CN103857204B - 承载板及其制作方法 - Google Patents
承载板及其制作方法 Download PDFInfo
- Publication number
- CN103857204B CN103857204B CN201210493833.7A CN201210493833A CN103857204B CN 103857204 B CN103857204 B CN 103857204B CN 201210493833 A CN201210493833 A CN 201210493833A CN 103857204 B CN103857204 B CN 103857204B
- Authority
- CN
- China
- Prior art keywords
- layer
- conductive
- copper foil
- conductive circuit
- dielectric layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000011068 loading method Methods 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 239000010410 layer Substances 0.000 claims description 266
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 98
- 239000011889 copper foil Substances 0.000 claims description 77
- 229920002120 photoresistant polymer Polymers 0.000 claims description 40
- 238000007747 plating Methods 0.000 claims description 35
- 238000003466 welding Methods 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 26
- 230000015572 biosynthetic process Effects 0.000 claims description 12
- 238000000608 laser ablation Methods 0.000 claims description 6
- 239000011241 protective layer Substances 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 4
- 229910000906 Bronze Inorganic materials 0.000 claims description 3
- 239000010974 bronze Substances 0.000 claims description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims 1
- 239000010949 copper Substances 0.000 description 20
- 229910052802 copper Inorganic materials 0.000 description 20
- 230000004888 barrier function Effects 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- 238000009713 electroplating Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210493833.7A CN103857204B (zh) | 2012-11-28 | 2012-11-28 | 承载板及其制作方法 |
TW101146768A TWI531291B (zh) | 2012-11-28 | 2012-12-12 | 承載板及其製作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210493833.7A CN103857204B (zh) | 2012-11-28 | 2012-11-28 | 承载板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103857204A CN103857204A (zh) | 2014-06-11 |
CN103857204B true CN103857204B (zh) | 2017-10-27 |
Family
ID=50864272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210493833.7A Active CN103857204B (zh) | 2012-11-28 | 2012-11-28 | 承载板及其制作方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN103857204B (zh) |
TW (1) | TWI531291B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105226031A (zh) * | 2014-07-02 | 2016-01-06 | 日月光半导体制造股份有限公司 | 衬底、其半导体封装及其制造工艺 |
CN108901148A (zh) * | 2018-08-03 | 2018-11-27 | 江苏普诺威电子股份有限公司 | 背靠背压合制作含埋容芯板的线路板的生产工艺 |
TWI693872B (zh) | 2018-10-29 | 2020-05-11 | 欣興電子股份有限公司 | 電路板製造方法 |
CN111148373B (zh) * | 2018-11-06 | 2021-06-29 | 欣兴电子股份有限公司 | 电路板制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1980541A (zh) * | 2005-12-07 | 2007-06-13 | 新光电气工业株式会社 | 制造布线基板的方法和制造电子元件安装结构的方法 |
CN101472406A (zh) * | 2007-12-25 | 2009-07-01 | 日本特殊陶业株式会社 | 布线基板的制造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3173410B2 (ja) * | 1997-03-14 | 2001-06-04 | 松下電器産業株式会社 | パッケージ基板およびその製造方法 |
TWI377655B (en) * | 2009-01-16 | 2012-11-21 | Advanced Semiconductor Eng | Method for manufacturing coreless package substrate |
-
2012
- 2012-11-28 CN CN201210493833.7A patent/CN103857204B/zh active Active
- 2012-12-12 TW TW101146768A patent/TWI531291B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1980541A (zh) * | 2005-12-07 | 2007-06-13 | 新光电气工业株式会社 | 制造布线基板的方法和制造电子元件安装结构的方法 |
CN101472406A (zh) * | 2007-12-25 | 2009-07-01 | 日本特殊陶业株式会社 | 布线基板的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201422088A (zh) | 2014-06-01 |
TWI531291B (zh) | 2016-04-21 |
CN103857204A (zh) | 2014-06-11 |
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Effective date of registration: 20161205 Address after: No. 18, Tengfei Road, Qinhuangdao Economic & Technological Development Zone, Hebei, China Applicant after: Qi Ding Technology Qinhuangdao Co.,Ltd. Applicant after: Zhen Ding Technology Co.,Ltd. Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Applicant before: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co.,Ltd. Applicant before: Zhen Ding Technology Co.,Ltd. |
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Effective date of registration: 20231017 Address after: No. 18-2, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province Patentee after: Liding semiconductor technology Qinhuangdao Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Address before: No.18, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province 066004 Patentee before: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |