JP2009239240A5 - - Google Patents

Download PDF

Info

Publication number
JP2009239240A5
JP2009239240A5 JP2008110464A JP2008110464A JP2009239240A5 JP 2009239240 A5 JP2009239240 A5 JP 2009239240A5 JP 2008110464 A JP2008110464 A JP 2008110464A JP 2008110464 A JP2008110464 A JP 2008110464A JP 2009239240 A5 JP2009239240 A5 JP 2009239240A5
Authority
JP
Japan
Prior art keywords
land
resist
rectangular
semiconductor device
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008110464A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009239240A (ja
JP5053919B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008110464A priority Critical patent/JP5053919B2/ja
Priority claimed from JP2008110464A external-priority patent/JP5053919B2/ja
Publication of JP2009239240A publication Critical patent/JP2009239240A/ja
Publication of JP2009239240A5 publication Critical patent/JP2009239240A5/ja
Application granted granted Critical
Publication of JP5053919B2 publication Critical patent/JP5053919B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008110464A 2008-03-07 2008-04-21 表面実装デバイスの実装構造体 Expired - Fee Related JP5053919B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008110464A JP5053919B2 (ja) 2008-03-07 2008-04-21 表面実装デバイスの実装構造体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008058263 2008-03-07
JP2008058263 2008-03-07
JP2008110464A JP5053919B2 (ja) 2008-03-07 2008-04-21 表面実装デバイスの実装構造体

Publications (3)

Publication Number Publication Date
JP2009239240A JP2009239240A (ja) 2009-10-15
JP2009239240A5 true JP2009239240A5 (enExample) 2011-05-12
JP5053919B2 JP5053919B2 (ja) 2012-10-24

Family

ID=41252793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008110464A Expired - Fee Related JP5053919B2 (ja) 2008-03-07 2008-04-21 表面実装デバイスの実装構造体

Country Status (1)

Country Link
JP (1) JP5053919B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9345148B2 (en) * 2008-03-25 2016-05-17 Stats Chippac, Ltd. Semiconductor device and method of forming flipchip interconnection structure with bump on partial pad
JP5776373B2 (ja) * 2011-06-29 2015-09-09 株式会社デンソー 電子装置
JP5980634B2 (ja) 2012-09-14 2016-08-31 富士通コンポーネント株式会社 プリント基板
JP2024153955A (ja) * 2021-07-13 2024-10-30 株式会社村田製作所 回路基板及び電子部品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11297889A (ja) * 1998-04-16 1999-10-29 Sony Corp 半導体パッケージおよび実装基板、ならびにこれらを用いた実装方法
CN100482041C (zh) * 2002-05-17 2009-04-22 日本电气株式会社 印刷布线板
JP2007005452A (ja) * 2005-06-22 2007-01-11 Renesas Technology Corp 半導体装置

Similar Documents

Publication Publication Date Title
US7005750B2 (en) Substrate with reinforced contact pad structure
KR100832651B1 (ko) 인쇄회로기판
US6734557B2 (en) Semiconductor device
JP5107959B2 (ja) 基板
TWI399146B (zh) 一種印刷電路板及其製作方法和球柵陣列焊盤圖案
US8963327B2 (en) Semiconductor device including wiring board with semiconductor chip
JP2011142185A (ja) 半導体装置
KR101060936B1 (ko) 인터커넥션 구조, 인터포저, 반도체 패키지 및 인터커넥션 구조의 제조 방법
JP5290215B2 (ja) 半導体装置、半導体パッケージ、インタポーザ、及びインタポーザの製造方法
JP4458010B2 (ja) 半導体装置
JP5053919B2 (ja) 表面実装デバイスの実装構造体
KR101139084B1 (ko) 다층 프린트 기판 및 그 제조 방법
JP2009239240A5 (enExample)
JP5159750B2 (ja) 半田ボール及び半導体パッケージ
JP5466218B2 (ja) 半導体パッケージ
JP2004128290A (ja) 半導体装置
JP6724808B2 (ja) 電子装置
JP2000243862A (ja) インターポーザ基板
JP2007005452A (ja) 半導体装置
JP5372235B2 (ja) 半導体装置および半導体装置実装体
JP2010161295A (ja) プリント基板およびこれを備えた半導体装置
JP2009076569A (ja) 半導体パッケージ、実装基板、およびこれらを含む半導体装置
KR20100123941A (ko) 반도체 패키지 제조용 기판 및 이를 이용한 반도체 패키지
CN105075410A (zh) 印刷布线板以及具备该印刷布线板的半导体装置
KR100772107B1 (ko) 볼 그리드 어레이 패키지