JP2009242733A - エネルギー線硬化型重合体、エネルギー線硬化型粘着剤組成物、粘着シートおよび半導体ウエハの加工方法 - Google Patents
エネルギー線硬化型重合体、エネルギー線硬化型粘着剤組成物、粘着シートおよび半導体ウエハの加工方法 Download PDFInfo
- Publication number
- JP2009242733A JP2009242733A JP2008093897A JP2008093897A JP2009242733A JP 2009242733 A JP2009242733 A JP 2009242733A JP 2008093897 A JP2008093897 A JP 2008093897A JP 2008093897 A JP2008093897 A JP 2008093897A JP 2009242733 A JP2009242733 A JP 2009242733A
- Authority
- JP
- Japan
- Prior art keywords
- group
- energy
- sensitive adhesive
- pressure
- energy ray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000642 polymer Polymers 0.000 title claims abstract description 89
- 239000000853 adhesive Substances 0.000 title claims abstract description 73
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 73
- 239000000203 mixture Substances 0.000 title claims abstract description 36
- 239000004065 semiconductor Substances 0.000 title claims description 37
- 238000003672 processing method Methods 0.000 title description 4
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 10
- 230000005284 excitation Effects 0.000 claims abstract description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 108
- 239000000178 monomer Substances 0.000 claims description 52
- 150000001875 compounds Chemical class 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 33
- 239000010410 layer Substances 0.000 claims description 29
- 238000000227 grinding Methods 0.000 claims description 28
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 19
- 239000003999 initiator Substances 0.000 claims description 16
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 125000001424 substituent group Chemical group 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 8
- 230000020169 heat generation Effects 0.000 claims description 7
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 claims description 3
- 150000003384 small molecules Chemical class 0.000 abstract description 23
- 230000000977 initiatory effect Effects 0.000 abstract 1
- 230000008016 vaporization Effects 0.000 abstract 1
- 238000009834 vaporization Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 78
- -1 acryloyl monoisocyanate compound Chemical class 0.000 description 43
- 150000003254 radicals Chemical class 0.000 description 41
- 125000000524 functional group Chemical group 0.000 description 32
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 30
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 19
- 239000012948 isocyanate Substances 0.000 description 15
- 239000007787 solid Substances 0.000 description 15
- 229920006243 acrylic copolymer Polymers 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 10
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 206010040844 Skin exfoliation Diseases 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000003505 polymerization initiator Substances 0.000 description 6
- 229920002635 polyurethane Polymers 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 239000012986 chain transfer agent Substances 0.000 description 5
- 238000011109 contamination Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 4
- 239000005977 Ethylene Substances 0.000 description 4
- 239000003522 acrylic cement Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 239000003431 cross linking reagent Substances 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229920001684 low density polyethylene Polymers 0.000 description 4
- 239000004702 low-density polyethylene Substances 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 239000005056 polyisocyanate Substances 0.000 description 4
