the cured elastomer 120 has a hardness (shore A) of about 64.4 and elongation at break (%) of 33.1 (0.9)). The weight of the sixth embodiment of the curable fluorine-containing polyalkylmethylsiloxane elastomer 120 increased by 70%.
Modifying the silicone-containing curable compositions used to form conventional stamps and/or molds by incorporating fluorine to form a curable composition including a fluorine-containing polyalkylmethylsiloxane composition, and then forming stamps and/or molds from the curable fluorine-containing polyalkylmethylsiloxane composition may have a number of advantages over conventional practice. For example, deformation of the formed
structure (e.g., the stamp and/or mold) and degradation of performance caused by solvent swelling may be reduced. In addition, adherence of stamps and/or molds to the molding material or substrates may be reduced, which may increase the lifetime of the stamp and/or mold. In particular, by further lowering the surface energy of the silicone material intended for microfluidic applications, the uptake of organic solvents and proteins is reduced and the lifetime of the silicone material intended for stamps and molds may be extended.
In the embodiment discussed above, the curable composition including a fluorine- containing polyalkylmethylsiloxane composition is formed by modifying a silicone- containing composition. For example, silicone-containing compositions may be modified to incorporate fluorine (and functionalities that include fluorine). Examples of curable silicone compositions include, but are not limited to, hydrosilylation-curable silicone compositions, peroxide curable silicone compositions, condensation-curable silicone compositions, epoxy- curable silicone compositions; ultraviolet radiation-curable silicone compositions, and high- energy radiation-curable silicone compositions. In yet other embodiments, hybrid polymers containing copolymers of organic and siloxane polymers may be used either in conjunction with a curable site or by utilizing polymers with high glass transition temperatures.
Curable silicone compositions and methods for their preparation are well known in the art. For example, a suitable hydrosilylation-curable silicone composition typically comprises (i) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (ii) an organohydrogensiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition, and (iii) a hydrosilylation catalyst. The hydrosilylation catalyst can be any of
the well known hydrosilylation catalysts comprising a platinum group metal, a compound containing a platinum group metal, or a microencapsulated platinum group metal-containing catalyst. Platinum group metals include platinum, rhodium, ruthenium, palladium, osmium and iridium. Preferably, the platinum group metal is platinum, based on its high activity in hydrosilylation reactions.
The hydrosilylation-curable silicone composition can be a one-part composition or a multi-part composition comprising the components in two or more parts. Room-temperature vulcanizable (RTV) compositions typically comprise two parts, one part containing the organopolysiloxane and catalyst and another part containing the organohydrogensiloxane and any optional ingredients. Hydrosilylation-curable silicone compositions that cure at elevated temperatures can be formulated as one-part or multi-part compositions. For example, liquid silicone rubber (LSR) compositions are typically formulated as two-part systems. One-part compositions typically contain a platinum catalyst inhibitor to ensure adequate shelf life.
A suitable peroxide-curable silicone composition typically comprises (i) an organopolysiloxane and (ii) an organic peroxide. Examples of organic peroxides include, diaroyl peroxides such as dibenzoyl peroxide, di-p-chlorobenzoyl peroxide, and bis-2,4- dichlorobenzoyl peroxide; dialkyl peroxides such as di-t-butyl peroxide and 2,5-dimethyl- 2,5-di-(t-butylperoxy)hexane; diaralkyl peroxides such as dicumyl peroxide; alkyl aralkyl peroxides such as t-butyl cumyl peroxide and l,4-bis(t-butylperoxyisopropyl)benzene; and alkyl aroyl peroxides such as t-butyl perbenzoate, t-butyl peracetate, and t-butyl peroctoate.
