JP2009117767A5 - - Google Patents

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Publication number
JP2009117767A5
JP2009117767A5 JP2007292142A JP2007292142A JP2009117767A5 JP 2009117767 A5 JP2009117767 A5 JP 2009117767A5 JP 2007292142 A JP2007292142 A JP 2007292142A JP 2007292142 A JP2007292142 A JP 2007292142A JP 2009117767 A5 JP2009117767 A5 JP 2009117767A5
Authority
JP
Japan
Prior art keywords
semiconductor chip
wiring
semiconductor device
substrate
wiring layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007292142A
Other languages
English (en)
Japanese (ja)
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JP2009117767A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007292142A priority Critical patent/JP2009117767A/ja
Priority claimed from JP2007292142A external-priority patent/JP2009117767A/ja
Priority to US12/266,075 priority patent/US20090121334A1/en
Priority to TW097143009A priority patent/TW200921821A/zh
Priority to KR1020080110509A priority patent/KR20090048362A/ko
Publication of JP2009117767A publication Critical patent/JP2009117767A/ja
Publication of JP2009117767A5 publication Critical patent/JP2009117767A5/ja
Pending legal-status Critical Current

Links

JP2007292142A 2007-11-09 2007-11-09 半導体装置の製造方法及びそれにより製造した半導体装置 Pending JP2009117767A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007292142A JP2009117767A (ja) 2007-11-09 2007-11-09 半導体装置の製造方法及びそれにより製造した半導体装置
US12/266,075 US20090121334A1 (en) 2007-11-09 2008-11-06 Manufacturing method of semiconductor apparatus and semiconductor apparatus
TW097143009A TW200921821A (en) 2007-11-09 2008-11-07 Manufacturing method of semiconductor apparatus and semiconductor apparatus
KR1020080110509A KR20090048362A (ko) 2007-11-09 2008-11-07 반도체 장치의 제조 방법 및 반도체 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007292142A JP2009117767A (ja) 2007-11-09 2007-11-09 半導体装置の製造方法及びそれにより製造した半導体装置

Publications (2)

Publication Number Publication Date
JP2009117767A JP2009117767A (ja) 2009-05-28
JP2009117767A5 true JP2009117767A5 (enExample) 2010-11-04

Family

ID=40622940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007292142A Pending JP2009117767A (ja) 2007-11-09 2007-11-09 半導体装置の製造方法及びそれにより製造した半導体装置

Country Status (4)

Country Link
US (1) US20090121334A1 (enExample)
JP (1) JP2009117767A (enExample)
KR (1) KR20090048362A (enExample)
TW (1) TW200921821A (enExample)

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EP2337068A1 (en) 2009-12-18 2011-06-22 Nxp B.V. Pre-soldered leadless package
US8298863B2 (en) * 2010-04-29 2012-10-30 Texas Instruments Incorporated TCE compensation for package substrates for reduced die warpage assembly
US8455991B2 (en) * 2010-09-24 2013-06-04 Stats Chippac Ltd. Integrated circuit packaging system with warpage control and method of manufacture thereof
US8410604B2 (en) * 2010-10-26 2013-04-02 Xilinx, Inc. Lead-free structures in a semiconductor device
US8698303B2 (en) 2010-11-23 2014-04-15 Ibiden Co., Ltd. Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device
KR101719636B1 (ko) * 2011-01-28 2017-04-05 삼성전자 주식회사 반도체 장치 및 그 제조 방법
JP2013183002A (ja) * 2012-03-01 2013-09-12 Ibiden Co Ltd 電子部品
US9406579B2 (en) * 2012-05-14 2016-08-02 STATS ChipPAC Pte. Ltd. Semiconductor device and method of controlling warpage in semiconductor package
JP6470095B2 (ja) * 2014-07-25 2019-02-13 京セラ株式会社 配線基板
TWI632647B (zh) * 2016-01-18 2018-08-11 矽品精密工業股份有限公司 封裝製程及其所用之封裝基板
US10580710B2 (en) 2017-08-31 2020-03-03 Micron Technology, Inc. Semiconductor device with a protection mechanism and associated systems, devices, and methods
US10381329B1 (en) 2018-01-24 2019-08-13 Micron Technology, Inc. Semiconductor device with a layered protection mechanism and associated systems, devices, and methods
US10475771B2 (en) 2018-01-24 2019-11-12 Micron Technology, Inc. Semiconductor device with an electrically-coupled protection mechanism and associated systems, devices, and methods
JP7189672B2 (ja) * 2018-04-18 2022-12-14 新光電気工業株式会社 半導体装置及びその製造方法
US12205877B2 (en) * 2019-02-21 2025-01-21 AT&S(Chongqing) Company Limited Ultra-thin component carrier having high stiffness and method of manufacturing the same
CN115547846A (zh) * 2019-02-21 2022-12-30 奥特斯科技(重庆)有限公司 部件承载件及其制造方法和电气装置
CN114582731A (zh) * 2022-05-05 2022-06-03 华进半导体封装先导技术研发中心有限公司 一种层叠封装的下封装体结构及其形成方法
CN118782478A (zh) * 2024-07-01 2024-10-15 中科同德微电子科技(大同)有限公司 Igbt芯片封装方法及igbt芯片封装模块

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Publication number Priority date Publication date Assignee Title
JPH01313969A (ja) * 1988-06-13 1989-12-19 Hitachi Ltd 半導体装置
US5783465A (en) * 1997-04-03 1998-07-21 Lucent Technologies Inc. Compliant bump technology
JP3834426B2 (ja) * 1997-09-02 2006-10-18 沖電気工業株式会社 半導体装置
US5977626A (en) * 1998-08-12 1999-11-02 Industrial Technology Research Institute Thermally and electrically enhanced PBGA package
US6191360B1 (en) * 1999-04-26 2001-02-20 Advanced Semiconductor Engineering, Inc. Thermally enhanced BGA package
TW411037U (en) * 1999-06-11 2000-11-01 Ind Tech Res Inst Integrated circuit packaging structure with dual directions of thermal conduction path
JP2001267473A (ja) * 2000-03-17 2001-09-28 Hitachi Ltd 半導体装置およびその製造方法
US6566748B1 (en) * 2000-07-13 2003-05-20 Fujitsu Limited Flip-chip semiconductor device having an improved reliability
US6432742B1 (en) * 2000-08-17 2002-08-13 St Assembly Test Services Pte Ltd. Methods of forming drop-in heat spreader plastic ball grid array (PBGA) packages
US6525420B2 (en) * 2001-01-30 2003-02-25 Thermal Corp. Semiconductor package with lid heat spreader
US6519154B1 (en) * 2001-08-17 2003-02-11 Intel Corporation Thermal bus design to cool a microelectronic die
JP2003163459A (ja) * 2001-11-26 2003-06-06 Sony Corp 高周波回路ブロック体及びその製造方法、高周波モジュール装置及びその製造方法。
US6775140B2 (en) * 2002-10-21 2004-08-10 St Assembly Test Services Ltd. Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices
US6747350B1 (en) * 2003-06-06 2004-06-08 Silicon Integrated Systems Corp. Flip chip package structure
TWI236118B (en) * 2003-06-18 2005-07-11 Advanced Semiconductor Eng Package structure with a heat spreader and manufacturing method thereof
US7608789B2 (en) * 2004-08-12 2009-10-27 Epcos Ag Component arrangement provided with a carrier substrate
US7348663B1 (en) * 2005-07-15 2008-03-25 Asat Ltd. Integrated circuit package and method for fabricating same
US7787252B2 (en) * 2008-12-04 2010-08-31 Lsi Corporation Preferentially cooled electronic device

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