- 229920001228 polyisocyanate Polymers 0.000 description 4
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 4
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 3
- ZOKCNEIWFQCSCM-UHFFFAOYSA-N (2-methyl-4-phenylpent-4-en-2-yl)benzene Chemical compound C=1C=CC=CC=1C(C)(C)CC(=C)C1=CC=CC=C1 ZOKCNEIWFQCSCM-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920005862 polyol Polymers 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 239000013585 weight reducing agent Substances 0.000 description 3
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 2
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 2
- JEHFRMABGJJCPF-UHFFFAOYSA-N 2-methylprop-2-enoyl isocyanate Chemical compound CC(=C)C(=O)N=C=O JEHFRMABGJJCPF-UHFFFAOYSA-N 0.000 description 2
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 229920010126 Linear Low Density Polyethylene (LLDPE) Polymers 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- MOYAFQVGZZPNRA-UHFFFAOYSA-N Terpinolene Chemical compound CC(C)=C1CCC(C)=CC1 MOYAFQVGZZPNRA-UHFFFAOYSA-N 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 239000002998 adhesive polymer Substances 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 125000005529 alkyleneoxy group Chemical group 0.000 description 2
- HXBPYFMVGFDZFT-UHFFFAOYSA-N allyl isocyanate Chemical compound C=CCN=C=O HXBPYFMVGFDZFT-UHFFFAOYSA-N 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 description 2
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- FFBZKUHRIXKOSY-UHFFFAOYSA-N aziridine-1-carboxamide Chemical compound NC(=O)N1CC1 FFBZKUHRIXKOSY-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 229920001038 ethylene copolymer Polymers 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 229920000554 ionomer Polymers 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920001083 polybutene Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920006289 polycarbonate film Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920000306 polymethylpentene Polymers 0.000 description 2
- 239000011116 polymethylpentene Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920006264 polyurethane film Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 235000010265 sodium sulphite Nutrition 0.000 description 2
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical class OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- FWWWRCRHNMOYQY-UHFFFAOYSA-N 1,5-diisocyanato-2,4-dimethylbenzene Chemical compound CC1=CC(C)=C(N=C=O)C=C1N=C=O FWWWRCRHNMOYQY-UHFFFAOYSA-N 0.000 description 1
- VDHIZYRFJQOFIN-UHFFFAOYSA-N 1-(2-benzoylphenyl)-2-methylprop-2-en-1-one Chemical compound CC(=C)C(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 VDHIZYRFJQOFIN-UHFFFAOYSA-N 0.000 description 1
- VEQCTDMBEVLHOF-UHFFFAOYSA-N 1-(2-benzoylphenyl)prop-2-en-1-one Chemical compound C=CC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 VEQCTDMBEVLHOF-UHFFFAOYSA-N 0.000 description 1
- IEWGRTFWNVFOTR-UHFFFAOYSA-N 1-(4-benzoylphenyl)-2-methylprop-2-en-1-one Chemical compound C1=CC(C(=O)C(=C)C)=CC=C1C(=O)C1=CC=CC=C1 IEWGRTFWNVFOTR-UHFFFAOYSA-N 0.000 description 1
- WQIONEQXRNRAST-UHFFFAOYSA-N 1-(4-benzoylphenyl)prop-2-en-1-one Chemical compound C1=CC(C(=O)C=C)=CC=C1C(=O)C1=CC=CC=C1 WQIONEQXRNRAST-UHFFFAOYSA-N 0.000 description 1
- LGJCFVYMIJLQJO-UHFFFAOYSA-N 1-dodecylperoxydodecane Chemical compound CCCCCCCCCCCCOOCCCCCCCCCCCC LGJCFVYMIJLQJO-UHFFFAOYSA-N 0.000 description 1
- LFSYUSUFCBOHGU-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatophenyl)methyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=CC=C1N=C=O LFSYUSUFCBOHGU-UHFFFAOYSA-N 0.000 description 1