A condensation-curable silicone composition typically comprises (i) an organopolysiloxane containing an average of at least two hydroxy groups per molecule; and (ii) a tri- or tetra-functional silane containing hydrolysable Si-O or Si-N bonds. Examples of silanes include alkoxysilanes such as CH3Si(OCH3)3, CH3Si(OCH2CH3)3, CH3Si(OCH2CH2CH3)3, CH3Si[O(CH2)3CH3]3, CH3CH2Si(OCH2CH3)3,
C6H5Si(OCH3)3, C6H5CH2Si(OCH3)3, C6H5Si(OCH2CH3)3, CH2=CHSi(OCH3)3, CH2=CHCH2Si(OCH3)3, CF3CH2CH2Si(OCH3)3, CH3Si(OCH2CH2OCH3)3,
CF3CH2CH2Si(OCH2CH2OCH3)3, CH2=CHSi(OCH2CH2OCH3)3,
CH2=CHCH2Si(OCH2CH2OCH3)3, C6H5Si(OCH2CH2OCH3)3, Si(OCH3)4, Si(OC2H5)4, and Si(OC3H7)4; organoacetoxysilanes such as CH3Si(OCOCH3)3,
CH3CH2Si(OCOCH3)3, and CH2=CHSi(OCOCH3)3; organoiminooxysilanes such as CH3Si[O-N=C(CH3)CH2CH3]3, Si[O-N=C(CH3)CH2CH3]4, and CH2=CHSi[O- N=C(CH3)CH2CH3]3; organoacetamidosilanes such as CH3Si[NHC(=O)CH3]3 and C6H5Si[NHCC=O)CH3J3; aminosilanes such as CH3Si[NH(S-C4H9)J3 and CH3Si(NHC6Hn)3; and organoaminooxysilanes.
A condensation-curable silicone composition can also contain a condensation catalyst to initiate and accelerate the condensation reaction. Examples of condensation catalysts include, but are not limited to, amines; and complexes of lead, tin, zinc, and iron with carboxylic acids. Tin(II) octoates, laurates, and oleates, as well as the salts of dibutyl tin, are particularly useful. The condensation-curable silicone composition can be a one-part composition or a multi-part composition comprising the components in two or more parts. For example, room-temperature vulcanizable (RTV) compositions can be formulated as one-
part or two-part compositions. In the two-part composition, one of the parts typically includes a small amount of water.
A suitable epoxy-curable silicone composition typically comprises (i) an organopolysiloxane containing an average of at least two epoxy-functional groups per molecule and (ii) a curing agent. Examples of epoxy-functional groups include 2- glycidoxyethyl, 3-glycidoxypropyl, 4-glycidoxybutyl, 2,(3,4-epoxycyclohexyl)ethyl, 3-(3,4- epoxycyclohexyl)propyl, 2,3-epoxypropyl, 3,4-epoxybutyl, and 4,5-epoxypentyl. Examples of curing agents include anhydrides such as phthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, and dodecenylsuccinic anhydride; polyamines such as diethylenetriamine, triethylenetetramine, diethylenepropylamine, N-(2- hydroxyethyl)diethylenetriamine, N,N' -di(2-hydroxyethyl)diethylenetriamine, m- phenylenediamine, methylenedianiline, aminoethyl piperazine, 4,4-diaminodiphenyl sulfone, benzyldimethylamine, dicyandiamide, and 2-methylimidazole, and triethylamine; Lewis acids such as boron trifluoride monoethylamine; polycarboxylic acids; polymercaptans; polyamides; and amidoamines.
A suitable ultraviolet radiation-curable silicone composition typically comprises (i) an organopolysiloxane containing radiation-sensitive functional groups and (ii) a photoinitiator. Examples of radiation-sensitive functional groups include acryloyl, methacryloyl, mercapto, epoxy, and alkenyl ether groups. The type of photoinitiator depends on the nature of the radiation-sensitive groups in the organopolysiloxane. Examples of photoinitiators include diaryliodonium salts, sulfonium salts, acetophenone, benzophenone, and benzoin and its derivatives.
A suitable high-energy radiation-curable silicone composition comprises an organopolysiloxane polymer. Examples of organpolyosiloxane polymers include polydimethylsiloxanes, poly(methylvinylsiloxanes), and organohydrogenpolysiloxanes. Examples of high-energy radiation include γ-rays and electron beams.
