JP2009033151A5 - - Google Patents
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- Publication number
- JP2009033151A5 JP2009033151A5 JP2008174221A JP2008174221A JP2009033151A5 JP 2009033151 A5 JP2009033151 A5 JP 2009033151A5 JP 2008174221 A JP2008174221 A JP 2008174221A JP 2008174221 A JP2008174221 A JP 2008174221A JP 2009033151 A5 JP2009033151 A5 JP 2009033151A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- single crystal
- substrate
- crystal semiconductor
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 239000004065 semiconductor Substances 0.000 claims 105
- 239000010410 layer Substances 0.000 claims 103
- 239000000758 substrate Substances 0.000 claims 80
- 239000013078 crystal Substances 0.000 claims 49
- 238000005530 etching Methods 0.000 claims 12
- 230000001678 irradiating effect Effects 0.000 claims 12
- 238000004519 manufacturing process Methods 0.000 claims 12
- 238000000034 method Methods 0.000 claims 9
- 238000010438 heat treatment Methods 0.000 claims 8
- 150000002500 ions Chemical class 0.000 claims 8
- 238000005498 polishing Methods 0.000 claims 6
- 239000011241 protective layer Substances 0.000 claims 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 5
- 229910052710 silicon Inorganic materials 0.000 claims 5
- 239000010703 silicon Substances 0.000 claims 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 2
- 239000000460 chlorine Substances 0.000 claims 2
- 229910052801 chlorine Inorganic materials 0.000 claims 2
- -1 fluorine ions Chemical class 0.000 claims 2
- 229910000041 hydrogen chloride Inorganic materials 0.000 claims 2
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 claims 2
- 230000001590 oxidative effect Effects 0.000 claims 2
- 239000001301 oxygen Substances 0.000 claims 2
- 229910052760 oxygen Inorganic materials 0.000 claims 2
- 238000007517 polishing process Methods 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008174221A JP2009033151A (ja) | 2007-07-04 | 2008-07-03 | Ｓｏｉ基板の製造方法及び半導体装置の作製方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007175757 | 2007-07-04 | ||
| JP2008174221A JP2009033151A (ja) | 2007-07-04 | 2008-07-03 | Ｓｏｉ基板の製造方法及び半導体装置の作製方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009033151A JP2009033151A (ja) | 2009-02-12 |
| JP2009033151A5 true JP2009033151A5 (enExample) | 2011-08-04 |
Family
ID=40213926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008174221A Withdrawn JP2009033151A (ja) | 2007-07-04 | 2008-07-03 | Ｓｏｉ基板の製造方法及び半導体装置の作製方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7678668B2 (enExample) |
| JP (1) | JP2009033151A (enExample) |
| KR (1) | KR101481974B1 (enExample) |
| CN (1) | CN101339899B (enExample) |
| TW (1) | TWI438864B (enExample) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8163628B2 (en) * | 2007-11-01 | 2012-04-24 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor substrate |
| WO2009084287A1 (ja) * | 2007-12-27 | 2009-07-09 | Sharp Kabushiki Kaisha | 半導体装置およびその製造方法 |
| US7951656B2 (en) * | 2008-06-06 | 2011-05-31 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP5580010B2 (ja) * | 2008-09-05 | 2014-08-27 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US20100081251A1 (en) * | 2008-09-29 | 2010-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing soi substrate |