- TZJQCUDHKUWEFU-UHFFFAOYSA-N 2,2-dimethylpentanenitrile Chemical compound CCCC(C)(C)C#N TZJQCUDHKUWEFU-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- OWHSTLLOZWTNTQ-UHFFFAOYSA-N 2-ethylhexyl 2-sulfanylacetate Chemical compound CCCCC(CC)COC(=O)CS OWHSTLLOZWTNTQ-UHFFFAOYSA-N 0.000 description 1
- NJRHMGPRPPEGQL-UHFFFAOYSA-N 2-hydroxybutyl prop-2-enoate Chemical compound CCC(O)COC(=O)C=C NJRHMGPRPPEGQL-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- KBXUTBMGSKKPFL-UHFFFAOYSA-N 3-hydroxy-2-methylprop-2-enoic acid Chemical compound OC=C(C)C(O)=O KBXUTBMGSKKPFL-UHFFFAOYSA-N 0.000 description 1
- WHNPOQXWAMXPTA-UHFFFAOYSA-N 3-methylbut-2-enamide Chemical compound CC(C)=CC(N)=O WHNPOQXWAMXPTA-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- LLZBYENODCOTTL-UHFFFAOYSA-N C(C=C)(=O)CCOC1=C(C(=O)C2=CC=CC=C2)C=CC=C1 Chemical compound C(C=C)(=O)CCOC1=C(C(=O)C2=CC=CC=C2)C=CC=C1 LLZBYENODCOTTL-UHFFFAOYSA-N 0.000 description 1
- 241001050985 Disco Species 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- GWGWXYUPRTXVSY-UHFFFAOYSA-N N=C=O.N=C=O.CC1=CC=C(C)C=C1 Chemical compound N=C=O.N=C=O.CC1=CC=C(C)C=C1 GWGWXYUPRTXVSY-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- VTXVGVNLYGSIAR-UHFFFAOYSA-N decane-1-thiol Chemical compound CCCCCCCCCCS VTXVGVNLYGSIAR-UHFFFAOYSA-N 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- GFJVXXWOPWLRNU-UHFFFAOYSA-N ethenyl formate Chemical compound C=COC=O GFJVXXWOPWLRNU-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- RJLZSKYNYLYCNY-UHFFFAOYSA-N ethyl carbamate;isocyanic acid Chemical group N=C=O.CCOC(N)=O RJLZSKYNYLYCNY-UHFFFAOYSA-N 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- YDNLNVZZTACNJX-UHFFFAOYSA-N isocyanatomethylbenzene Chemical compound O=C=NCC1=CC=CC=C1 YDNLNVZZTACNJX-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 1
- SJPFBRJHYRBAGV-UHFFFAOYSA-N n-[[3-[[bis(oxiran-2-ylmethyl)amino]methyl]phenyl]methyl]-1-(oxiran-2-yl)-n-(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC=1C=C(CN(CC2OC2)CC2OC2)C=CC=1)CC1CO1 SJPFBRJHYRBAGV-UHFFFAOYSA-N 0.000 description 1
- DKGCZVJEVNZACI-UHFFFAOYSA-N n-[[5-[[bis(oxiran-2-ylmethyl)amino]methyl]-5-methylcyclohexa-1,3-dien-1-yl]methyl]-1-(oxiran-2-yl)-n-(oxiran-2-ylmethyl)methanamine Chemical compound C1C(CN(CC2OC2)CC2OC2)=CC=CC1(C)CN(CC1OC1)CC1CO1 DKGCZVJEVNZACI-UHFFFAOYSA-N 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- ZVEZMVFBMOOHAT-UHFFFAOYSA-N nonane-1-thiol Chemical compound CCCCCCCCCS ZVEZMVFBMOOHAT-UHFFFAOYSA-N 0.000 description 1
- YRIQTCODFIJDKE-UHFFFAOYSA-N nonyl 2-sulfanylacetate Chemical compound CCCCCCCCCOC(=O)CS YRIQTCODFIJDKE-UHFFFAOYSA-N 0.000 description 1
- KZCOBXFFBQJQHH-UHFFFAOYSA-N octane-1-thiol Chemical compound CCCCCCCCS KZCOBXFFBQJQHH-UHFFFAOYSA-N 0.000 description 1
- MADOXCFISYCULS-UHFFFAOYSA-N octyl 2-sulfanylacetate Chemical compound CCCCCCCCOC(=O)CS MADOXCFISYCULS-UHFFFAOYSA-N 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000036314 physical performance Effects 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 238000007717 redox polymerization reaction Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- IUCJMVBFZDHPDX-UHFFFAOYSA-N tretamine Chemical compound C1CN1C1=NC(N2CC2)=NC(N2CC2)=N1 IUCJMVBFZDHPDX-UHFFFAOYSA-N 0.000 description 1
- 229950001353 tretamine Drugs 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/14—Methyl esters, e.g. methyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
- C08F220/302—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety and two or more oxygen atoms in the alcohol moiety
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Abstract
