JP2009517498A - 異方性の導電性接着剤組成物 - Google Patents
異方性の導電性接着剤組成物 Download PDFInfo
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- JP2009517498A JP2009517498A JP2008542330A JP2008542330A JP2009517498A JP 2009517498 A JP2009517498 A JP 2009517498A JP 2008542330 A JP2008542330 A JP 2008542330A JP 2008542330 A JP2008542330 A JP 2008542330A JP 2009517498 A JP2009517498 A JP 2009517498A
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- adhesive composition
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- curing agent
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Classifications
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
- C08G59/5086—Triazines; Melamines; Guanamines
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/02—Elements
- C08K3/08—Metals
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Adhesive Tapes (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US73956905P | 2005-11-23 | 2005-11-23 | |
| PCT/US2006/043198 WO2007061613A1 (en) | 2005-11-23 | 2006-11-07 | Anisotropic conductive adhesive compositions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009517498A true JP2009517498A (ja) | 2009-04-30 |
| JP2009517498A5 JP2009517498A5 (enExample) | 2010-01-07 |
Family
ID=38067528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008542330A Pending JP2009517498A (ja) | 2005-11-23 | 2006-11-07 | 異方性の導電性接着剤組成物 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20070116961A1 (enExample) |
| EP (1) | EP1951836B1 (enExample) |
| JP (1) | JP2009517498A (enExample) |
| KR (1) | KR20080070680A (enExample) |
| CN (1) | CN101313045A (enExample) |
| AT (1) | ATE524533T1 (enExample) |
| TW (1) | TW200722497A (enExample) |
| WO (1) | WO2007061613A1 (enExample) |
Cited By (4)
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|---|---|---|---|---|
| JP2011181525A (ja) * | 2011-06-09 | 2011-09-15 | Sony Chemical & Information Device Corp | 異方性導電材料 |
| JP2013227441A (ja) * | 2012-04-26 | 2013-11-07 | Toagosei Co Ltd | 接着剤組成物並びにこれを用いたカバーレイフィルム及び接着シート |
| US10524364B2 (en) | 2009-07-08 | 2019-12-31 | Henkel Ag & Co. Kgaa | Electrically conductive adhesives |
| JPWO2022270154A1 (enExample) * | 2021-06-21 | 2022-12-29 |
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| GB0806434D0 (en) | 2008-04-09 | 2008-05-14 | Zephyros Inc | Improvements in or relating to structural adhesives |
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| CN104877611B (zh) * | 2009-11-17 | 2020-04-10 | 日立化成株式会社 | 电路连接材料、使用其的连接结构体、临时压接方法以及应用 |
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| US20130146816A1 (en) * | 2010-04-19 | 2013-06-13 | Trillion Science Inc. | One part epoxy resin including acrylic block copolymer |
| JP5761639B2 (ja) * | 2010-09-30 | 2015-08-12 | 日本発條株式会社 | 接着剤樹脂組成物、その硬化物、及び接着剤フィルム |
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| JP2018131569A (ja) * | 2017-02-16 | 2018-08-23 | パナソニックＩｐマネジメント株式会社 | 導電性粒子を含む樹脂組成物 |
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| CN110938402A (zh) * | 2019-12-18 | 2020-03-31 | 湖南省和祥润新材料有限公司 | 一种阻燃型光固化胶及其制备方法 |
| KR20240037322A (ko) * | 2021-07-23 | 2024-03-21 | 클라라 푸드즈 컴퍼니 | 단백질 조성물 및 제조 방법 |
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- 2006-11-07 WO PCT/US2006/043198 patent/WO2007061613A1/en not_active Ceased
- 2006-11-07 EP EP20060827563 patent/EP1951836B1/en not_active Not-in-force
- 2006-11-07 JP JP2008542330A patent/JP2009517498A/ja active Pending
- 2006-11-07 AT AT06827563T patent/ATE524533T1/de not_active IP Right Cessation
- 2006-11-07 KR KR1020087012201A patent/KR20080070680A/ko not_active Abandoned
- 2006-11-07 CN CNA2006800439826A patent/CN101313045A/zh active Pending
- 2006-11-22 TW TW095143287A patent/TW200722497A/zh unknown
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| JP2000509425A (ja) * | 1996-05-16 | 2000-07-25 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 接着剤組成物と使用方法 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10524364B2 (en) | 2009-07-08 | 2019-12-31 | Henkel Ag & Co. Kgaa | Electrically conductive adhesives |
| JP2011181525A (ja) * | 2011-06-09 | 2011-09-15 | Sony Chemical & Information Device Corp | 異方性導電材料 |
| JP2013227441A (ja) * | 2012-04-26 | 2013-11-07 | Toagosei Co Ltd | 接着剤組成物並びにこれを用いたカバーレイフィルム及び接着シート |
| JPWO2022270154A1 (enExample) * | 2021-06-21 | 2022-12-29 | ||
| WO2022270154A1 (ja) * | 2021-06-21 | 2022-12-29 | シーカ・ハマタイト株式会社 | 電磁鋼板積層用接着剤組成物 |
| JP7660675B2 (ja) | 2021-06-21 | 2025-04-11 | シーカ・ジャパン株式会社 | 電磁鋼板積層用接着剤組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101313045A (zh) | 2008-11-26 |
| EP1951836A1 (en) | 2008-08-06 |
| EP1951836B1 (en) | 2011-09-14 |
| TW200722497A (en) | 2007-06-16 |
| WO2007061613A1 (en) | 2007-05-31 |
| KR20080070680A (ko) | 2008-07-30 |
| ATE524533T1 (de) | 2011-09-15 |
| EP1951836A4 (en) | 2010-06-09 |
| US20070116961A1 (en) | 2007-05-24 |
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