KR20090018576A - 반도체 장치의 제조 방법 및 반도체 장치 - Google Patents

반도체 장치의 제조 방법 및 반도체 장치 Download PDF

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Publication number
KR20090018576A
KR20090018576A KR1020080079244A KR20080079244A KR20090018576A KR 20090018576 A KR20090018576 A KR 20090018576A KR 1020080079244 A KR1020080079244 A KR 1020080079244A KR 20080079244 A KR20080079244 A KR 20080079244A KR 20090018576 A KR20090018576 A KR 20090018576A
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KR
South Korea
Prior art keywords
connection terminal
internal connection
metal layer
wiring pattern
semiconductor device
Prior art date
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Withdrawn
Application number
KR1020080079244A
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English (en)
Korean (ko)
Inventor
다쿠야 가자마
Original Assignee
신꼬오덴기 고교 가부시키가이샤
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Application filed by 신꼬오덴기 고교 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20090018576A publication Critical patent/KR20090018576A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020080079244A 2007-08-17 2008-08-13 반도체 장치의 제조 방법 및 반도체 장치 Withdrawn KR20090018576A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00212949 2007-08-17
JP2007212949A JP5048420B2 (ja) 2007-08-17 2007-08-17 半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
KR20090018576A true KR20090018576A (ko) 2009-02-20

Family

ID=39766905

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080079244A Withdrawn KR20090018576A (ko) 2007-08-17 2008-08-13 반도체 장치의 제조 방법 및 반도체 장치

Country Status (5)

Country Link
US (2) US7719123B2 (enExample)
EP (1) EP2026380A3 (enExample)
JP (1) JP5048420B2 (enExample)
KR (1) KR20090018576A (enExample)
CN (1) CN101369546A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010103300A (ja) * 2008-10-23 2010-05-06 Sanyo Electric Co Ltd 半導体装置及びその製造方法
US7956471B2 (en) 2008-11-12 2011-06-07 Freescale Semiconductor, Inc. Mold and substrate for use with mold
JP5383460B2 (ja) * 2009-12-04 2014-01-08 新光電気工業株式会社 半導体装置の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5148265A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5412539A (en) * 1993-10-18 1995-05-02 Hughes Aircraft Company Multichip module with a mandrel-produced interconnecting decal
JP3502776B2 (ja) * 1998-11-26 2004-03-02 新光電気工業株式会社 バンプ付き金属箔及び回路基板及びこれを用いた半導体装置
JP4707283B2 (ja) * 2001-08-30 2011-06-22 イビデン株式会社 半導体チップ
JP3717899B2 (ja) * 2002-04-01 2005-11-16 Ｎｅｃエレクトロニクス株式会社 半導体装置及びその製造方法
JP3614828B2 (ja) * 2002-04-05 2005-01-26 沖電気工業株式会社 チップサイズパッケージの製造方法
JP2004193497A (ja) * 2002-12-13 2004-07-08 Nec Electronics Corp チップサイズパッケージおよびその製造方法
JP2008108849A (ja) * 2006-10-24 2008-05-08 Shinko Electric Ind Co Ltd 半導体装置および半導体装置の製造方法

Also Published As

Publication number Publication date
EP2026380A2 (en) 2009-02-18
US8148254B2 (en) 2012-04-03
US20090045529A1 (en) 2009-02-19
US20100184257A1 (en) 2010-07-22
JP5048420B2 (ja) 2012-10-17
US7719123B2 (en) 2010-05-18
JP2009049134A (ja) 2009-03-05
EP2026380A3 (en) 2009-11-18
CN101369546A (zh) 2009-02-18

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Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20080813

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