JP2009033178A5 - - Google Patents

Download PDF

Info

Publication number
JP2009033178A5
JP2009033178A5 JP2008196676A JP2008196676A JP2009033178A5 JP 2009033178 A5 JP2009033178 A5 JP 2009033178A5 JP 2008196676 A JP2008196676 A JP 2008196676A JP 2008196676 A JP2008196676 A JP 2008196676A JP 2009033178 A5 JP2009033178 A5 JP 2009033178A5
Authority
JP
Japan
Prior art keywords
vacuum chuck
circular groove
grooves
inner circular
mils
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008196676A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009033178A (ja
JP5798283B2 (ja
Filing date
Publication date
Priority claimed from US11/830,589 external-priority patent/US20090031955A1/en
Application filed filed Critical
Publication of JP2009033178A publication Critical patent/JP2009033178A/ja
Publication of JP2009033178A5 publication Critical patent/JP2009033178A5/ja
Application granted granted Critical
Publication of JP5798283B2 publication Critical patent/JP5798283B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008196676A 2007-07-30 2008-07-30 軸対称及び均一熱プロファイルの真空チャック型ヒーター Expired - Fee Related JP5798283B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/830,589 US20090031955A1 (en) 2007-07-30 2007-07-30 Vacuum chucking heater of axisymmetrical and uniform thermal profile
US11/830,589 2007-07-30

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013259036A Division JP2014053645A (ja) 2007-07-30 2013-12-16 軸対称及び均一熱プロファイルの真空チャック型ヒーター

Publications (3)

Publication Number Publication Date
JP2009033178A JP2009033178A (ja) 2009-02-12
JP2009033178A5 true JP2009033178A5 (enExample) 2011-09-15
JP5798283B2 JP5798283B2 (ja) 2015-10-21

Family

ID=40330933

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008196676A Expired - Fee Related JP5798283B2 (ja) 2007-07-30 2008-07-30 軸対称及び均一熱プロファイルの真空チャック型ヒーター
JP2013259036A Withdrawn JP2014053645A (ja) 2007-07-30 2013-12-16 軸対称及び均一熱プロファイルの真空チャック型ヒーター

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013259036A Withdrawn JP2014053645A (ja) 2007-07-30 2013-12-16 軸対称及び均一熱プロファイルの真空チャック型ヒーター

Country Status (6)