The curable silicone composition of the present invention can comprise additional ingredients. Examples of additional ingredients include, but are not limited to, adhesion promoters, solvents, inorganic fillers, photosensitizers, antioxidants, stabilizers, pigments, and surfactants. Examples of inorganic fillers include, but are not limited to, natural silicas such as crystalline silica, ground crystalline silica, and diatomaceous silica; synthetic silicas such as fused silica, silica gel, pyrogenic silica, and precipitated silica; silicates such as mica, wollastonite, feldspar, and nepheline syenite; metal oxides such as aluminum oxide, titanium dioxide, magnesium oxide, ferric oxide, beryllium oxide, chromium oxide, and zinc oxide; metal nitrides such as boron nitride, silicon nitride, and aluminum nitride, metal carbides such as boron carbide, titanium carbide, and silicon carbide; carbon black; alkaline earth metal carbonates such as calcium carbonate; alkaline earth metal sulfates such as calcium sulfate, magnesium sulfate, and barium sulfate; molybdenum disulfate; zinc sulfate; kaolin; talc; glass fiber; glass beads such as hollow glass microspheres and solid glass microspheres; aluminum trihydrate; asbestos; and metallic powders such as aluminum, copper, nickel, iron, and silver powders.
The silicone composition can be cured by exposure to ambient temperature, elevated temperature, moisture, or radiation, depending on the particular cure mechanism. For
example, one-part hydrosilylation-curable silicone compositions are typically cured at an elevated temperature. Two-part hydrosilylation-curable silicone compositions are typically cured at room temperature or an elevated temperature. One-part condensation-curable silicone compositions are typically cured by exposure to atmospheric moisture at room temperature, although cure can be accelerated by application of heat and/or exposure to high humidity. Two-part condensation-curable silicone compositions are typically cured at room temperature; however, cure can be accelerated by application of heat. Peroxide-curable silicone compositions are typically cured at an elevated temperature. Epoxy-curable silicone compositions are typically cured at room temperature or an elevated temperature. Depending on the particular formulation, radiation-curable silicone compositions are typically cured by exposure to radiation, for example, ultraviolet light, gamma rays, or electron beams.
The particular embodiments disclosed above are illustrative only, as the invention may be modified and practiced in different but equivalent manners apparent to those skilled in the art having the benefit of the teachings herein. Furthermore, no limitations are intended to the details of construction or design herein shown, other than as described in the claims below. It is therefore evident that the particular embodiments disclosed above may be altered or modified and all such variations are considered within the scope and spirit of the invention. Accordingly, the protection sought herein is as set forth in the claims below.
Claims
1. An elastomeric stamp or mold formed by a process comprising: depositing a curable fluorine-containing polyalkylmethylsiloxane composition adjacent a master pattern; curing, at least partially, the curable fluorine-containing polyalkylmethylsiloxane composition; and removing said at least partially cured fluorine-containing polyalkylmethylsiloxane composition from the master pattern.
2. The elastomeric stamp or mold formed by the process of claim 1, wherein the process comprises forming the curable fluorine-containing polyalkylmethylsiloxane composition by combining a curable silicone-containing composition and a fluorine-containing composition such that a surface energy of said at least partially cured fluorine-containing polyalkylmethylsiloxane composition is lower than a surface energy of the at least partially cured silicone-containing composition.
3. The elastomeric stamp or mold formed by the process of claim 2, wherein combining the curable silicone-containing composition and the fluorine-containing composition comprises combining dimethylvinyl-terminated siloxane resin, dimethylvinyl-terminated polydimethylsiloxane polymer, dimethylvinyl-terminated (trifluoropropylmethyl)-co- (dimethyl) siloxane, Karstedt's catalyst, 5-hexenyldimethyl-terminated polydimethylsiloxane, dimethylhydrogen-terminated siloxane resins, and tetramethyl-tetravinyl-tetracyclosiloxane.
4. The elastomeric stamp or mold formed by the process of claim 2, wherein combining the curable silicone-containing composition and the fluorine-containing composition comprises combining dimethylvinyl-terminated siloxane resin, dimethylvinyl-terminated polydimethylsiloxane polymer, dimethylvinyl-terminated (trifluoropropylmethyl)-co- (dimethyl) siloxane, Karstedt's catalyst, 5-hexenyldimethyl-terminated polydimethylsiloxane, dimethylhydrogen-terminated siloxane resins, diemthylhydrogen-terminated
(trifluoropropyl)-co-(dimethyl)siloxane, and tetramethyl-tetravinyl-tetracyclosiloxane.