【解決手段】 本発明に係るエネルギー線硬化型重合体は、主鎖または側鎖に、エネルギー線による励起下で重合反応を開始させるラジカル発生基、およびエネルギー線重合性基が結合されてなることを特徴としている。
【選択図】 なし
Description
回路やウエハ本体へのダメージを防止すること、
剥離後の回路上に粘着剤が残留(糊残り)しないこと、
裏面研削時に発生する研削屑の洗い流しや研削時に発生する熱を除去するための研削水が回路面に浸入することを防止すること、
研削後のウエハの厚み精度を充分に保つこと、などが要求される。
ダイシング時にはウエハを充分な接着力で保持できること、
チップのピックアップ時には、チップをダイシングテープから容易に剥離できること、
ピックアップされたチップ裏面に粘着剤が残留しないこと、
ダイシング時の切削水によって、粘着剤層に含まれる低分子量化合物が流失しないこと、などが要求される。
本発明に用いられるラジカル発生基含有モノマーは、本発明のエネルギー線硬化型重合体のラジカル発生基を誘導するモノマーとなる。該モノマーは、重合性の二重結合と、エネルギー線による励起下で重合反応を開始させる遊離基(ラジカル)を発生する基(ラジカル発生基)を有する。ラジカル発生基としては、例えば下記一般式で示されるような芳香環に置換基を有していてもよいフェニルカルボニル基を含む基が使用できる。
このようなラジカル発生基含有モノマーは、例えばラジカル発生基を有する化合物と、重合性の二重結合を有する化合物との付加反応によって得られる。
ラジカル発生基含有重合体(a1)は、前述したラジカル発生基含有モノマーと、エネルギー線重合性基を導入するための官能基含有モノマーと、必要に応じてその他のモノマーを重合してなる。
ラジカル発生基含有重合体(a1)を構成する官能基含有モノマーは、本発明のエネルギー線硬化型重合体にエネルギー線重合性基を導入するためのモノマーであり、重合性の二重結合と、ヒドロキシ基、カルボキシル基、アミノ基、置換アミノ基、エポキシ基等の官能基を分子内に有するモノマーであり、好ましくはヒドロキシ基含有不飽和化合物、カルボキシル基含有不飽和化合物が用いられる。
ラジカル発生基含有重合体(a1)を構成するその他のモノマーとしては特に限定はされないが、重合体としては例えばアクリル系モノマーを主体として用いたアクリル系共重合体や、オレフィン系モノマーを主体として用いたオレフィン系共重合体などが考えられる。本発明のエネルギー線硬化型重合体を粘着剤として用いるのであれば、比較的粘着力の制御が容易な各種のアクリル系共重合体が好ましく、種々のアクリル系モノマーが構成単位として用いられる。
ラジカル発生基含有重合体(a1)は、前述したラジカル発生基含有モノマーと、官能基含有モノマーと、必要に応じてその他のモノマーを重合してなる。
本発明のエネルギー線硬化型重合体(A)は、前述のラジカル発生基含有重合体(a1)の官能基含有モノマー由来の官能基に、エネルギー線重合性基含有化合物(a2)を反応させて得られる。
エネルギー線重合性基含有化合物(a2)には、ラジカル発生基含有重合体(a1)中の官能基と反応しうる置換基が含まれている。この置換基は前記官能基の種類により様々である。たとえば、官能基がヒドロキシ基またはカルボキシル基の場合、置換基としてはイソシアナート基、エポキシ基等が好ましく、官能基がカルボキシル基の場合、置換基としてはイソシアナート基、エポキシ基等が好ましく、官能基がアミノ基または置換アミノ基の場合、置換基としてはイソシアナート基等が好ましく、官能基がエポキシ基の場合、置換基としてはカルボキシル基が好ましい。このような置換基は、エネルギー線重合性基含有化合物(a2)1分子毎に一つずつ含まれている。
本発明のエネルギー線硬化型重合体(A)は、上記ラジカル発生基含有重合体(a1)と、該ラジカル発生基含有重合体(a1)に含まれる官能基に反応する置換基を有するエネルギー線重合性基含有化合物(a2)とを反応させることによって得られる。以下、エネルギー線硬化型重合体(A)の製法について特にアクリル系共重合体を主骨格とする例について詳述するが、本発明のエネルギー線硬化型重合体(A)は下記製法により得られるものに限定はされない。
本発明のエネルギー線硬化型重合体に、必要に応じて適当な添加剤を配合することにより、エネルギー線硬化型の粘着剤組成物が得られる。
架橋剤(B)としては例えば、有機多価イソシアナート化合物、有機多価エポキシ化合物、有機多価イミン化合物等があげられる。
上記のような架橋剤(B)の使用量は、エネルギー線硬化型重合体(A)100重量部に対して、好ましくは0.01〜20重量部、特に好ましくは0.1〜10重量部程度である。
本発明の粘着剤組成物より得られる粘着剤層が基材に塗布されることにより、本発明の粘着シートが得られる。また必要に応じて、粘着剤層を保護するために剥離フィルムを使用してもよい。
本発明の粘着シートに用いられる基材としては、特に限定はされないが例えばポリエチレンフィルム、ポリプロピレンフィルム、ポリブテンフィルム、ポリブタジエンフィルム、ポリメチルペンテンフィルム、ポリ塩化ビニルフィルム、塩化ビニル共重合体フィルム、ポリエチレンテレフタレートフィルム、ポリブチレンテレフタレートフィルム、ポリウレタンフィルム、エチレン酢ビフィルム、アイオノマー樹脂フィルム、エチレン・(メタ)アクリル酸共重合体フィルム、エチレン・(メタ)アクリル酸エステル共重合体フィルム、ポリスチレンフィルム、ポリカーボネートフィルム、フッ素樹脂フィルム、低密度ポリエチレン(LDPE)フィルム、直鎖低密度ポリエチレン(LLDPE)フィルム、およびその水添加物または変性物等からなるフィルムが用いられる。またこれらの架橋フィルムも用いられる。上記の基材は1種単独でもよいし、さらにこれらを2種類以上組み合わせた複合フィルムであってもよい。
剥離フィルムとしては、剥離性の表面を有する種々のフィルムが用いられる。このような剥離フィルムとしては、具体的には、ポリエチレンフィルム、ポリプロピレンフィルム、ポリブテンフィルム、ポリブタジエンフィルム、ポリメチルペンテンフィルム、ポリ塩化ビニルフィルム、塩化ビニル共重合体フィルム、ポリエチレンテレフタレートフィルム、ポリブチレンテレフタレートフィルム、ポリウレタンフィルム、エチレン酢ビフィルム、アイオノマー樹脂フィルム、エチレン・(メタ)アクリル酸共重合体フィルム、エチレン・(メタ)アクリル酸エステル共重合体フィルム、ポリスチレンフィルム、ポリカーボネートフィルム、フッ素樹脂フィルム、低密度ポリエチレン(LDPE)フィルム、直鎖低密度ポリエチレン(LLDPE)フィルム、およびその水添加物または変性物等からなるフィルムなどが用いられる。またこれらの架橋フィルムも用いられる。上記の基材は1種単独でもよいし、さらにこれらを2種類以上組み合わせた複合フィルムであってもよい。
本発明の粘着シートは、前述のエネルギー線硬化型粘着剤組成物と基材とからなる。本粘着シートは、該エネルギー線硬化型粘着剤をロールナイフコーター、コンマコーター、グラビアコーター、ダイコーター、リバースコーターなど一般に公知の方法にしたがって各種の基材上に適宜の厚さで塗工して乾燥させて粘着剤層を形成し、次いで必要に応じ粘着剤層上に剥離フィルムを貼り合わせることによって得られる。また粘着剤層を剥離フィルム上に設け、これを上記基材に転写することで製造してもよい。
本発明の粘着シートは、下記に示すように半導体ウエハの加工に用いることが出来る。
ウエハの裏面研削においては、表面に回路が形成された半導体ウエハの回路面にウエハ加工用粘着シートを貼付して回路面を保護しつつウエハの裏面を研削し、所定厚みのウエハとする。
また上記の裏面研削工程に続いて、ウエハ裏面に種々の加工が施されることがある。
本発明の粘着シートはエネルギー線照射により接着力が激減する性質を有するため、ダイシングシートとして使用することもできる。
(ラジカル発生基含有モノマーの合成)
1-[4-(2-ヒドロキシエトキシ)-フェニル]-2-ヒドロキシ-2-メチル-1-プロパン-1-オン(チバ・スペシャリティケミカルズ社製、イルガキュア2959)と、メタクリロイルオキシエチルイソシアナートとを等モル比で混合し、反応させてラジカル発生基含有モノマーを得た。
