WO2008106245A8 - Method of forming soft lithographic molds with fluorine modified elastomers - Google Patents

Method of forming soft lithographic molds with fluorine modified elastomers Download PDF

Info

Publication number
WO2008106245A8
WO2008106245A8 PCT/US2008/051124 US2008051124W WO2008106245A8 WO 2008106245 A8 WO2008106245 A8 WO 2008106245A8 US 2008051124 W US2008051124 W US 2008051124W WO 2008106245 A8 WO2008106245 A8 WO 2008106245A8
Authority
WO
WIPO (PCT)
Prior art keywords
fluorine modified
soft lithographic
forming soft
modified elastomers
polyalkylmethylsiloxane
Prior art date
Application number
PCT/US2008/051124
Other languages
French (fr)
Other versions
WO2008106245A2 (en
WO2008106245A3 (en
Inventor
Anne Shim
Rob Drake
Avril Surgenor
Wei Chen
Brian Harkness
Dongchan Ahn
Samantha Reed
Original Assignee
Dow Corning Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corporation filed Critical Dow Corning Corporation
Publication of WO2008106245A2 publication Critical patent/WO2008106245A2/en
Publication of WO2008106245A3 publication Critical patent/WO2008106245A3/en
Publication of WO2008106245A8 publication Critical patent/WO2008106245A8/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds

Abstract

The present invention provides an elastomeric stamp or mold. The elastomeric stamp or mold may be formed by a process including depositing a curable fluorine-containing polyalkylmethylsiloxane composition adjacent a master pattern and curing, at least partially, the curable fluorine-containing polyalkylmethylsiloxane composition. The process may also include removing the at least partially cured fluorine-containing polyalkylmethylsiloxane composition from the master pattern.
PCT/US2008/051124 2007-02-12 2008-01-16 Method of forming soft lithographic molds with fluorine modified elastomers WO2008106245A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US88939207P 2007-02-12 2007-02-12
US60/889,392 2007-02-12

Publications (3)

Publication Number Publication Date
WO2008106245A2 WO2008106245A2 (en) 2008-09-04
WO2008106245A3 WO2008106245A3 (en) 2008-12-24
WO2008106245A8 true WO2008106245A8 (en) 2009-11-12

Family

ID=39721811

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/051124 WO2008106245A2 (en) 2007-02-12 2008-01-16 Method of forming soft lithographic molds with fluorine modified elastomers

Country Status (1)

Country Link
WO (1) WO2008106245A2 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10217089A1 (en) * 2002-04-17 2003-10-30 Inst Neue Mat Gemein Gmbh Transfer process for the production of microstructured substrates
US20050167894A1 (en) * 2002-10-08 2005-08-04 Wu-Sheng Shih Patterned structure reproduction using nonsticking mold
KR101154209B1 (en) * 2003-11-17 2012-06-18 다우 코닝 코포레이션 Method of embossing cured silicone resin substrates
CA2847260C (en) * 2003-12-19 2016-06-21 The University Of North Carolina At Chapel Hill Methods for fabricating isolated micro- and nano- structures using soft or imprint lithography
JP2008512281A (en) * 2004-09-13 2008-04-24 ダウ・コーニング・コーポレイション Lithographic techniques using silicone molds
EP1700680A1 (en) * 2005-03-09 2006-09-13 EPFL Ecole Polytechnique Fédérale de Lausanne Easy release fluoropolymer molds for micro- and nano-pattern replication

Also Published As

Publication number Publication date
WO2008106245A2 (en) 2008-09-04
WO2008106245A3 (en) 2008-12-24

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