CN103857204A - 承载板及其制作方法 - Google Patents
承载板及其制作方法 Download PDFInfo
- Publication number
- CN103857204A CN103857204A CN201210493833.7A CN201210493833A CN103857204A CN 103857204 A CN103857204 A CN 103857204A CN 201210493833 A CN201210493833 A CN 201210493833A CN 103857204 A CN103857204 A CN 103857204A
- Authority
- CN
- China
- Prior art keywords
- layer
- conducting wire
- copper foil
- dielectric layer
- wire layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 281
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 99
- 239000011889 copper foil Substances 0.000 claims description 78
- 229920002120 photoresistant polymer Polymers 0.000 claims description 44
- 238000011068 loading method Methods 0.000 claims description 39
- 238000003466 welding Methods 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 24
- 230000015572 biosynthetic process Effects 0.000 claims description 13
- 238000009713 electroplating Methods 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 9
- 238000000608 laser ablation Methods 0.000 claims description 6
- 239000011241 protective layer Substances 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 description 28
- 239000010949 copper Substances 0.000 description 20
- 229910052802 copper Inorganic materials 0.000 description 20
- 239000000126 substance Substances 0.000 description 12
- 230000004888 barrier function Effects 0.000 description 10
- 238000002360 preparation method Methods 0.000 description 5
- 239000002699 waste material Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
第一承载板 | 10a |
第二承载板 | 10b |
第一铜箔 | 11 |
第二铜箔 | 12 |
第一离型膜 | 13 |
第二离型膜 | 14 |
胶片 | 15 |
第一光阻层 | 31 |
第二光阻层 | 32 |
第一介电层 | 41 |
第三介电层 | 42 |
第一开孔 | 311 |
第二开孔 | 321 |
第一导电凸块 | 312 |
第二导电凸块 | 322 |
第一导电线路层 | 51 |
第一化学镀铜层 | 511 |
第一电镀阻挡图形 | 512 |
第一电镀铜层 | 513 |
第一延伸部 | 515 |
第三导电线路层 | 52 |
第二化学镀铜层 | 521 |
第二电镀阻挡图形 | 522 |
第二电镀铜层 | 523 |
第二延伸部 | 525 |
第二介电层 | 61 |
第一盲孔 | 611 |
第一导电盲孔 | 612 |
第四介电层 | 62 |
第二盲孔 | 621 |
第二导电盲孔 | 622 |
第二导电线路层 | 71 |
第四导电线路层 | 72 |
第一防焊层 | 81 |
第一开口 | 811 |
第二防焊层 | 82 |
第二开口 | 821 |
第一防护层 | 91 |
第二防护层 | 92 |
第一承载基板 | 100a |
第二承载基板 | 100b |
第一表面 | 411 |
第二表面 | 412 |
产品区域 | 103 |
废料区域 | 104 |
切口 | 105 |
多层基板 | 110 |
中心区 | 151 |
边缘区 | 152 |
表面处理层 | 90 |
Claims (13)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210493833.7A CN103857204B (zh) | 2012-11-28 | 2012-11-28 | 承载板及其制作方法 |
TW101146768A TWI531291B (zh) | 2012-11-28 | 2012-12-12 | 承載板及其製作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210493833.7A CN103857204B (zh) | 2012-11-28 | 2012-11-28 | 承载板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103857204A true CN103857204A (zh) | 2014-06-11 |
CN103857204B CN103857204B (zh) | 2017-10-27 |
Family
ID=50864272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210493833.7A Active CN103857204B (zh) | 2012-11-28 | 2012-11-28 | 承载板及其制作方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN103857204B (zh) |
TW (1) | TWI531291B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105226031A (zh) * | 2014-07-02 | 2016-01-06 | 日月光半导体制造股份有限公司 | 衬底、其半导体封装及其制造工艺 |
CN108901148A (zh) * | 2018-08-03 | 2018-11-27 | 江苏普诺威电子股份有限公司 | 背靠背压合制作含埋容芯板的线路板的生产工艺 |
CN111148373A (zh) * | 2018-11-06 | 2020-05-12 | 欣兴电子股份有限公司 | 电路板制造方法 |
US11419222B2 (en) | 2018-10-29 | 2022-08-16 | Unimicron Technology Corp. | Method of manufacturing circuit board |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1980541A (zh) * | 2005-12-07 | 2007-06-13 | 新光电气工业株式会社 | 制造布线基板的方法和制造电子元件安装结构的方法 |
US7358445B1 (en) * | 1997-03-14 | 2008-04-15 | Matsushita Electric Industrial Co., Ltd. | Circuit substrate and apparatus including the circuit substrate |
CN101472406A (zh) * | 2007-12-25 | 2009-07-01 | 日本特殊陶业株式会社 | 布线基板的制造方法 |
TW201029130A (en) * | 2009-01-16 | 2010-08-01 | Advanced Semiconductor Eng | Method for manufacturing coreless package substrate |
-
2012
- 2012-11-28 CN CN201210493833.7A patent/CN103857204B/zh active Active
- 2012-12-12 TW TW101146768A patent/TWI531291B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7358445B1 (en) * | 1997-03-14 | 2008-04-15 | Matsushita Electric Industrial Co., Ltd. | Circuit substrate and apparatus including the circuit substrate |
CN1980541A (zh) * | 2005-12-07 | 2007-06-13 | 新光电气工业株式会社 | 制造布线基板的方法和制造电子元件安装结构的方法 |
CN101472406A (zh) * | 2007-12-25 | 2009-07-01 | 日本特殊陶业株式会社 | 布线基板的制造方法 |
TW201029130A (en) * | 2009-01-16 | 2010-08-01 | Advanced Semiconductor Eng | Method for manufacturing coreless package substrate |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105226031A (zh) * | 2014-07-02 | 2016-01-06 | 日月光半导体制造股份有限公司 | 衬底、其半导体封装及其制造工艺 |
CN108901148A (zh) * | 2018-08-03 | 2018-11-27 | 江苏普诺威电子股份有限公司 | 背靠背压合制作含埋容芯板的线路板的生产工艺 |
US11419222B2 (en) | 2018-10-29 | 2022-08-16 | Unimicron Technology Corp. | Method of manufacturing circuit board |
CN111148373A (zh) * | 2018-11-06 | 2020-05-12 | 欣兴电子股份有限公司 | 电路板制造方法 |
CN111148373B (zh) * | 2018-11-06 | 2021-06-29 | 欣兴电子股份有限公司 | 电路板制造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201422088A (zh) | 2014-06-01 |
CN103857204B (zh) | 2017-10-27 |
TWI531291B (zh) | 2016-04-21 |
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Effective date of registration: 20161205 Address after: No. 18, Tengfei Road, Qinhuangdao Economic & Technological Development Zone, Hebei, China Applicant after: Qi Ding Technology Qinhuangdao Co.,Ltd. Applicant after: Zhen Ding Technology Co.,Ltd. Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Applicant before: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co.,Ltd. Applicant before: Zhen Ding Technology Co.,Ltd. |
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Effective date of registration: 20231017 Address after: No. 18-2, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province Patentee after: Liding semiconductor technology Qinhuangdao Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Address before: No.18, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province 066004 Patentee before: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |
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