ブチルアクリレート57重量部、メチルメタクリレート10重量部、官能基含有モノマーとして2−ヒドロキシエチルアクリレート28重量部および上記で調製したラジカル発生基含有重合性モノマー5重量部を用いて酢酸エチル溶媒中で溶液重合し、アクリル系のラジカル発生基含有重合体を合成した。重合開始剤として2,2’−アゾビスイソブチロニトリル、連鎖移動剤として2,4−ジフェニル−4−メチル−1−ペンテンを用いた。(以下、特に記載が無ければ、ラジカル発生基含有重合体合成時の重合開始剤と連鎖移動剤は上記のものを使用)。
このアクリル系のラジカル発生基含有重合体固形分100重量部と、メタクリロイルオキシエチルイソシアナート30重量部(アクリル系のラジカル発生基含有重合体の官能基であるヒドロキシ基100当量に対して80当量)とを反応させ、重合性基およびラジカル発生基が結合してなる重量平均分子量630,000のアクリル系のエネルギー線硬化型重合体の酢酸エチル溶液(30%溶液)を得た。
このアクリル系のエネルギー線硬化型重合体100重量部に対し、架橋剤として多価イソシアナート化合物(日本ポリウレタン社製、コロネートL)0.625重量部(固形分)とを混合し、架橋されたアクリル系の粘着剤組成物を得た。
アクリル系の粘着剤組成物を、ロールナイフコーターを用いて、乾燥後の塗布厚が40μmとなるように、剥離シートとしてシリコーン剥離処理したポリエチレンテレフタレートフィルム(厚さ38μm)の剥離処理面に塗布し、100℃および120℃で2分間乾燥した後、得られた粘着剤層に、基材として厚さ110μmのポリエチレンフィルムを積層し、粘着シートを得た。粘着力の安定化のために23℃50%RHの雰囲気下に7日放置した後、下記の物性、および性能を評価した。
得られた粘着シートの粘着力を以下のように測定した。
上記粘着シートを、半導体ウエハの裏面研削時の表面保護シートとして用いた際の表面汚染性を以下のように評価した。
加熱後の重量減少率は、示差熱・熱重量同時測定装置(島津製作所(株)製、DTG−60)を用いて重量減少にて測定した。上記粘着シートの小片(0.01g、剥離フィルムは除去)を10℃/分で120℃まで昇温後、120℃、60分間加熱した後、常温に戻し、加熱前後での重量変化率により求めた。
ブチルアクリレート68.2重量部、ジメチルメタクリレート10重量部、2−ヒドロキシエチルアクリレート16.8重量部および実施例1で調製したラジカル発生基含有モノマー5重量部を用いて酢酸エチル溶媒中で溶液重合しアクリル系のラジカル発生基含有重合体を生成した。このラジカル発生基含有重合体の固形分100重量部と、メタクリロイルオキシエチルイソシアナート18.7重量部(ラジカル発生基含有重合体の官能基であるヒドロキシ基100当量に対して83.3当量)とを反応させ、重合性基およびラジカル発生基が結合してなる重量平均分子量680,000のエネルギー線硬化型重合体の酢酸エチル溶液(30%溶液)を得た。
ブチルアクリレート68.2重量部、メチルメタクリレート10重量部、2−ヒドロキシエチルアクリレート16.8重量部および実施例1で調製したラジカル発生基含有モノマー1重量部を用いて酢酸エチル溶媒中で溶液重合しアクリル系のラジカル発生基含有重合体を生成した。このラジカル発生基含有重合体の固形分100重量部と、メタクリロイルオキシエチルイソシアナート18.7重量部(ラジカル発生基含有重合体の官能基であるヒドロキシ基100当量に対して83.3当量)とを反応させ、重合性基およびラジカル発生基が結合してなる重量平均分子量680,000のアクリル系のエネルギー線硬化型重合体の酢酸エチル溶液(30%溶液)を得た。
(エネルギー線硬化型粘着剤組成物の作成)
ブチルアクリレート62重量部、メチルメタクリレート10重量部、2−ヒドロキシエチルアクリレート28重量部を用いて酢酸エチル溶媒中で溶液重合しアクリル系共重合体を生成した。このアクリル系共重合体の固形分100重量部と、メタクリロイルオキシエチルイソシアナート30重量部(アクリル系共重合体の官能基であるヒドロキシ基100当量に対して80当量)とを反応させ、アルキレンオキシ基を介して重合性基が結合してなる重量平均分子量600,000のアクリル系粘着性重合体を得た。
ブチルアクリレート73.2重量部、ジメチルメタクリレート10重量部、2−ヒドロキシエチルアクリレート16.8重量部を用いて酢酸エチル溶媒中で溶液重合しアクリル系共重合体を生成した。このアクリル系共重合体の固形分100重量部と、メタクリロイルオキシエチルイソシアナート18.7重量部(アクリル系共重合体の官能基であるヒドロキシ基100当量に対して83.3当量)とを反応させ、アルキレンオキシ基を介して重合性基が結合してなる重量平均分子量600,000のアクリル系粘着性重合体を得た。
ブチルアクリレート73.2重量部、メチルメタクリレート10重量部、2−ヒドロキシエチルアクリレート16.8重量部を用いて酢酸エチル溶媒中で溶液重合し、重量平均分子量600,000のアクリル系共重合体を生成した。このアクリル系共重合体の固形分100重量部と、メタクリロイルオキシエチルイソシアナート18.7重量部(アクリル系共重合体の官能基であるヒドロキシ基100当量に対して83.3当量)とを反応させ、アルキレンオキシ基を介して重合性基が結合してなるアクリル系粘着性重合体を得た。
Claims (11)
- 主鎖または側鎖に、エネルギー線による励起下で重合反応を開始させるラジカル発生基、およびエネルギー線重合性基が結合されてなるエネルギー線硬化型重合体。
- 前記ラジカル発生基が、芳香環に置換基を有してもよいフェニルカルボニル基を含む基である請求項1に記載のエネルギー線硬化型重合体。
- 前記ラジカル発生基が、ヒドロキシ基を有する光重合開始剤のヒドロキシ基に、重合性の二重結合を有する化合物を付加して得られるモノマーに由来してなる請求項1または2に記載のエネルギー線硬化型重合体。
- 重量平均分子量が30万〜160万である請求項1〜3のいずれかに記載のエネルギー線硬化型重合体。
- 請求項1〜4のいずれかに記載のエネルギー線硬化型重合体を含有するエネルギー線硬化型粘着剤組成物。
- 基材とその上に形成されたエネルギー線硬化型粘着剤層とからなり、前記エネルギー線硬化型粘着剤層が、請求項5に記載のエネルギー線硬化型粘着剤組成物からなる粘着シート。
- 半導体ウエハの加工に用いる請求項6に記載の粘着シート。
- 請求項7に記載の粘着シートのエネルギー線硬化型粘着剤層に、表面に回路が形成された半導体ウエハの回路表面を貼付し、該ウエハの裏面加工を行う半導体ウエハの加工方法。
- 前記半導体ウエハの裏面加工が、裏面研削である請求項8に記載の半導体ウエハの加工方法。
- 請求項7に記載の粘着シートのエネルギー線硬化型粘着剤層に、表面に回路が形成された半導体ウエハの裏面を貼付し、該ウエハのダイシングを行う半導体ウエハの加工方法。
- 加熱または発熱を伴う工程をさらに含む請求項8〜10のいずれかに記載の半導体ウエハの加工方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008093897A JP5727688B2 (ja) | 2008-03-31 | 2008-03-31 | エネルギー線硬化型重合体、エネルギー線硬化型粘着剤組成物、粘着シートおよび半導体ウエハの加工方法 |
US12/935,677 US8304920B2 (en) | 2008-03-31 | 2009-03-12 | Energy ray-curable polymer, an energy ray-curable adhesive composition, an adhesive sheet and a processing method of a semiconductor wafer |
PCT/JP2009/054742 WO2009122878A1 (ja) | 2008-03-31 | 2009-03-12 | エネルギー線硬化型重合体、エネルギー線硬化型粘着剤組成物、粘着シートおよび半導体ウエハの加工方法 |
KR1020107021627A KR101606217B1 (ko) | 2008-03-31 | 2009-03-12 | 에너지선 경화형 중합체, 에너지선 경화형 점착제 조성물, 점착 시트 및 반도체 웨이퍼의 가공방법 |