Country Link
US (1) US20090031955A1 (enExample)
JP (2) JP5798283B2 (enExample)
KR (2) KR101062595B1 (enExample)
CN (1) CN101358338B (enExample)
SG (1) SG149792A1 (enExample)
TW (1) TWI491757B (enExample)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8198567B2 (en) * 2008-01-15 2012-06-12 Applied Materials, Inc. High temperature vacuum chuck assembly
US8637794B2 (en) * 2009-10-21 2014-01-28 Lam Research Corporation Heating plate with planar heating zones for semiconductor processing
US8791392B2 (en) 2010-10-22 2014-07-29 Lam Research Corporation Methods of fault detection for multiplexed heater array
US8546732B2 (en) * 2010-11-10 2013-10-01 Lam Research Corporation Heating plate with planar heater zones for semiconductor processing
DE102010055675A1 (de) * 2010-12-22 2012-06-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Haltevorrichtung für Substrate sowie Verfahren zur Beschichtung eines Substrates
JP6114698B2 (ja) 2011-03-01 2017-04-12 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ デュアルロードロック構成内の除害及びストリップ処理チャンバ
CN203205393U (zh) 2011-03-01 2013-09-18 应用材料公司 用于转移基板及限制自由基的箍组件
WO2012118606A2 (en) * 2011-03-01 2012-09-07 Applied Materials, Inc. Thin heated substrate support
US11171008B2 (en) 2011-03-01 2021-11-09 Applied Materials, Inc. Abatement and strip process chamber in a dual load lock configuration
US20120267423A1 (en) * 2011-04-19 2012-10-25 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and Apparatus for Thin Die Processing
US10242890B2 (en) * 2011-08-08 2019-03-26 Applied Materials, Inc. Substrate support with heater
DE102012100825A1 (de) 2011-12-01 2013-06-06 solar-semi GmbH Vorrichtung zum Bearbeiten eines Substrats und Verfahren hierzu
CN106847737B (zh) 2012-02-29 2020-11-13 应用材料公司 配置中的除污及剥除处理腔室
US9478447B2 (en) * 2012-11-26 2016-10-25 Applied Materials, Inc. Substrate support with wire mesh plasma containment
CN104637854B (zh) * 2013-11-13 2018-12-07 沈阳新松机器人自动化股份有限公司 一种用于吸附硅片的吸盘
CN112053991B (zh) * 2014-05-21 2022-04-15 应用材料公司 热处理基座
CN105161449A (zh) * 2014-05-30 2015-12-16 盛美半导体设备（上海）有限公司 晶圆固定装置
KR101477660B1 (ko) * 2014-08-01 2014-12-31 (주)지원에프알에스 탄성링 및 탄성밴드를 이용하여 완충칼럼의 복원력을 향상시킨 기능성 신발물품
JP6394337B2 (ja) * 2014-12-04 2018-09-26 株式会社Sumco 吸着チャック、面取り研磨装置、及び、シリコンウェーハの面取り研磨方法
US9728437B2 (en) 2015-02-03 2017-08-08 Applied Materials, Inc. High temperature chuck for plasma processing systems
US9691645B2 (en) 2015-08-06 2017-06-27 Applied Materials, Inc. Bolted wafer chuck thermal management systems and methods for wafer processing systems
US9741593B2 (en) 2015-08-06 2017-08-22 Applied Materials, Inc. Thermal management systems and methods for wafer processing systems
JP6674800B2 (ja) * 2016-03-07 2020-04-01 日本特殊陶業株式会社 基板支持装置
KR102523850B1 (ko) * 2016-07-11 2023-04-21 주식회사 미코세라믹스 척 구조물 및 척 구조물을 갖는 칩 분리 장치
JP6847610B2 (ja) * 2016-09-14 2021-03-24 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
US10468290B2 (en) * 2016-11-02 2019-11-05 Ultratech, Inc. Wafer chuck apparatus with micro-channel regions
JP6829118B2 (ja) * 2017-03-16 2021-02-10 株式会社日本製鋼所 レーザ照射装置、レーザ照射方法、及び半導体装置の製造方法
KR102339350B1 (ko) * 2017-04-03 2021-12-16 주식회사 미코세라믹스 세라믹 히터
US20210202282A1 (en) * 2017-10-19 2021-07-01 Evatec Ag Method and apparatus for treating a substrate
US11361981B2 (en) * 2018-05-02 2022-06-14 Applied Materials, Inc. Batch substrate support with warped substrate capability
JP6959201B2 (ja) * 2018-08-29 2021-11-02 日本碍子株式会社 セラミックヒータ
CN109280904A (zh) * 2018-11-27 2019-01-29 中山德华芯片技术有限公司 一种应用于晶格失配结构外延生长的石墨盘
CN111168870A (zh) * 2020-02-27 2020-05-19 石嘴山市新宇兰山电碳有限公司 一种数控车床专用曲面加工真空吸附模具
CN111490002B (zh) * 2020-04-21 2023-06-27 錼创显示科技股份有限公司 载盘结构
JP7391294B2 (ja) * 2021-12-23 2023-12-05 住友電気工業株式会社 ヒータ
CN115142050B (zh) * 2022-09-05 2022-11-25 拓荆科技(北京)有限公司 真空吸附加热盘及装置
CN115354307B (zh) * 2022-09-23 2023-08-18 拓荆科技股份有限公司 一种真空加热衬底设备
KR102650161B1 (ko) * 2023-01-05 2024-03-22 주식회사 미코세라믹스 세라믹 서셉터
US12241929B2 (en) 2023-04-21 2025-03-04 Taiwan Semiconductor Manufacturing Company, Ltd. Work press assembly for test handler
CN119361427B (zh) * 2024-09-27 2025-10-24 深圳市鹏新旭技术有限公司 半导体器件及其制备方法和半导体设备

