JP2009132999A5 - - Google Patents

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Publication number
JP2009132999A5
JP2009132999A5 JP2008275561A JP2008275561A JP2009132999A5 JP 2009132999 A5 JP2009132999 A5 JP 2009132999A5 JP 2008275561 A JP2008275561 A JP 2008275561A JP 2008275561 A JP2008275561 A JP 2008275561A JP 2009132999 A5 JP2009132999 A5 JP 2009132999A5
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JP
Japan
Prior art keywords
power supply
plating tank
workpiece
cathode
plating
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JP2008275561A
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English (en)
Japanese (ja)
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JP5457010B2 (ja
JP2009132999A (ja
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Priority to JP2008275561A priority Critical patent/JP5457010B2/ja
Priority claimed from JP2008275561A external-priority patent/JP5457010B2/ja
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Publication of JP2009132999A5 publication Critical patent/JP2009132999A5/ja
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JP2008275561A 2007-11-01 2008-10-27 連続めっき処理装置 Active JP5457010B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008275561A JP5457010B2 (ja) 2007-11-01 2008-10-27 連続めっき処理装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007284841 2007-11-01
JP2007284841 2007-11-01
JP2008275561A JP5457010B2 (ja) 2007-11-01 2008-10-27 連続めっき処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014002497A Division JP5740014B2 (ja) 2007-11-01 2014-01-09 連続めっき処理方法

Publications (3)

Publication Number Publication Date
JP2009132999A JP2009132999A (ja) 2009-06-18
JP2009132999A5 true JP2009132999A5 (enExample) 2011-12-15
JP5457010B2 JP5457010B2 (ja) 2014-04-02

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ID=40514646

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JP2008275561A Active JP5457010B2 (ja) 2007-11-01 2008-10-27 連続めっき処理装置
JP2014002497A Active JP5740014B2 (ja) 2007-11-01 2014-01-09 連続めっき処理方法

Family Applications After (1)

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JP2014002497A Active JP5740014B2 (ja) 2007-11-01 2014-01-09 連続めっき処理方法

Country Status (6)