US13/570,306 US20120302041A1 (en) | 2008-03-31 | 2012-08-09 | Energy Ray-Curable Polymer, an Energy Ray-Curable Adhesive Composition, an Adhesive Sheet and a Processing Method of a Semiconductor Wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008093897A JP5727688B2 (ja) | 2008-03-31 | 2008-03-31 | エネルギー線硬化型重合体、エネルギー線硬化型粘着剤組成物、粘着シートおよび半導体ウエハの加工方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009242733A true JP2009242733A (ja) | 2009-10-22 |
JP2009242733A5 JP2009242733A5 (ja) | 2011-01-06 |
JP5727688B2 JP5727688B2 (ja) | 2015-06-03 |
Family
ID=41135264
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008093897A Active JP5727688B2 (ja) | 2008-03-31 | 2008-03-31 | エネルギー線硬化型重合体、エネルギー線硬化型粘着剤組成物、粘着シートおよび半導体ウエハの加工方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US8304920B2 (ja) |
JP (1) | JP5727688B2 (ja) |
KR (1) | KR101606217B1 (ja) |
WO (1) | WO2009122878A1 (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011210944A (ja) * | 2010-03-30 | 2011-10-20 | Furukawa Electric Co Ltd:The | 帯電防止性半導体加工用粘着テープ |
JP2011225706A (ja) * | 2010-04-19 | 2011-11-10 | Denki Kagaku Kogyo Kk | 粘着シート及び電子部品の製造方法 |
WO2012017568A1 (ja) * | 2010-08-05 | 2012-02-09 | 古河電気工業株式会社 | 粘着フィルム及び半導体ウエハ加工用テープ |
JP2015185590A (ja) * | 2014-03-20 | 2015-10-22 | 住友ベークライト株式会社 | 半導体用ウエハ加工用粘着テープ |
WO2016121706A1 (ja) * | 2015-01-26 | 2016-08-04 | 日本化薬株式会社 | 感光性樹脂組成物及びその硬化物 |
JP2019517096A (ja) * | 2016-04-29 | 2019-06-20 | エルジー・ケム・リミテッド | 発熱体 |
CN113474429A (zh) * | 2019-03-29 | 2021-10-01 | 昭和电工株式会社 | 粘接剂用组合物、蓄电装置用外装材料及其制造方法 |
US11702571B2 (en) | 2018-03-28 | 2023-07-18 | Lg Chem, Ltd. | Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the same |
US12018189B2 (en) | 2019-03-29 | 2024-06-25 | Resonac Corporation | Composition for adhesives, outer package material for electricity storage devices, and method for producing same |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110045290A1 (en) * | 2008-03-03 | 2011-02-24 | Lintec Corporation | Adhesive Sheet |
JP5727688B2 (ja) * | 2008-03-31 | 2015-06-03 | リンテック株式会社 | エネルギー線硬化型重合体、エネルギー線硬化型粘着剤組成物、粘着シートおよび半導体ウエハの加工方法 |
JP6085076B2 (ja) * | 2009-03-16 | 2017-02-22 | リンテック株式会社 | 粘着シートおよび半導体ウエハの加工方法、半導体チップの製造方法 |
US10086594B2 (en) * | 2012-05-14 | 2018-10-02 | Lintec Corporation | Sheet having adhesive resin layer attached thereto, and method for producing semiconductor device |
EP3344720B1 (en) | 2015-08-31 | 2020-10-14 | 3M Innovative Properties Company | Articles comprising (meth)acrylate pressure-sensitive adhesive with enhanced adhesion to wet surfaces |
JP6875378B2 (ja) | 2015-08-31 | 2021-05-26 | スリーエム イノベイティブ プロパティズ カンパニー | 湿潤表面に対する接着力が高められた(メタ)アクリレート感圧接着剤を含む陰圧閉鎖創傷療法被覆材 |
KR102309379B1 (ko) | 2017-12-22 | 2021-10-06 | 동우 화인켐 주식회사 | 점착 시트, 이를 포함하는 광학부재 및 표시장치 |
KR20190080265A (ko) | 2017-12-28 | 2019-07-08 | 동우 화인켐 주식회사 | 점착제 조성물 및 이로부터 제조된 점착 시트 |
KR20190086850A (ko) | 2018-01-15 | 2019-07-24 | 동우 화인켐 주식회사 | 점착 시트, 이를 포함하는 광학부재 및 표시장치 |
KR102332228B1 (ko) | 2018-01-24 | 2021-11-29 | 동우 화인켐 주식회사 | 점착 시트, 이를 포함하는 광학부재 및 화상표시장치 |
CN113061208A (zh) * | 2021-04-01 | 2021-07-02 | 湖北科技学院 | 一种电子束辐照引发制备磺胺二甲基嘧啶分子印迹聚合物的方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03168209A (ja) * | 1989-11-29 | 1991-07-22 | Dainippon Ink & Chem Inc | 水溶性エネルギー線硬化型樹脂組成物 |
JPH04110303A (ja) * | 1990-08-31 | 1992-04-10 | Dainippon Ink & Chem Inc | 活性エネルギー線硬化型樹脂組成物 |
JP2003064329A (ja) * | 2001-08-30 | 2003-03-05 | Nitto Denko Corp | エネルギー線硬化型熱剥離性粘着シート、これを用いた切断片の製造方法、及びその切断片 |
JP2005263876A (ja) * | 2004-03-16 | 2005-09-29 | Lintec Corp | 両面粘着シートおよび脆質部材の転写方法 |
JP2007277282A (ja) * | 2006-04-03 | 2007-10-25 | Nitto Denko Corp | 半導体ウエハ加工用粘着シート |
JP2007297591A (ja) * | 2006-04-06 | 2007-11-15 | Lintec Corp | 粘着シート |