5. The elastomeric stamp or mold formed by the process of claim 2, wherein combining the curable silicone-containing composition and the fluorine-containing composition comprises combining dimethylvinyl-terminated siloxane resin, dimethylvinyl-terminated polydimethylsiloxane polymer, Karstedt's catalyst, 5-hexenyldimethyl-terminated polydimethylsiloxane, dimethylhydrogen-terminated siloxane resins, diemthylhydrogen- terminated (trifluoropropyl)-co-(dimethyl)siloxane, and tetramethyl-tetravinyl- tetracyclosiloxane.
6. The elastomeric stamp or mold formed by the process of claim 2, wherein combining the curable silicone-containing composition and the fluorine-containing composition comprises combining dimethylvinyl-terminated siloxane resin, dimethylvinyl-terminated polydimethylsiloxane polymer, Karstedt's catalyst, tetramethyl-tetravinyl-tetracyclosiloxane, and trimethyl-terminated (perfluorobutylethylmethyl)-co-(methylhydrogen) siloxane polymer.
7. The elastomeric stamp or mold formed by the process of claim 2, wherein forming the curable fluorine-containing polyalkylmethylsiloxane composition comprises combining the curable silicone-containing composition and the fluorine-containing composition such that a modulus of said at least partially cured fluorine-containing polyalkylmethylsiloxane composition is higher than a modulus of the at least partially cured silicone-containing composition.
8. The elastomeric stamp or mold formed by the process of claim 7, wherein combining the curable silicone-containing composition and the fluorine-containing composition comprises combining the curable silicone-containing composition and the fluorine-containing composition such that crosslinking of said at least partially cured fluorine-containing polyalkylmethylsiloxane composition is higher than crosslinking of the at least partially cured silicone-containing composition.
9. The elastomeric stamp or mold formed by the process of claim 7, wherein combining the curable silicone-containing composition and the fluorine-containing composition comprises combining dimethylvinyl-terminated siloxane resin, Tetrakis (omega- dimethylvinylpolydimethylsiloxy) silane, Karstedt's catalyst, tetramethyl-tetravinyl- tetracyclosiloxane, trimethyl-terminated (perfluorobutylethylmethyl)-co-(methylhydrogen) siloxane polymer.
10. The elastomeric stamp or mold formed by the process of claim 1, wherein curing, at least partially, the curable fluorine-containing polyalkylmethylsiloxane composition comprises: degassing the curable fluorine-containing polyalkylmethylsiloxane composition; and curing the curable fluorine-containing polyalkylmethylsiloxane composition by applying heat.
11. The elastomeric stamp or mold formed by the process of claim 1, wherein depositing the curable fluorine-containing polyalkylmethylsiloxane composition adjacent the master pattern comprises depositing the curable fluorine-containing polyalkylmethylsiloxane composition adjacent a master pattern having micron-scale structures formed therein or thereon.
12. A method, comprising: depositing a curable fluorine-containing polyalkylmethylsiloxane composition adjacent a master pattern; curing, at least partially, the curable fluorine-containing polyalkylmethylsiloxane composition; and removing said at least partially cured fluorine-containing polyalkylmethylsiloxane composition from the master pattern.
13. The method of claim 12, comprising forming the curable fluorine-containing polyalkylmethylsiloxane composition by combining a curable silicone-containing composition and a fluorine-containing composition such that a surface energy of said at least partially cured fluorine-containing polyalkylmethylsiloxane composition is lower than a surface energy of the at least partially cured silicone-containing composition.
14. The method of claim 13, wherein combining the curable silicone-containing composition and the fluorine-containing composition comprises combining dimethylvinyl- terminated siloxane resin, dimethylvinyl-terminated polydimethylsiloxane polymer, dimethylvinyl-terminated (trifluoropropylmethyl)-co-(dimethyl) siloxane, Karstedt's catalyst, 5-hexenyldimethyl-terminated polydimethylsiloxane, dimethylhydrogen-terminated siloxane resins, and tetramethyl-tetravinyl-tetracyclosiloxane.
