JP2008525800A - 3軸磁気センサのための単一パッケージの設計 - Google Patents
3軸磁気センサのための単一パッケージの設計 Download PDFInfo
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- JP2008525800A JP2008525800A JP2007548309A JP2007548309A JP2008525800A JP 2008525800 A JP2008525800 A JP 2008525800A JP 2007548309 A JP2007548309 A JP 2007548309A JP 2007548309 A JP2007548309 A JP 2007548309A JP 2008525800 A JP2008525800 A JP 2008525800A
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- 239000000758 substrate Substances 0.000 claims abstract description 63
- 229910000679 solder Inorganic materials 0.000 claims abstract description 22
- 238000005538 encapsulation Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 description 18
- 238000010586 diagram Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/04—Measuring direction or magnitude of magnetic fields or magnetic flux using the flux-gate principle
- G01R33/05—Measuring direction or magnitude of magnetic fields or magnetic flux using the flux-gate principle in thin-film element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/025—Compensating stray fields
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C17/00—Compasses; Devices for ascertaining true or magnetic north for navigation or surveying purposes
- G01C17/02—Magnetic compasses
- G01C17/28—Electromagnetic compasses
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/0206—Three-component magnetometers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Magnetic Variables (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims (9)
- 堅固な基板であって、前記堅固な基板は上面を有し、前記上面はチャンネルを含む堅固な基板と、
X軸に沿った磁場を感知するための前記堅固な基板の前記上面上に位置するX軸センサであって、入力/出力パッドを含むX軸センサと、
Y軸に沿った磁場を感知するための前記堅固な基板の前記上面上に位置するY軸センサであって、入力/出力パッドを含むY軸センサと、
Z軸に沿った磁場を感知するための前記堅固な基板の前記上面内の前記チャンネル内に位置するZ軸センサであって、入力/出力パッドを含むZ軸センサと、
各センサ上の個々の入力/出力パッドに導電的に接続するための前記堅固な基板の前記上面上に位置する対応する入力/出力パッドと、を含むセンサパッケージ。 - 前記パッケージの周囲に封入層を更に含み、前記封入層を含む前記パッケージの高さは1.2mm未満である請求項1に記載のセンサパッケージ。
- 前記Z軸センサ上の前記入力/出力パッドは、前記センサの1つの辺縁部に沿って垂直なアレイに配列され、且つ、前記堅固な基板上の前記対応する入力/出力パッドと導電的に接続している請求項1に記載のセンサパッケージ。
- 前記Z軸センサ上の前記入力/出力パッドは、ハンダバンプにより前記堅固な基板に導電的に接続されている請求項3に記載のセンサパッケージ。
- 前記堅固な基板上の前記入力/出力パッドは、前記チャンネルの最上部辺縁部に位置するハンダ充填導通孔を含む請求項4に記載のセンサパッケージ。
- 前記チャンネルは幅を有し、且つ、前記幅は前記Z軸センサの厚さに相当する請求項1に記載のセンサパッケージ。
- 前記堅固な基板上の前記入力/出力パッドは、リードレスチップキャリヤ設計において外周上に配列されている請求項1に記載のセンサパッケージ。
- 前記堅固な基板上の前記入力/出力パッドは、ボールグリッドアレイ設計において前記基板の前記上面の中央にグリッド状に配列されている請求項1に記載のセンサパッケージ。
- 前記堅固な基板は印刷回路板である請求項1に記載のセンサパッケージ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/022,495 US7271586B2 (en) | 2003-12-04 | 2004-12-22 | Single package design for 3-axis magnetic sensor |
US11/022,495 | 2004-12-22 | ||
PCT/US2005/045372 WO2006068909A1 (en) | 2004-12-22 | 2005-12-15 | Single package design for 3-axis magnetic sensor |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008525800A true JP2008525800A (ja) | 2008-07-17 |
JP2008525800A5 JP2008525800A5 (ja) | 2008-09-04 |
JP4750131B2 JP4750131B2 (ja) | 2011-08-17 |
Family
ID=36096213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007548309A Active JP4750131B2 (ja) | 2004-12-22 | 2005-12-15 | 3軸磁気センサのための単一パッケージの設計 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7271586B2 (ja) |
EP (1) | EP1839064B1 (ja) |
JP (1) | JP4750131B2 (ja) |
KR (1) | KR101167490B1 (ja) |
CN (1) | CN101120263B (ja) |