JP2008019341A (ja) * | 2006-07-13 | 2008-01-31 | Nitto Denko Corp | 活性エネルギー線硬化型再剥離用水分散型アクリル系粘着剤組成物及び粘着シート |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3724368A1 (de) | 1987-07-23 | 1989-02-02 | Basf Ag | Verfahren zur herstellung oligomerer oder polymerer strahlungsreaktiver vorstufen fuer loesungsmittelstrukturierte schichten |
US5270431A (en) | 1987-07-23 | 1993-12-14 | Basf Aktiengesellschaft | Preparation of oligomeric or polymeric radiation-reactive intermediates for solvent-structured layers |
DE3914374A1 (de) | 1989-04-29 | 1990-10-31 | Basf Ag | Durch ultraviolette strahlung unter luftsauerstoffatmosphaere vernetzbare copolymerisate |
JPH05335411A (ja) | 1992-06-02 | 1993-12-17 | Toshiba Corp | ペレットの製造方法 |
JP3191176B2 (ja) | 1992-07-01 | 2001-07-23 | ソニーケミカル株式会社 | 粘着剤組成物 |
JP2775383B2 (ja) | 1993-09-07 | 1998-07-16 | 昭和高分子株式会社 | 熱硬化性粘着剤組成物 |
JPH09291264A (ja) | 1996-04-24 | 1997-11-11 | Mitsubishi Rayon Co Ltd | 紫外線硬化型粘着剤組成物 |
JP2000328023A (ja) | 1999-05-21 | 2000-11-28 | Lintec Corp | 粘着シート |
US7641966B2 (en) | 1999-06-14 | 2010-01-05 | Nitto Denko Corporation | Re-release adhesive and re-release adhesive sheet |
JP2002187906A (ja) * | 2000-12-21 | 2002-07-05 | Lintec Corp | 高分子量光重合開始剤及びそれを用いた光硬化性材料 |
JP4999231B2 (ja) | 2001-01-15 | 2012-08-15 | ロックペイント株式会社 | ラミネーション用接着剤組成物及びその製造方法 |
JP4841802B2 (ja) | 2003-05-02 | 2011-12-21 | リンテック株式会社 | 粘着シートおよびその使用方法 |
WO2005011977A1 (ja) | 2003-07-30 | 2005-02-10 | Dainippon Ink And Chemicals, Inc. | 成形用積層シート |
JP4566527B2 (ja) | 2003-08-08 | 2010-10-20 | 日東電工株式会社 | 再剥離型粘着シート |
JP4275522B2 (ja) * | 2003-12-26 | 2009-06-10 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP2005236082A (ja) * | 2004-02-20 | 2005-09-02 | Nitto Denko Corp | レーザーダイシング用粘着シート及びその製造方法 |
JP2005292435A (ja) * | 2004-03-31 | 2005-10-20 | Toppan Printing Co Ltd | 光硬化性樹脂組成物 |
JP4721834B2 (ja) * | 2005-09-06 | 2011-07-13 | 日東電工株式会社 | 粘着シート及びこの粘着シートを用いた製品の加工方法 |
JP2008028026A (ja) | 2006-07-19 | 2008-02-07 | Nitto Denko Corp | ダイシング用粘着テープ又はシート、被加工物のダイシング方法、及び被加工物の切断片のピックアップ方法 |
US20090017323A1 (en) | 2007-07-13 | 2009-01-15 | 3M Innovative Properties Company | Layered body and method for manufacturing thin substrate using the layered body |
US20110045290A1 (en) | 2008-03-03 | 2011-02-24 | Lintec Corporation | Adhesive Sheet |
JP5727688B2 (ja) * | 2008-03-31 | 2015-06-03 | リンテック株式会社 | エネルギー線硬化型重合体、エネルギー線硬化型粘着剤組成物、粘着シートおよび半導体ウエハの加工方法 |
JP6085076B2 (ja) | 2009-03-16 | 2017-02-22 | リンテック株式会社 | 粘着シートおよび半導体ウエハの加工方法、半導体チップの製造方法 |
-
2008
- 2008-03-31 JP JP2008093897A patent/JP5727688B2/ja active Active
-
2009
- 2009-03-12 KR KR1020107021627A patent/KR101606217B1/ko active IP Right Grant
- 2009-03-12 US US12/935,677 patent/US8304920B2/en active Active
- 2009-03-12 WO PCT/JP2009/054742 patent/WO2009122878A1/ja active Application Filing
-
2012
- 2012-08-09 US US13/570,306 patent/US20120302041A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03168209A (ja) * | 1989-11-29 | 1991-07-22 | Dainippon Ink & Chem Inc | 水溶性エネルギー線硬化型樹脂組成物 |
JPH04110303A (ja) * | 1990-08-31 | 1992-04-10 | Dainippon Ink & Chem Inc | 活性エネルギー線硬化型樹脂組成物 |
JP2003064329A (ja) * | 2001-08-30 | 2003-03-05 | Nitto Denko Corp | エネルギー線硬化型熱剥離性粘着シート、これを用いた切断片の製造方法、及びその切断片 |
JP2005263876A (ja) * | 2004-03-16 | 2005-09-29 | Lintec Corp | 両面粘着シートおよび脆質部材の転写方法 |
JP2007277282A (ja) * | 2006-04-03 | 2007-10-25 | Nitto Denko Corp | 半導体ウエハ加工用粘着シート |
JP2007297591A (ja) * | 2006-04-06 | 2007-11-15 | Lintec Corp | 粘着シート |
JP2008019341A (ja) * | 2006-07-13 | 2008-01-31 | Nitto Denko Corp | 活性エネルギー線硬化型再剥離用水分散型アクリル系粘着剤組成物及び粘着シート |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011210944A (ja) * | 2010-03-30 | 2011-10-20 | Furukawa Electric Co Ltd:The | 帯電防止性半導体加工用粘着テープ |