15. The method of claim 13, wherein combining the curable silicone-containing composition and the fluorine-containing composition comprises combining dimethylvinyl- terminated siloxane resin, dimethylvinyl-terminated polydimethylsiloxane polymer, dimethylvinyl-terminated (trifluoropropylmethyl)-co-(dimethyl) siloxane, Karstedt's catalyst, 5-hexenyldimethyl-terminated polydimethylsiloxane, dimethylhydrogen-terminated siloxane resins, diemthylhydrogen-terminated (trifluoropropyl)-co-(dimethyl)siloxane, and tetramethyl-tetravinyl-tetracyclosiloxane.
16. The method of claim 13, wherein combining the curable silicone-containing composition and the fluorine-containing composition comprises combining dimethylvinyl- terminated siloxane resin, dimethylvinyl-terminated polydimethylsiloxane polymer, Karstedt's catalyst, 5-hexenyldimethyl-terminated polydimethylsiloxane, dimethylhydrogen- terminated siloxane resins, diemthylhydrogen-terminated (trifluoropropyl)-co-
(dimethyl)siloxane, and tetramethyl-tetravinyl-tetracyclosiloxane.
17. The method of claim 13, wherein combining the curable silicone-containing composition and the fluorine-containing composition comprises combining dimethylvinyl- terminated siloxane resin, dimethylvinyl-terminated polydimethylsiloxane polymer, Karstedt's catalyst, tetramethyl-tetravinyl-tetracyclosiloxane, and trimethyl-terminated (perfluorobutylethylmethyl)-co-(methylhydrogen) siloxane polymer.
18. The method of claim 13, wherein forming the curable fluorine-containing polyalkylmethylsiloxane composition comprises combining the curable silicone-containing composition and the fluorine-containing composition such that a modulus of said at least partially cured fluorine-containing polyalkylmethylsiloxane composition is higher than a modulus of the at least partially cured silicone-containing composition.
19. The method of claim 18, wherein combining the curable silicone-containing composition and the fluorine-containing composition comprises combining the curable silicone-containing composition and the fluorine-containing composition such that crosslinking of said at least partially cured fluorine-containing polyalkylmethylsiloxane composition is higher than crosslinking of the at least partially cured silicone-containing composition.
20. The method of claim 18, wherein combining the curable silicone-containing composition and the fluorine-containing composition comprises combining dimethylvinyl- terminated siloxane resin, Tetrakis (omega-dimethylvinylpolydimethylsiloxy) silane,
Karstedt's catalyst, tetramethyl-tetravinyl-tetracyclosiloxane, trimethyl-terminated (perfluorobutylethylmethyl)-co-(methylhydrogen) siloxane polymer.
21. The method of claim 12, wherein curing, at least partially, the curable fluorine- containing polyalkylmethylsiloxane composition comprises: degassing the curable fluorine-containing polyalkylmethylsiloxane composition; and curing the curable fluorine-containing polyalkylmethylsiloxane composition by applying heat.
22. The method of claim 12, wherein depositing the curable fluorine-containing polyalkylmethylsiloxane composition adjacent the master pattern comprises depositing the curable fluorine-containing polyalkylmethylsiloxane composition adjacent a master pattern having micron-scale structures formed therein or thereon.
23. The method of claim 12, comprising forming at least one structure using said at least partially cured fluorine-containing polyalkylmethylsiloxane composition.
24. The method of claim 23, wherein forming said at least one structure comprises forming said at least one structure using said at least partially cured fluorine-containing polyalkylmethylsiloxane composition as at least one of a stamp and a mold.
25. An apparatus, comprising: at least one of a stamp and a mold comprising a curable fluorine-containing polyalkylmethylsiloxane composition cured, at least partially, while adjacent a master pattern.
26. The apparatus of claim 25, wherein said stamp or mold comprises a curable fluorine- containing polyalkylmethylsiloxane composition formed by combining a curable silicone- containing composition and a fluorine-containing composition such that a surface energy of said at least partially cured fluorine-containing polyalkylmethylsiloxane composition is lower than a surface energy of the at least partially cured silicone-containing composition.
