JP2009016552A - 導電性ボール載置装置、導電性ボールの載置方法、導電性ボール載置用マスク、及びその製造方法 - Google Patents
導電性ボール載置装置、導電性ボールの載置方法、導電性ボール載置用マスク、及びその製造方法 Download PDFInfo
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Abstract
【解決手段】粘着材115が形成された複数のパッド112を有する基板101上に対向配置されると共に、複数のパッド112上の夫々に導電性ボール105を載置するための複数のボール載置用貫通穴128を有した導電性ボール載置用マスク103と、導電性ボール載置用マスク103の上面103A側を吸引しながら移動することにより、複数のパッド112上の夫々に導電性ボール105を載置する導電性ボール供給手段104と、を備え、導電性ボール載置用マスク103に導電性ボール105が通過することを阻止するように形成された貫通部129を設けた。
【選択図】図3
Description
図3は、本発明の実施の形態に係る導電性ボール載置装置の断面図である。図3では、本実施の形態の導電性ボール載置装置100により、基板101に設けられた複数のパッド112上に導電性ボール105を載置している様子を模式的に示す。
101,108 基板
102 ステージ
102A,103A 上面
103,150 導電性ボール載置用マスク
104 導電性ボール供給手段
105 導電性ボール
107 基板本体
111 貫通電極
112,116 パッド
113,117 ソルダーレジスト
115 粘着材
107A,107B 面
119,121,139 開口部
125,151 板体
126 支持部
128 ボール載置用貫通穴
129,152 貫通部
131 吸引ヘッド
132 吸引装置
133 駆動装置
135 筒部
136 板部
137 吸引口
139 開口部
141 シリコン基板
142,161 レジスト膜
144 第1の開口部
145 第2の開口部
A 基板形成領域
B 切断位置
C パッド形成領域
Claims (10)
- 粘着材が形成された複数のパッドを有する基板上に対向配置されると共に、前記複数のパッドに対向する配列で形成され、前記複数のパッドの夫々に1つの導電性ボールを載置するための複数のボール載置用貫通穴を有した導電性ボール載置用マスクと、
前記導電性ボール載置用マスクの上面側を吸引することにより、前記導電性ボール載置用マスク上の複数の前記導電性ボールを移動又は除去する導電性ボール供給手段と、を備えた導電性ボール載置装置であって、
前記導電性ボール載置用マスクに、前記導電性ボールが通過することを阻止するように形成された貫通部を設けたことを特徴とする導電性ボール載置装置。 - 前記貫通部は、前記導電性ボール供給手段による吸引に伴って、前記導電性ボール載置用マスクの上方と下方との間の空気の流通を行うことを特徴とする請求項1記載の導電性ボール載置装置。
- 前記貫通部は、少なくとも前記複数のボール載置用貫通穴の近傍に位置する部分の前記導電性ボール載置用マスクに配設されることを特徴とする請求項1又は2記載の導電性ボール載置装置。
- 前記導電性ボール載置用マスクは、薄板形状とされ、前記複数のボール載置用貫通穴及び前記貫通部が形成される板体と、前記基板と接触することにより、前記板体を支持する支持部とを有することを特徴とする請求項1ないし3のうち、いずれか一項記載の導電性ボール載置装置。
- 前記導電性ボール載置用マスクの材料は、シリコンであることを特徴とする請求項1ないし4のうち、いずれか一項記載の導電性ボール載置装置。
- 基板上に設けられると共に、粘着材が形成された複数のパッドの夫々に1つの導電性ボールを載置する導電性ボールの載置方法であって、
前記複数のパッドの夫々に1つの前記導電性ボールを載置するための複数のボール載置用貫通穴と、前記導電性ボールが通過することを阻止するように形成された貫通部とを備えた導電性ボール載置用マスクを前記基板の上方に対向配置する導電性ボール載置用マスク配置工程と、
前記導電性ボール載置用マスク上に複数の前記導電性ボールを供給する導電性ボール供給工程と、
前記導電性ボール供給工程後に、前記導電性ボール載置用マスクの上面側を吸引することにより、前記導電性ボール載置用マスク上の複数の前記導電性ボールを移動又は除去する導電性ボール移動工程と、を含むことを特徴とする導電性ボールの載置方法。 - 前記貫通部は、少なくとも前記複数のボール載置用貫通穴の近傍に位置する部分の前記導電性ボール載置用マスクに形成することを特徴とする請求項6記載の導電性ボールの載置方法。
- 粘着材が形成された複数のパッドを有する基板上に対向配置されると共に、前記複数のパッドに対向する配列で形成され、前記複数のパッド上の夫々に1つの導電性ボールを載置するための複数のボール載置用貫通穴を有した導電性ボール載置用マスクであって、
前記導電性ボール載置用マスクに、前記導電性ボール載置用マスクの上方と下方との間の空気の流通を行うと共に、前記導電性ボールの通過を阻止する貫通部を設けたことを特徴とする導電性ボール載置用マスク。 - 前記貫通部は、少なくとも前記複数のボール載置用貫通穴の近傍に位置する部分の前記導電性ボール載置用マスクに配設されることを特徴とする請求項8記載の導電性ボール載置用マスク。
- 請求項8又は9記載の導電性ボール載置用マスクの製造方法であって、
薄板化されたシリコン基板を準備するシリコン基板準備工程と、