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4183545A (en) * 1978-07-28 1980-01-15 Advanced Simiconductor Materials/America Rotary vacuum-chuck using no rotary union
JPH01134945A (ja) * 1987-11-19 1989-05-26 Tokyo Electron Ltd ウエハ保持装置
JP2908516B2 (ja) * 1990-05-07 1999-06-21 キヤノン株式会社 真空吸着式ウエハ保持装置
JPH06244269A (ja) * 1992-09-07 1994-09-02 Mitsubishi Electric Corp 半導体製造装置並びに半導体製造装置におけるウエハ真空チャック装置及びガスクリーニング方法及び窒化膜形成方法
US5695568A (en) * 1993-04-05 1997-12-09 Applied Materials, Inc. Chemical vapor deposition chamber
JPH0722496A (ja) * 1993-06-29 1995-01-24 Nikon Corp 基板の吸着保持装置
US5342068A (en) * 1993-08-26 1994-08-30 Texas Instruments Incorporated Laminar flow vacuum chuck
JPH10116760A (ja) * 1996-10-08 1998-05-06 Nikon Corp 露光装置及び基板保持装置
TW524873B (en) * 1997-07-11 2003-03-21 Applied Materials Inc Improved substrate supporting apparatus and processing chamber
US5989444A (en) * 1998-02-13 1999-11-23 Zywno; Marek Fluid bearings and vacuum chucks and methods for producing same
US6179924B1 (en) * 1998-04-28 2001-01-30 Applied Materials, Inc. Heater for use in substrate processing apparatus to deposit tungsten
US6241825B1 (en) * 1999-04-16 2001-06-05 Cutek Research Inc. Compliant wafer chuck
US6464795B1 (en) * 1999-05-21 2002-10-15 Applied Materials, Inc. Substrate support member for a processing chamber
JP2001144197A (ja) * 1999-11-11 2001-05-25 Fujitsu Ltd 半導体装置、半導体装置の製造方法及び試験方法
JP2002057209A (ja) * 2000-06-01 2002-02-22 Tokyo Electron Ltd 枚葉式処理装置および枚葉式処理方法
KR100523113B1 (ko) * 2000-06-01 2005-10-19 동경 엘렉트론 주식회사 반도체 처리용의 단일기판식 처리 장치
US6413321B1 (en) * 2000-12-07 2002-07-02 Applied Materials, Inc. Method and apparatus for reducing particle contamination on wafer backside during CVD process
KR20030001842A (ko) * 2001-06-28 2003-01-08 삼성전자 주식회사 이디에스 설비에 구비된 프로브 척
JP2004009165A (ja) * 2002-06-04 2004-01-15 Ngk Spark Plug Co Ltd 吸着用チャック
JP2004039978A (ja) * 2002-07-05 2004-02-05 Hirata Corp 基板保持装置
US20040016745A1 (en) * 2002-07-29 2004-01-29 Applied Materials, Inc. Method for achieving process uniformity by modifying thermal coupling between heater and substrate
DE10235482B3 (de) * 2002-08-02 2004-01-22 Süss Microtec Lithography Gmbh Vorrichtung zum Fixieren dünner und flexibler Substrate
JP4090313B2 (ja) * 2002-09-11 2008-05-28 大日本スクリーン製造株式会社 基板保持装置および基板処理装置
KR20040103648A (ko) * 2003-05-30 2004-12-09 삼성전자주식회사 반도체 기판지지 척 및 박막 증착 장치
JP2006005095A (ja) * 2004-06-16 2006-01-05 Ngk Insulators Ltd 基板加熱装置とその製造方法
JP2006310697A (ja) * 2005-05-02 2006-11-09 Dainippon Screen Mfg Co Ltd 吸着チャック
KR200405748Y1 (ko) * 2005-10-27 2006-01-11 (주)쎄미시스코 다공질 실리콘을 이용한 이중 구조의 진공 척
JP5019811B2 (ja) * 2006-07-20 2012-09-05 東京エレクトロン株式会社 静電吸着電極の補修方法

Similar Documents

Publication Publication Date Title
JP2009033178A5 (enExample)
SG149792A1 (en) Vacuum chucking heater of axisymmetrical and uniform thermal profile
JP2012507138A5 (enExample)
US20170167023A1 (en) Silicon or silicon carbide gas injector for substrate processing systems
TWI614837B (zh) 具有受控制的封閉間隙之基板支撐件
CN201257599Y (zh) 一种真空吸盘
JP2013513239A5 (enExample)
JP2016530705A5 (enExample)
KR20160047403A (ko) 정전척 및 그 정전척에 사용되는 베이스 부재
JP2010287573A (ja) 基板加熱ユニット及びこれを含む基板処理装置
JP2018518060A5 (enExample)
ATE529544T1 (de) Epitaktischer barrelsuszeptor zur verbesserter gleichmässigen dicke einer epitaktischen schicht
CN105382601B (zh) 一种适用于薄片工件的多尺寸真空夹具
JP2018078284A5 (enExample)
GB0719629D0 (en) Systems and methods for fabricating multi-material joining mechanisms
CN114512435A (zh) 一种高精度晶圆载台陶瓷载盘
CN105161449A (zh) 晶圆固定装置
JP2008244015A (ja) 半導体製造装置用サセプタ
JP5199012B2 (ja) チャックロール
JP2010239020A (ja) 半導体装置用ウエハホルダ
KR20140002335U (ko) 대형 파이프 가공용 지그
JP2014171389A5 (enExample)
JP2010103225A (ja) プラズマ処理装置用電極板
JP7170546B2 (ja) 試料保持具
JP2010089846A (ja) チャックロール