| JP2010114431A (ja) * | 2008-10-10 | 2010-05-20 | Semiconductor Energy Lab Co Ltd | Ｓｏｉ基板の作製方法 |
| JP5420968B2 (ja) | 2009-05-07 | 2014-02-19 | 信越化学工業株式会社 | 貼り合わせウェーハの製造方法 |
| JP2011119233A (ja) * | 2009-11-04 | 2011-06-16 | Canon Inc | 有機ｅｌ素子とそれを用いた表示装置 |
| KR101708607B1 (ko) | 2009-11-20 | 2017-02-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101055473B1 (ko) * | 2009-12-15 | 2011-08-08 | 삼성전기주식회사 | 기판 제조용 캐리어 부재 및 이를 이용한 기판의 제조방법 |
| JP5571770B2 (ja) * | 2010-03-08 | 2014-08-13 | 株式会社日立国際電気 | 半導体装置の製造方法及び基板処理装置 |
| WO2011111507A1 (en) * | 2010-03-12 | 2011-09-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| CN105931967B (zh) | 2011-04-27 | 2019-05-03 | 株式会社半导体能源研究所 | 半导体装置的制造方法 |
| JP6005401B2 (ja) * | 2011-06-10 | 2016-10-12 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP5878330B2 (ja) * | 2011-10-18 | 2016-03-08 | 株式会社ディスコ | レーザー光線の出力設定方法およびレーザー加工装置 |
| KR20140091203A (ko) * | 2013-01-10 | 2014-07-21 | 삼성전자주식회사 | 반도체의 잔류 응력 제거장치 및 잔류 응력 제거방법 |
| KR101583007B1 (ko) * | 2013-12-18 | 2016-01-07 | 주식회사 디에이케이코리아 | 합성수지의 금속 패턴 형성 방법 |
| JP6294670B2 (ja) * | 2014-01-07 | 2018-03-14 | 株式会社ジャパンディスプレイ | 表示装置及び表示装置の製造方法 |
| CN111477657B (zh) * | 2014-10-28 | 2024-03-05 | 株式会社半导体能源研究所 | 功能面板、功能面板的制造方法、模块、数据处理装置 |
| JP6396852B2 (ja) * | 2015-06-02 | 2018-09-26 | 信越化学工業株式会社 | 酸化物単結晶薄膜を備えた複合ウェーハの製造方法 |
| JP6396854B2 (ja) * | 2015-06-02 | 2018-09-26 | 信越化学工業株式会社 | 酸化物単結晶薄膜を備えた複合ウェーハの製造方法 |
| JP6454606B2 (ja) * | 2015-06-02 | 2019-01-16 | 信越化学工業株式会社 | 酸化物単結晶薄膜を備えた複合ウェーハの製造方法 |
| CN105261586B (zh) * | 2015-08-25 | 2018-05-25 | 上海新傲科技股份有限公司 | 带有电荷陷阱和绝缘埋层衬底的制备方法 |
| CN107132616A (zh) * | 2017-05-22 | 2017-09-05 | 浙江大学 | 一种基于复合波导的横向电场通过的偏振器 |
| WO2019014753A1 (en) * | 2017-07-20 | 2019-01-24 | Quantum Silicon Inc. | PROCESSING A SILICON WAFER ON INSULATION IN PREPARATION FOR MANUFACTURING AN ATOMISTIC ELECTRONIC DEVICE INTERFACED WITH A CMOS ELECTRONIC DEVICE |
| CN110166913A (zh) * | 2018-02-14 | 2019-08-23 | 复旦大学附属眼耳鼻喉科医院 | 生物相容性传声器及其制备方法 |
| KR102049806B1 (ko) * | 2018-04-25 | 2020-01-22 | 한국과학기술연구원 | 특정 파장의 광원 및 반응성 가스를 이용하여 대상물의 표면을 평탄화하는 방법 및 장치 |
| CN109001179B (zh) * | 2018-08-07 | 2020-10-27 | 东南大学 | 尖端间距可调节的金属V型光栅Fano共振结构 |
| US11167375B2 (en) | 2018-08-10 | 2021-11-09 | The Research Foundation For The State University Of New York | Additive manufacturing processes and additively manufactured products |
| WO2020180940A1 (en) * | 2019-03-04 | 2020-09-10 | Board Of Regents, The University Of Texas System | Silicon-on-oxide-on-silicon |
| WO2020234853A1 (en) * | 2019-05-23 | 2020-11-26 | Vuereal Inc. | Method of integrating functional tuning materials with micro devices and structures thereof |
| CN110854117A (zh) * | 2019-11-26 | 2020-02-28 | 中国科学院微电子研究所 | 一种三维静态随机存取存储器及其制备方法 |
| CN111181518A (zh) * | 2019-12-28 | 2020-05-19 | 珠海市东恒电子有限公司 | 一种平衡非平衡射频转换元器件制程方法 |
| CN113540339B (zh) * | 2020-04-21 | 2024-07-12 | 济南晶正电子科技有限公司 | 一种制备压电复合薄膜的方法及压电复合薄膜 |
| CN111508891B (zh) * | 2020-04-28 | 2024-03-12 | 上海华力集成电路制造有限公司 | Soi晶圆片的制作方法 |
| CN113745391B (zh) * | 2021-08-26 | 2022-10-14 | 厦门天马微电子有限公司 | 一种显示面板和显示装置 |