27. The apparatus of claim 26, wherein said stamp or mold comprises a curable fluorine- containing polyalkylmethylsiloxane composition formed by combining dimethylvinyl- terminated siloxane resin, dimethylvinyl-terminated polydimethylsiloxane polymer, dimethylvinyl-terminated (trifluoropropylmethyl)-co-(dimethyl) siloxane, Karstedt's catalyst,
5-hexenyldimethyl-terminated polydimethylsiloxane, dimethylhydrogen-terminated siloxane resins, and tetramethyl-tetravinyl-tetracyclosiloxane.
28. The apparatus of claim 26, wherein said stamp or mold comprises a curable fluorine- containing polyalkylmethylsiloxane composition formed by combining dimethylvinyl- terminated siloxane resin, dimethylvinyl-terminated polydimethylsiloxane polymer, dimethylvinyl-terminated (trifluoropropylmethyl)-co-(dimethyl) siloxane, Karstedt's catalyst, 5-hexenyldimethyl-terminated polydimethylsiloxane, dimethylhydrogen-terminated siloxane resins, diemthylhydrogen-terminated (trifluoropropyl)-co-(dimethyl)siloxane, and tetramethyl-tetravinyl-tetracyclosiloxane.
29. The apparatus of claim 26, wherein said stamp or mold comprises a curable fluorine- containing polyalkylmethylsiloxane composition formed by combining dimethylvinyl- terminated siloxane resin, dimethylvinyl-terminated polydimethylsiloxane polymer, Karstedt's catalyst, 5-hexenyldimethyl-terminated polydimethylsiloxane, dimethylhydrogen- terminated siloxane resins, diemthylhydrogen-terminated (trifluoropropyl)-co- (dimethyl)siloxane, and tetramethyl-tetravinyl-tetracyclosiloxane.
30. The apparatus of claim 26, wherein said stamp or mold comprises a curable fluorine- containing polyalkylmethylsiloxane composition formed by combining dimethylvinyl- terminated siloxane resin, dimethylvinyl-terminated polydimethylsiloxane polymer, Karstedt's catalyst, tetramethyl-tetravinyl-tetracyclosiloxane, and trimethyl-terminated (perfluorobutylethylmethyl)-co-(methylhydrogen) siloxane polymer.
31. The apparatus of claim 26, wherein said stamp or mold comprises a curable fluorine- containing polyalkylmethylsiloxane composition formed by combining the curable silicone- containing composition and the fluorine-containing composition such that a modulus of said at least partially cured fluorine-containing polyalkylmethylsiloxane composition is higher than a modulus of the at least partially cured silicone-containing composition.
32. The apparatus of claim 31, wherein said stamp or mold comprises a curable fluorine- containing polyalkylmethylsiloxane composition formed by combining the curable silicone- containing composition and the fluorine-containing composition such that crosslinking of said at least partially cured fluorine-containing polyalkylmethylsiloxane composition is higher than crosslinking of the at least partially cured silicone-containing composition.
33. The apparatus of claim 31, wherein said stamp or mold comprises a curable fluorine- containing polyalkylmethylsiloxane composition formed by combining dimethylvinyl- terminated siloxane resin, Tetrakis (omega-dimethylvinylpolydimethylsiloxy) silane, Karstedt's catalyst, tetramethyl-tetravinyl-tetracyclosiloxane, trimethyl-terminated (perfluorobutylethylmethyl)-co-(methylhydrogen) siloxane polymer.
34. The method of claim 25, wherein the master pattern has micron-scale structures formed therein or thereon.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US88939207P | 2007-02-12 | 2007-02-12 | |
| US60/889,392 | 2007-02-12 |
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| WO2008106245A2 true WO2008106245A2 (en) | 2008-09-04 |
| WO2008106245A3 WO2008106245A3 (en) | 2008-12-24 |
| WO2008106245A8 WO2008106245A8 (en) | 2009-11-12 |
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| PCT/US2008/051124 WO2008106245A2 (en) | 2007-02-12 | 2008-01-16 | Method of forming soft lithographic molds with fluorine modified elastomers |
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| WO2008106245A3 (en) | 2008-12-24 |
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