前記シリコン基板上に、前記ボール載置用貫通穴の形成領域に対応する部分の前記シリコン基板を露出する第1の開口部と、前記貫通部の形成領域に対応する部分の前記シリコン基板を露出する第2の開口部とを有したレジスト膜を形成するレジスト膜形成工程と、
前記レジスト膜をマスクとする異方性エッチングにより、前記複数のボール載置用貫通穴と前記貫通部とを同時に形成するボール載置用貫通穴及び貫通部形成工程と、
前記ボール載置用貫通穴及び前記貫通部を形成後に、前記レジスト膜を除去するレジスト膜除去工程と、を含み、
前記貫通部を、前記導電性ボールの通過を阻止するような形状に形成することを特徴とする導電性ボール載置用マスクの製造方法。
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JP2007176328A JP4430693B2 (ja) | 2007-07-04 | 2007-07-04 | 導電性ボール載置装置、導電性ボールの載置方法、導電性ボール載置用マスク、及びその製造方法 |
US12/166,673 US7866534B2 (en) | 2007-07-04 | 2008-07-02 | Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method |
EP08159779A EP2019575A3 (en) | 2007-07-04 | 2008-07-04 | Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method |
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JP2007176328A JP4430693B2 (ja) | 2007-07-04 | 2007-07-04 | 導電性ボール載置装置、導電性ボールの載置方法、導電性ボール載置用マスク、及びその製造方法 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011114303A (ja) * | 2009-11-30 | 2011-06-09 | Shibuya Kogyo Co Ltd | 導電性ボールの搭載装置 |
JP2011129806A (ja) * | 2009-12-21 | 2011-06-30 | Athlete Fa Kk | ボール誘導装置、ボール誘導方法およびボール搭載装置 |
JP2015153851A (ja) * | 2014-02-13 | 2015-08-24 | イビデン株式会社 | ボール搭載用マスクおよびボール搭載装置 |
JP2016018852A (ja) * | 2014-07-07 | 2016-02-01 | 日立マクセル株式会社 | 配列用マスク |
CN111162024A (zh) * | 2018-11-07 | 2020-05-15 | 普罗科技有限公司 | 用于安装导电球的设备 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102100867B1 (ko) * | 2013-06-26 | 2020-04-14 | 삼성전자주식회사 | 솔더 볼 탑재 장치 |
US9120170B2 (en) * | 2013-11-01 | 2015-09-01 | Zen Voce Corporation | Apparatus and method for placing and mounting solder balls on an integrated circuit substrate |
KR102472710B1 (ko) * | 2018-06-05 | 2022-11-30 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 패키지 |
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JP2011114303A (ja) * | 2009-11-30 | 2011-06-09 | Shibuya Kogyo Co Ltd | 導電性ボールの搭載装置 |
JP2011129806A (ja) * | 2009-12-21 | 2011-06-30 | Athlete Fa Kk | ボール誘導装置、ボール誘導方法およびボール搭載装置 |
JP2015153851A (ja) * | 2014-02-13 | 2015-08-24 | イビデン株式会社 | ボール搭載用マスクおよびボール搭載装置 |
JP2016018852A (ja) * | 2014-07-07 | 2016-02-01 | 日立マクセル株式会社 | 配列用マスク |
CN111162024A (zh) * | 2018-11-07 | 2020-05-15 | 普罗科技有限公司 | 用于安装导电球的设备 |
CN111162024B (zh) * | 2018-11-07 | 2023-02-17 | 普罗科技有限公司 | 用于安装导电球的设备 |
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JP4430693B2 (ja) | 2010-03-10 |
EP2019575A2 (en) | 2009-01-28 |
US7866534B2 (en) | 2011-01-11 |
US20090008433A1 (en) | 2009-01-08 |
EP2019575A3 (en) | 2010-06-02 |
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