JP2009196078A5 - - Google Patents

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Publication number
JP2009196078A5
JP2009196078A5 JP2008282499A JP2008282499A JP2009196078A5 JP 2009196078 A5 JP2009196078 A5 JP 2009196078A5 JP 2008282499 A JP2008282499 A JP 2008282499A JP 2008282499 A JP2008282499 A JP 2008282499A JP 2009196078 A5 JP2009196078 A5 JP 2009196078A5
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JP
Japan
Prior art keywords
film
insulating
component according
electrical component
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008282499A
Other languages
English (en)
Japanese (ja)
Other versions
JP4581011B2 (ja
JP2009196078A (ja
Filing date
Publication date
Priority claimed from JP2008282499A external-priority patent/JP4581011B2/ja
Priority to JP2008282499A priority Critical patent/JP4581011B2/ja
Application filed filed Critical
Priority to TW098102544A priority patent/TWI385784B/zh
Priority to KR1020090005991A priority patent/KR101057905B1/ko
Priority to US12/358,869 priority patent/US8309858B2/en
Priority to CN201110253951.6A priority patent/CN102336392B/zh
Priority to CN2009100032764A priority patent/CN101492149B/zh
Publication of JP2009196078A publication Critical patent/JP2009196078A/ja
Publication of JP2009196078A5 publication Critical patent/JP2009196078A5/ja
Publication of JP4581011B2 publication Critical patent/JP4581011B2/ja
Application granted granted Critical
Priority to US13/647,845 priority patent/US8829359B2/en
Priority to US14/462,262 priority patent/US9676608B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008282499A 2008-01-25 2008-10-31 電気部品とその製造方法 Expired - Fee Related JP4581011B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2008282499A JP4581011B2 (ja) 2008-01-25 2008-10-31 電気部品とその製造方法
TW098102544A TWI385784B (zh) 2008-01-25 2009-01-22 半導體積體電路內建的電子裝置
KR1020090005991A KR101057905B1 (ko) 2008-01-25 2009-01-23 반도체 집적 회로에 내장되는 전기 디바이스
US12/358,869 US8309858B2 (en) 2008-01-25 2009-01-23 Electrical device including a functional element in a cavity
CN201110253951.6A CN102336392B (zh) 2008-01-25 2009-02-01 构建到半导体集成电路中的电器件
CN2009100032764A CN101492149B (zh) 2008-01-25 2009-02-01 构建到半导体集成电路中的电器件
US13/647,845 US8829359B2 (en) 2008-01-25 2012-10-09 Electrical device including a functional element in a cavity
US14/462,262 US9676608B2 (en) 2008-01-25 2014-08-18 Electrical device including a functional element in a cavity

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008015510 2008-01-25
JP2008282499A JP4581011B2 (ja) 2008-01-25 2008-10-31 電気部品とその製造方法

Publications (3)

Publication Number Publication Date
JP2009196078A JP2009196078A (ja) 2009-09-03
JP2009196078A5 true JP2009196078A5 (enExample) 2010-05-13
JP4581011B2 JP4581011B2 (ja) 2010-11-17

Family

ID=40898069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008282499A Expired - Fee Related JP4581011B2 (ja) 2008-01-25 2008-10-31 電気部品とその製造方法

Country Status (5)

Country Link
US (3) US8309858B2 (enExample)
JP (1) JP4581011B2 (enExample)
KR (1) KR101057905B1 (enExample)
CN (2) CN101492149B (enExample)
TW (1) TWI385784B (enExample)

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US9955949B2 (en) 2013-08-23 2018-05-01 Canon Kabushiki Kaisha Method for manufacturing a capacitive transducer
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JP6314568B2 (ja) * 2014-03-18 2018-04-25 セイコーエプソン株式会社 Ｍｅｍｓデバイス及びその製造方法
JP2015223689A (ja) * 2014-05-30 2015-12-14 株式会社東芝 電子部品及びその製造方法
CN105645349B (zh) * 2014-12-04 2017-09-22 中芯国际集成电路制造(上海)有限公司 Mems器件的形成方法
TWI610406B (zh) * 2015-02-09 2018-01-01 精材科技股份有限公司 晶片封裝體與其製備方法
US10384929B2 (en) * 2016-03-22 2019-08-20 Murata Manufacturing Co., Ltd. Impact element for a sensor device and a manufacturing method
JP6668286B2 (ja) 2016-04-01 2020-03-18 スカイワークスフィルターソリューションズジャパン株式会社 電子部品及びその製造方法と電子装置及びその製造方法
JP6648637B2 (ja) * 2016-05-24 2020-02-14 Tdk株式会社 電子部品パッケージ
JP6685839B2 (ja) * 2016-05-30 2020-04-22 株式会社東芝 ガス検出装置
WO2018133940A1 (en) 2017-01-19 2018-07-26 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic element
CN106865489B (zh) * 2017-02-14 2019-01-18 上海华虹宏力半导体制造有限公司 Mems器件的制造方法
JP6990997B2 (ja) * 2017-06-06 2022-01-12 株式会社日立製作所 Ｍｅｍｓデバイス
DE112017008195B4 (de) * 2017-11-14 2023-06-22 Mitsubishi Electric Corporation Halbleitereinrichtung und Verfahren zu deren Herstellung
DE102018118701B3 (de) * 2018-08-01 2019-10-17 RF360 Europe GmbH BAW-Resonator mit verbesserter Verbindung der oberen Elektrode
KR102165882B1 (ko) * 2018-12-28 2020-10-14 주식회사 제이피드림 박막 패키지 및 그의 형성방법
JP7591886B2 (ja) * 2020-03-18 2024-11-29 日本航空電子工業株式会社 デバイス
CN111370375B (zh) * 2020-03-23 2025-03-14 苏州晶方半导体科技股份有限公司 封装结构、半导体器件和封装方法
JP7735629B2 (ja) * 2020-05-25 2025-09-09 ミネベアパワーデバイス株式会社 半導体装置および電力変換装置
US11800643B2 (en) * 2021-04-05 2023-10-24 Japan Aviation Electronics Industry, Limited Device having closed space between overlapping sealing members
JP7696372B2 (ja) * 2022-08-15 2025-06-20 エーエーシーアコースティックテクノロジーズ（シンセン）カンパニーリミテッド Ｍｅｍｓデバイスの製造方法及びｍｅｍｓデバイス

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