| CN117066978B (zh) * | 2023-10-16 | 2024-01-05 | 天通控股股份有限公司 | 一种钽酸锂键合晶片的减薄方法 |
| KR20250083279A (ko) | 2023-11-30 | 2025-06-10 | 삼성디스플레이 주식회사 | 표시 장치의 제조 장치 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0254532A (ja) * | 1988-08-17 | 1990-02-23 | Sony Corp | Ｓｏｉ基板の製造方法 |
| US5567967A (en) * | 1993-06-28 | 1996-10-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having a crystallized island semiconductor layer |
| US5767799A (en) * | 1995-12-05 | 1998-06-16 | Mitsubishi Semiconductor America, Inc. | Low power high speed MPEG video variable length decoder |
| US6534380B1 (en) | 1997-07-18 | 2003-03-18 | Denso Corporation | Semiconductor substrate and method of manufacturing the same |
| JPH1197379A (ja) | 1997-07-25 | 1999-04-09 | Denso Corp | 半導体基板及び半導体基板の製造方法 |
| JPH11163363A (ja) | 1997-11-22 | 1999-06-18 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| JPH11233449A (ja) * | 1998-02-13 | 1999-08-27 | Denso Corp | 半導体基板の製造方法 |
| JP4476390B2 (ja) | 1998-09-04 | 2010-06-09 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP2000124092A (ja) | 1998-10-16 | 2000-04-28 | Shin Etsu Handotai Co Ltd | 水素イオン注入剥離法によってｓｏｉウエーハを製造する方法およびこの方法で製造されたｓｏｉウエーハ |
| JP4323724B2 (ja) * | 1999-03-05 | 2009-09-02 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
| JP4379943B2 (ja) | 1999-04-07 | 2009-12-09 | 株式会社デンソー | 半導体基板の製造方法および半導体基板製造装置 |
| FR2817395B1 (fr) | 2000-11-27 | 2003-10-31 | Soitec Silicon On Insulator | Procede de fabrication d'un substrat notamment pour l'optique, l'electronique ou l'optoelectronique et substrat obtenu par ce procede |
| US6767799B2 (en) | 2001-12-28 | 2004-07-27 | Semiconductor Energy Laboratory Co., Ltd. | Laser beam irradiation method |
| JP2004273698A (ja) * | 2003-03-07 | 2004-09-30 | Casio Comput Co Ltd | 半導体薄膜の製造方法 |
| FR2858461B1 (fr) * | 2003-07-30 | 2005-11-04 | Soitec Silicon On Insulator | Realisation d'une structure comprenant une couche protegeant contre des traitements chimiques |
| JP4759919B2 (ja) | 2004-01-16 | 2011-08-31 | セイコーエプソン株式会社 | 電気光学装置の製造方法 |
| JP5110772B2 (ja) | 2004-02-03 | 2012-12-26 | 株式会社半導体エネルギー研究所 | 半導体薄膜層を有する基板の製造方法 |
| JP5084169B2 (ja) * | 2005-04-28 | 2012-11-28 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| CN101281912B (zh) | 2007-04-03 | 2013-01-23 | 株式会社半导体能源研究所 | Soi衬底及其制造方法以及半导体装置 |
| EP2009687B1 (en) | 2007-06-29 | 2016-08-17 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing an SOI substrate and method of manufacturing a semiconductor device |
| US20090004764A1 (en) | 2007-06-29 | 2009-01-01 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing SOI substrate and method for manufacturing semiconductor device |
-
2008
- 2008-06-17 US US12/213,271 patent/US7678668B2/en not_active Expired - Fee Related
- 2008-06-30 TW TW097124555A patent/TWI438864B/zh not_active IP Right Cessation
- 2008-07-03 CN CN2008101379109A patent/CN101339899B/zh not_active Expired - Fee Related
- 2008-07-03 KR KR20080064209A patent/KR101481974B1/ko not_active Expired - Fee Related
- 2008-07-03 JP JP2008174221A patent/JP2009033151A/ja not_active Withdrawn
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