JP2009177152A - 配線基板の製造方法 - Google Patents

配線基板の製造方法 Download PDF

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Publication number
JP2009177152A
JP2009177152A JP2008326596A JP2008326596A JP2009177152A JP 2009177152 A JP2009177152 A JP 2009177152A JP 2008326596 A JP2008326596 A JP 2008326596A JP 2008326596 A JP2008326596 A JP 2008326596A JP 2009177152 A JP2009177152 A JP 2009177152A
Authority
JP
Japan
Prior art keywords
plating
resist
copper plating
layer
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008326596A
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English (en)
Japanese (ja)
Inventor
Yoko Nishimura
洋子 西村
Seiji Mori
聖二 森
Hajime Saiki
一 斉木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP2008326596A priority Critical patent/JP2009177152A/ja
Publication of JP2009177152A publication Critical patent/JP2009177152A/ja
Pending legal-status Critical Current

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  • Manufacturing Of Printed Wiring (AREA)
JP2008326596A 2007-12-25 2008-12-22 配線基板の製造方法 Pending JP2009177152A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008326596A JP2009177152A (ja) 2007-12-25 2008-12-22 配線基板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007333352 2007-12-25
JP2008326596A JP2009177152A (ja) 2007-12-25 2008-12-22 配線基板の製造方法

Publications (1)

Publication Number Publication Date
JP2009177152A true JP2009177152A (ja) 2009-08-06

Family

ID=40829420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008326596A Pending JP2009177152A (ja) 2007-12-25 2008-12-22 配線基板の製造方法

Country Status (3)

Country Link
JP (1) JP2009177152A (zh)
CN (1) CN101472406B (zh)
TW (1) TWI397361B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018180868A1 (ja) * 2017-03-27 2018-10-04 株式会社アルバック 電子部品の製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103857204B (zh) * 2012-11-28 2017-10-27 碁鼎科技秦皇岛有限公司 承载板及其制作方法
CN106852002A (zh) * 2017-02-07 2017-06-13 苏州维信电子有限公司 一种细线路层横截面形状方正柔性线路板的制造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001135916A (ja) * 1999-11-04 2001-05-18 Ibiden Co Ltd プリント配線板の製造方法
JP2003115662A (ja) * 2001-10-05 2003-04-18 Toppan Printing Co Ltd 半導体装置用基板の製造方法
JP2007324522A (ja) * 2006-06-05 2007-12-13 Tokuyama Corp メタライズドセラミック基板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5160579A (en) * 1991-06-05 1992-11-03 Macdermid, Incorporated Process for manufacturing printed circuit employing selective provision of solderable coating
JP2005223167A (ja) * 2004-02-06 2005-08-18 Shinko Electric Ind Co Ltd 親水性処理方法及び配線パターンの形成方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001135916A (ja) * 1999-11-04 2001-05-18 Ibiden Co Ltd プリント配線板の製造方法
JP2003115662A (ja) * 2001-10-05 2003-04-18 Toppan Printing Co Ltd 半導体装置用基板の製造方法
JP2007324522A (ja) * 2006-06-05 2007-12-13 Tokuyama Corp メタライズドセラミック基板の製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018180868A1 (ja) * 2017-03-27 2018-10-04 株式会社アルバック 電子部品の製造方法
KR20190019158A (ko) * 2017-03-27 2019-02-26 가부시키가이샤 아루박 전자 부품의 제조 방법
CN109716506A (zh) * 2017-03-27 2019-05-03 株式会社爱发科 电子部件的制造方法
TWI687973B (zh) * 2017-03-27 2020-03-11 日商愛發科股份有限公司 電子構件的製造方法
US10619261B2 (en) 2017-03-27 2020-04-14 Ulvac, Inc. Manufacturing method for electronic component
KR102137716B1 (ko) 2017-03-27 2020-07-24 가부시키가이샤 아루박 전자 부품의 제조 방법
CN109716506B (zh) * 2017-03-27 2023-09-22 株式会社爱发科 电子部件的制造方法

Also Published As

Publication number Publication date
TW200938048A (en) 2009-09-01
CN101472406B (zh) 2012-08-15
CN101472406A (zh) 2009-07-01
TWI397361B (zh) 2013-05-21

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