JP2011225706A (ja) * | 2010-04-19 | 2011-11-10 | Denki Kagaku Kogyo Kk | 粘着シート及び電子部品の製造方法 |
WO2012017568A1 (ja) * | 2010-08-05 | 2012-02-09 | 古河電気工業株式会社 | 粘着フィルム及び半導体ウエハ加工用テープ |
JP2015185590A (ja) * | 2014-03-20 | 2015-10-22 | 住友ベークライト株式会社 | 半導体用ウエハ加工用粘着テープ |
WO2016121706A1 (ja) * | 2015-01-26 | 2016-08-04 | 日本化薬株式会社 | 感光性樹脂組成物及びその硬化物 |
JP2019517096A (ja) * | 2016-04-29 | 2019-06-20 | エルジー・ケム・リミテッド | 発熱体 |
US10796818B2 (en) | 2016-04-29 | 2020-10-06 | Lg Chem., Ltd. | Heating element |
US11702571B2 (en) | 2018-03-28 | 2023-07-18 | Lg Chem, Ltd. | Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the same |
CN113474429A (zh) * | 2019-03-29 | 2021-10-01 | 昭和电工株式会社 | 粘接剂用组合物、蓄电装置用外装材料及其制造方法 |
EP3950867A4 (en) * | 2019-03-29 | 2022-12-14 | Showa Denko K.K. | COMPOSITION FOR ADHESIVES, EXTERNAL HOUSING MATERIAL FOR ELECTRICITY STORAGE DEVICES AND METHOD OF MAKING THEREOF |
CN113474429B (zh) * | 2019-03-29 | 2023-03-17 | 昭和电工株式会社 | 粘接剂用组合物、蓄电装置用外装材料及其制造方法 |
US12018189B2 (en) | 2019-03-29 | 2024-06-25 | Resonac Corporation | Composition for adhesives, outer package material for electricity storage devices, and method for producing same |
Also Published As
Publication number | Publication date |
---|---|
KR20100138979A (ko) | 2010-12-31 |
US20110104874A1 (en) | 2011-05-05 |
US8304920B2 (en) | 2012-11-06 |
US20120302041A1 (en) | 2012-11-29 |
KR101606217B1 (ko) | 2016-03-24 |
WO2009122878A1 (ja) | 2009-10-08 |
JP5727688B2 (ja) | 2015-06-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5727688B2 (ja) | エネルギー線硬化型重合体、エネルギー線硬化型粘着剤組成物、粘着シートおよび半導体ウエハの加工方法 | |
JP6085076B2 (ja) | 粘着シートおよび半導体ウエハの加工方法、半導体チップの製造方法 | |
JP5302951B2 (ja) | 粘着シート | |
EP0999250B1 (en) | Pressure sensitive adhesive sheet for use in semiconductor wafer working | |
JP5464635B2 (ja) | 半導体ウエハ加工用粘着シートおよびその使用方法 | |
JP6270736B2 (ja) | 保護膜形成用フィルム | |
JP5049612B2 (ja) | 粘着シート | |
JP4991348B2 (ja) | 粘着シート | |
JP7381447B2 (ja) | 粘着テープおよび半導体装置の製造方法 | |
JP2013213075A (ja) | 半導体加工用粘着テープ | |
TW200949922A (en) | Dicing method | |
JP4991350B2 (ja) | 粘着シート | |
JP2000212526A (ja) | 粘着シ―ト | |
JP6129541B2 (ja) | ダイシングシート | |
JP5314308B2 (ja) | レーザーダイシング・ダイボンド兼用シートおよびチップ複合体の製造方法 | |
JP7404073B2 (ja) | 半導体加工用粘着テープ | |
JP7381448B2 (ja) | 粘着テープおよび半導体装置の製造方法 | |
JP5033440B2 (ja) | 粘着シート | |
JP6006953B2 (ja) | 電子部品加工用粘着シートおよび半導体装置の製造方法 | |
JP2008280505A (ja) | 半導体加工用テープ | |
JP4578600B2 (ja) | 光感応性粘着テープ及びその製造方法 | |
WO2022209153A1 (ja) | ワーク加工用粘着テープ | |
JP2013151614A (ja) | 粘着テープ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101115 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20101115 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130409 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130529 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20130529 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130618 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130813 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140527 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140728 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140731 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140826 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20141015 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150107 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20150115 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150324 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150403 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5727688 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |