JP2009049134A5 - - Google Patents

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Publication number
JP2009049134A5
JP2009049134A5 JP2007212949A JP2007212949A JP2009049134A5 JP 2009049134 A5 JP2009049134 A5 JP 2009049134A5 JP 2007212949 A JP2007212949 A JP 2007212949A JP 2007212949 A JP2007212949 A JP 2007212949A JP 2009049134 A5 JP2009049134 A5 JP 2009049134A5
Authority
JP
Japan
Prior art keywords
internal connection
wiring pattern
metal layer
connection terminal
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007212949A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009049134A (ja
JP5048420B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2007212949A external-priority patent/JP5048420B2/ja
Priority to JP2007212949A priority Critical patent/JP5048420B2/ja
Priority to KR1020080079244A priority patent/KR20090018576A/ko
Priority to EP08162325A priority patent/EP2026380A3/en
Priority to US12/190,789 priority patent/US7719123B2/en
Priority to CNA2008101459885A priority patent/CN101369546A/zh
Publication of JP2009049134A publication Critical patent/JP2009049134A/ja
Priority to US12/749,758 priority patent/US8148254B2/en
Publication of JP2009049134A5 publication Critical patent/JP2009049134A5/ja
Publication of JP5048420B2 publication Critical patent/JP5048420B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007212949A 2007-08-17 2007-08-17 半導体装置及びその製造方法 Active JP5048420B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007212949A JP5048420B2 (ja) 2007-08-17 2007-08-17 半導体装置及びその製造方法
KR1020080079244A KR20090018576A (ko) 2007-08-17 2008-08-13 반도체 장치의 제조 방법 및 반도체 장치
EP08162325A EP2026380A3 (en) 2007-08-17 2008-08-13 Method of manufacturing semiconductor device
US12/190,789 US7719123B2 (en) 2007-08-17 2008-08-13 Method of manufacturing semiconductor device
CNA2008101459885A CN101369546A (zh) 2007-08-17 2008-08-15 制造半导体器件的方法
US12/749,758 US8148254B2 (en) 2007-08-17 2010-03-30 Method of manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007212949A JP5048420B2 (ja) 2007-08-17 2007-08-17 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2009049134A JP2009049134A (ja) 2009-03-05
JP2009049134A5 true JP2009049134A5 (enExample) 2010-07-01
JP5048420B2 JP5048420B2 (ja) 2012-10-17

Family

ID=39766905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007212949A Active JP5048420B2 (ja) 2007-08-17 2007-08-17 半導体装置及びその製造方法

Country Status (5)

Country Link
US (2) US7719123B2 (enExample)
EP (1) EP2026380A3 (enExample)
JP (1) JP5048420B2 (enExample)
KR (1) KR20090018576A (enExample)
CN (1) CN101369546A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010103300A (ja) * 2008-10-23 2010-05-06 Sanyo Electric Co Ltd 半導体装置及びその製造方法
US7956471B2 (en) * 2008-11-12 2011-06-07 Freescale Semiconductor, Inc. Mold and substrate for use with mold
JP5383460B2 (ja) * 2009-12-04 2014-01-08 新光電気工業株式会社 半導体装置の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5148265A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5412539A (en) * 1993-10-18 1995-05-02 Hughes Aircraft Company Multichip module with a mandrel-produced interconnecting decal
JP3502776B2 (ja) * 1998-11-26 2004-03-02 新光電気工業株式会社 バンプ付き金属箔及び回路基板及びこれを用いた半導体装置
JP4707283B2 (ja) * 2001-08-30 2011-06-22 イビデン株式会社 半導体チップ
JP3717899B2 (ja) * 2002-04-01 2005-11-16 Ｎｅｃエレクトロニクス株式会社 半導体装置及びその製造方法
JP3614828B2 (ja) 2002-04-05 2005-01-26 沖電気工業株式会社 チップサイズパッケージの製造方法
JP2004193497A (ja) * 2002-12-13 2004-07-08 Nec Electronics Corp チップサイズパッケージおよびその製造方法
JP2008108849A (ja) 2006-10-24 2008-05-08 Shinko Electric Ind Co Ltd 半導体装置および半導体装置の製造方法

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