Country Link
US (1) US8940137B2 (enExample)
JP (2) JP5457010B2 (enExample)
KR (1) KR101540474B1 (enExample)
CN (1) CN101423969B (enExample)
DE (1) DE102008053965B4 (enExample)
TW (1) TWI415977B (enExample)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR122013014461B1 (pt) 2009-06-08 2020-10-20 Modumetal, Inc revestimento de multicamadas resistente à corrosão em um substrato e método de eletrodeposição para produção de um revestimento de multicamada
JP5613499B2 (ja) * 2010-08-25 2014-10-22 アルメックスＰｅ株式会社 表面処理装置
JP2012046783A (ja) * 2010-08-25 2012-03-08 Almex Pe Inc 表面処理装置
JP5602553B2 (ja) * 2010-09-17 2014-10-08 アルメックスＰｅ株式会社 表面処理装置
KR101500966B1 (ko) 2011-06-30 2015-03-10 아루멕쿠스 피이 가부시키가이샤 표면 처리 장치 및 워크 유지 지그
JP5833355B2 (ja) * 2011-06-30 2015-12-16 アルメックスＰｅ株式会社 表面処理装置
JP5795514B2 (ja) 2011-09-29 2015-10-14 アルメックスＰｅ株式会社 連続メッキ装置
JP6129497B2 (ja) * 2011-09-29 2017-05-17 アルメックスＰｅ株式会社 連続メッキ装置
JP5766091B2 (ja) * 2011-10-24 2015-08-19 京セラサーキットソリューションズ株式会社 めっき装置
CN102677134A (zh) * 2012-05-31 2012-09-19 无锡市喷特环保工程有限公司 连续镀槽
CN103590079A (zh) * 2012-08-14 2014-02-19 亚洲电镀器材有限公司 一种电镀方法
HK1220743A1 (zh) 2013-03-15 2017-05-12 Modumetal, Inc. 具有高硬度的镍铬纳米层压涂层
EP2971264A4 (en) 2013-03-15 2017-05-31 Modumetal, Inc. Nanolaminate coatings
EP2971266A4 (en) 2013-03-15 2017-03-01 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
CN105189826B (zh) 2013-03-15 2019-07-16 莫杜美拓有限公司 通过添加制造工艺制备的制品的电沉积的组合物和纳米层压合金
EP3194163A4 (en) 2014-09-18 2018-06-27 Modumetal, Inc. Methods of preparing articles by electrodeposition and additive manufacturing processes
CA2961508C (en) * 2014-09-18 2024-04-09 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
CN104313657A (zh) * 2014-11-10 2015-01-28 临安振有电子有限公司 Hdi印制线路板通孔的电沉积装置
CN106149039B (zh) * 2015-04-08 2017-11-24 亚硕企业股份有限公司 电镀设备
CN104862768B (zh) * 2015-05-27 2017-09-22 广州杰赛科技股份有限公司 一种电路板的电镀方法及装置
TWI698554B (zh) * 2015-10-20 2020-07-11 香港商亞洲電鍍器材有限公司 電鍍機器及電鍍方法
KR102579796B1 (ko) * 2015-10-20 2023-09-15 프로세스 오토메이션 인터내셔날 리미티드 전기도금 머신 및 전기도금 방법
JP6117891B2 (ja) * 2015-10-29 2017-04-19 アルメックスＰｅ株式会社 表面処理装置
CA3036191A1 (en) 2016-09-08 2018-03-15 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
US12227869B2 (en) 2016-09-09 2025-02-18 Modumetal, Inc. Application of laminate and nanolaminate materials to tooling and molding processes
KR102412452B1 (ko) 2016-09-14 2022-06-23 모두메탈, 인크. 신뢰가능한 고처리량 복합 전기장 발생을 위한 시스템, 및 그로부터 코팅을 제조하는 방법
WO2018062259A1 (ja) * 2016-09-29 2018-04-05 アルメックスＰｅ株式会社 ワーク保持治具及び表面処理装置
US12076965B2 (en) 2016-11-02 2024-09-03 Modumetal, Inc. Topology optimized high interface packing structures
CN110770372B (zh) 2017-04-21 2022-10-11 莫杜美拓有限公司 具有电沉积涂层的管状制品及其生产系统和方法
JP6779545B2 (ja) 2017-05-30 2020-11-04 株式会社アルメックステクノロジーズ 表面処理装置及び搬送治具
CN107119309A (zh) * 2017-06-15 2017-09-01 临安金奥科技有限公司 一种对板材表面进行单面连续处理的装置
CN111247273B (zh) * 2017-10-20 2022-12-20 Almex 科技株式会社 表面处理装置和工件保持夹具
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
CN109468677A (zh) * 2018-12-05 2019-03-15 珠海杰赛科技有限公司 一种垂直连续电镀方法
CN215925133U (zh) * 2021-06-30 2022-03-01 厦门海辰新能源科技有限公司 一种用于镀膜机的阳极板及镀膜机
CN114775023A (zh) * 2022-05-26 2022-07-22 枣庄睿诺光电信息有限公司 一种电镀装置
CN115505996B (zh) * 2022-11-04 2023-03-10 昆山东威科技股份有限公司 一种电镀装置

