JP2009177152A - 配線基板の製造方法 - Google Patents
配線基板の製造方法 Download PDFInfo
- Publication number
- JP2009177152A JP2009177152A JP2008326596A JP2008326596A JP2009177152A JP 2009177152 A JP2009177152 A JP 2009177152A JP 2008326596 A JP2008326596 A JP 2008326596A JP 2008326596 A JP2008326596 A JP 2008326596A JP 2009177152 A JP2009177152 A JP 2009177152A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- resist
- copper plating
- layer
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008326596A JP2009177152A (ja) | 2007-12-25 | 2008-12-22 | 配線基板の製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007333352 | 2007-12-25 | ||
JP2008326596A JP2009177152A (ja) | 2007-12-25 | 2008-12-22 | 配線基板の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009177152A true JP2009177152A (ja) | 2009-08-06 |
Family
ID=40829420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008326596A Pending JP2009177152A (ja) | 2007-12-25 | 2008-12-22 | 配線基板の製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2009177152A (zh) |
CN (1) | CN101472406B (zh) |
TW (1) | TWI397361B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018180868A1 (ja) * | 2017-03-27 | 2018-10-04 | 株式会社アルバック | 電子部品の製造方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103857204B (zh) * | 2012-11-28 | 2017-10-27 | 碁鼎科技秦皇岛有限公司 | 承载板及其制作方法 |
CN106852002A (zh) * | 2017-02-07 | 2017-06-13 | 苏州维信电子有限公司 | 一种细线路层横截面形状方正柔性线路板的制造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001135916A (ja) * | 1999-11-04 | 2001-05-18 | Ibiden Co Ltd | プリント配線板の製造方法 |
JP2003115662A (ja) * | 2001-10-05 | 2003-04-18 | Toppan Printing Co Ltd | 半導体装置用基板の製造方法 |
JP2007324522A (ja) * | 2006-06-05 | 2007-12-13 | Tokuyama Corp | メタライズドセラミック基板の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5160579A (en) * | 1991-06-05 | 1992-11-03 | Macdermid, Incorporated | Process for manufacturing printed circuit employing selective provision of solderable coating |
JP2005223167A (ja) * | 2004-02-06 | 2005-08-18 | Shinko Electric Ind Co Ltd | 親水性処理方法及び配線パターンの形成方法 |
-
2008
- 2008-11-03 CN CN2008101704181A patent/CN101472406B/zh not_active Expired - Fee Related
- 2008-12-22 JP JP2008326596A patent/JP2009177152A/ja active Pending
- 2008-12-25 TW TW97150562A patent/TWI397361B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001135916A (ja) * | 1999-11-04 | 2001-05-18 | Ibiden Co Ltd | プリント配線板の製造方法 |
JP2003115662A (ja) * | 2001-10-05 | 2003-04-18 | Toppan Printing Co Ltd | 半導体装置用基板の製造方法 |
JP2007324522A (ja) * | 2006-06-05 | 2007-12-13 | Tokuyama Corp | メタライズドセラミック基板の製造方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018180868A1 (ja) * | 2017-03-27 | 2018-10-04 | 株式会社アルバック | 電子部品の製造方法 |
KR20190019158A (ko) * | 2017-03-27 | 2019-02-26 | 가부시키가이샤 아루박 | 전자 부품의 제조 방법 |
CN109716506A (zh) * | 2017-03-27 | 2019-05-03 | 株式会社爱发科 | 电子部件的制造方法 |
TWI687973B (zh) * | 2017-03-27 | 2020-03-11 | 日商愛發科股份有限公司 | 電子構件的製造方法 |
US10619261B2 (en) | 2017-03-27 | 2020-04-14 | Ulvac, Inc. | Manufacturing method for electronic component |
KR102137716B1 (ko) | 2017-03-27 | 2020-07-24 | 가부시키가이샤 아루박 | 전자 부품의 제조 방법 |
CN109716506B (zh) * | 2017-03-27 | 2023-09-22 | 株式会社爱发科 | 电子部件的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW200938048A (en) | 2009-09-01 |
CN101472406B (zh) | 2012-08-15 |
CN101472406A (zh) | 2009-07-01 |
TWI397361B (zh) | 2013-05-21 |
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