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2724691A (en) * 1951-06-13 1955-11-22 Western Electric Co Apparatus for electroplating articles
US2724690A (en) * 1951-06-13 1955-11-22 Western Electric Co Apparatus for electroplating articles
US2935989A (en) * 1957-12-04 1960-05-10 Hanson Van Winkle Munning Co Processing apparatus
US3455809A (en) * 1966-11-25 1969-07-15 Baker Bros Inc Adjustable electrode transporter for lateral electrode spacing during electroplating
GB1557017A (en) * 1976-07-20 1979-12-05 Heritage Silversmiths Ltd Electropolishing of stainless steel
JPS5321048A (en) * 1976-08-10 1978-02-27 Nippon Electric Co Constant current density plating device
US4184927A (en) * 1976-12-30 1980-01-22 Riken Keikinzoku Kogyo Kabushiki Kaisha Process and apparatus for effecting surface treatment of workpieces
FR2390517A1 (fr) * 1977-05-10 1978-12-08 Coppertron Sa Installation pour l'electro-production de cuivre en feuilles destinees a etre appliquees en particulier sur des materiaux dielectriques
US4189360A (en) * 1979-03-12 1980-02-19 Woods Craig P Process for continuous anodizing of aluminum
US4263122A (en) * 1979-12-03 1981-04-21 Programmed Coating Systems, Inc. Electrocoating equipment
DE2951708A1 (de) * 1979-12-19 1981-07-02 Schering Ag Berlin Und Bergkamen, 1000 Berlin Verfahren und vorrichtung zur automatischen regelung von teilstromstaerken eines gleichrichters
US4337134A (en) * 1980-02-27 1982-06-29 Elfab Corporation Continuous truck mounted printed circuit board plating system
US4401522A (en) * 1980-09-29 1983-08-30 Micro-Plate, Inc. Plating method and apparatus
US4378281A (en) * 1981-06-25 1983-03-29 Napco, Inc. High speed plating of flat planar workpieces
US4534843A (en) * 1983-01-28 1985-08-13 Technic, Inc. Apparatus for electroplating and chemically treating contact elements of encapsulated electronic components and their like
JPS61133400A (ja) * 1984-12-03 1986-06-20 Kosaku:Kk 電気めつき装置
US4775046A (en) * 1986-01-17 1988-10-04 Future Automation, Inc. Transport belt for production parts
DE3929728A1 (de) * 1989-09-07 1991-03-14 Werner M Kraemer Anlage zur herstellung von leiterplatten und verfahren zum betreiben der anlage
DE3939681A1 (de) * 1989-12-01 1991-06-06 Schering Ag Verfahren zur steuerung des ablaufes von galvanischen anlagen, sowie zur durchfuehrung des verfahrens dienender anordnung
JPH0774479B2 (ja) * 1990-03-22 1995-08-09 三菱電機株式会社 電気めっき装置
JPH06346289A (ja) * 1993-06-14 1994-12-20 Fujikura Ltd 陽極酸化処理装置および陽極酸化処理方法
DE59501606D1 (de) * 1994-05-11 1998-04-16 Siemens Sa Vorrichtung zur behandlung von leiterplatten
DE19539868C1 (de) * 1995-10-26 1997-02-20 Lea Ronal Gmbh Transportvorrichtung und Transportsystem zur vertikalen Führung von plattenähnlichen Gegenständen zur chemischen oder elektrolytischen Oberflächenbehandlung
DE19717510C1 (de) * 1997-04-25 1998-10-01 Atotech Deutschland Gmbh Vorrichtung zur Abblendung von Galvanisiergut in Durchlaufanlagen
TW373034B (en) * 1997-10-30 1999-11-01 Kazuo Ohba Automatic plating method and apparatus thereof
TW438906B (en) * 1998-06-11 2001-06-07 Kazuo Ohba Continuous plating apparatus
US6471846B1 (en) * 1998-09-25 2002-10-29 Kazuo Ohba Electric feeding method and apparatus for a continuous plating apparatus
JP3025254B1 (ja) * 1999-02-05 2000-03-27 藤本電気商事有限会社 めっき装置およびめっき方法
JP3754262B2 (ja) * 2000-02-16 2006-03-08 株式会社アルメックス 表面処理装置
US6793792B2 (en) * 2001-01-12 2004-09-21 Unitive International Limited Curaco Electroplating methods including maintaining a determined electroplating voltage and related systems
JP4157308B2 (ja) * 2001-06-27 2008-10-01 シャープ株式会社 めっき膜の形成方法及び該方法によりめっき膜が形成された電子部品
DE10153171B4 (de) * 2001-10-27 2004-09-16 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Behandeln von Teilen in Durchlaufanlagen
WO2004107422A2 (en) * 2003-05-27 2004-12-09 Ebara Corporation Plating apparatus and plating method
KR100539239B1 (ko) * 2003-06-25 2005-12-27 삼성전자주식회사 도금 중단에 의해 불량이 발생되는 것을 방지하는 도금방법 및 이에 이용되는 도금 장비
JP2005097721A (ja) * 2003-08-27 2005-04-14 Yamaha Corp 両面メッキ装置および両面メッキ方法
JP4707941B2 (ja) * 2003-09-02 2011-06-22 アルメックスＰｅ株式会社 めっき処理装置およびめっき処理方法
JP2006037134A (ja) * 2004-07-23 2006-02-09 Chuo Seisakusho Ltd 連続搬送式めっき装置の電流制御方法
US20060213778A1 (en) * 2005-03-23 2006-09-28 Taiwan Semiconductor Manufacturing Co., Ltd. Method for electrochemical plating on semiconductor wafers
JP4937154B2 (ja) * 2008-02-06 2012-05-23 デュポン神東・オートモティブ・システムズ株式会社 電着膜厚自動制御方法

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