WO (1) | WO2006068909A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011039040A (ja) * | 2009-07-14 | 2011-02-24 | Honeywell Internatl Inc | 垂直にセンサ組み立てる方法 |
JP2015053465A (ja) * | 2013-08-05 | 2015-03-19 | ローム株式会社 | 半導体装置 |
JP2021005630A (ja) * | 2019-06-26 | 2021-01-14 | Tdk株式会社 | 複合センサーモジュール用基板及びこれを備える複合センサーモジュール |
Families Citing this family (30)
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TWI361503B (en) * | 2005-03-17 | 2012-04-01 | Yamaha Corp | Three-axis magnetic sensor and manufacturing method therefor |
JP4904052B2 (ja) * | 2005-12-27 | 2012-03-28 | アルプス電気株式会社 | 磁気方位検出装置 |
JP4495240B2 (ja) * | 2007-02-14 | 2010-06-30 | アルプス電気株式会社 | 検出装置および検出装置の製造方法 |
US20090072823A1 (en) * | 2007-09-17 | 2009-03-19 | Honeywell International Inc. | 3d integrated compass package |
US7564237B2 (en) | 2007-10-23 | 2009-07-21 | Honeywell International Inc. | Integrated 3-axis field sensor and fabrication methods |
US7790502B2 (en) * | 2007-12-10 | 2010-09-07 | Honeywell International Inc. | Method of manufacturing flexible semiconductor assemblies |
KR100950676B1 (ko) * | 2008-01-07 | 2010-03-31 | 에스티에스반도체통신 주식회사 | 3축 지자기 센서 및 그 제조 방법 |
JP5154275B2 (ja) * | 2008-03-24 | 2013-02-27 | アルプス電気株式会社 | 磁気センサパッケージ |
US7994773B2 (en) | 2008-07-11 | 2011-08-09 | Data Security, Inc. | Apparatus and method for in-field magnetic measurements |
CN102132168B (zh) * | 2008-09-29 | 2013-07-24 | 欧姆龙株式会社 | 磁场检测元件及信号传递元件 |
KR101107747B1 (ko) * | 2009-07-30 | 2012-01-20 | (주)파트론 | 플립 본딩 방식으로 실장된 플럭스게이트 소자를 갖는 전자 나침반 패키지 및 이의 제조 방법 |
KR101090990B1 (ko) * | 2009-10-27 | 2011-12-13 | 주식회사 아모센스 | 지자기 센서 및 그의 제조방법 |
US20110147867A1 (en) * | 2009-12-23 | 2011-06-23 | Everspin Technologies, Inc. | Method of vertically mounting an integrated circuit |
US20110234218A1 (en) * | 2010-03-24 | 2011-09-29 | Matthieu Lagouge | Integrated multi-axis hybrid magnetic field sensor |
US20120105058A1 (en) * | 2010-10-29 | 2012-05-03 | Iakov Veniaminovitch Kopelevitch | Magnetic field sensing |
DE102011001422A1 (de) * | 2011-03-21 | 2012-09-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Sensormodul und Verfahren zum Herstellen eines Sensormoduls |
US8316552B1 (en) | 2011-05-05 | 2012-11-27 | Honeywell International Inc. | Systems and methods for three-axis sensor chip packages |
CN102214589B (zh) * | 2011-05-31 | 2013-04-24 | 华亚平 | 垂直芯片电子封装方法 |
US8459112B2 (en) | 2011-06-09 | 2013-06-11 | Honeywell International Inc. | Systems and methods for three dimensional sensors |
US9360345B2 (en) | 2011-10-10 | 2016-06-07 | Honeywell International Inc. | Extended smart position sensing range using electromagnetics |
US8618795B1 (en) * | 2012-06-29 | 2013-12-31 | General Electric Company | Sensor assembly for use in medical position and orientation tracking |
US20140005527A1 (en) * | 2012-06-29 | 2014-01-02 | General Electric Company | Method and system for dynamic referencing and registration used with surgical and interventional procedures |
CN104755948B (zh) | 2012-10-12 | 2018-04-10 | 美新公司 | 单晶三轴磁场传感器 |
ITTO20121067A1 (it) | 2012-12-12 | 2014-06-13 | St Microelectronics Srl | Sensore magnetoresistivo integrato in una piastrina per il rilevamento di campi magnetici perpendicolari alla piastrina nonche' suo procedimento di fabbricazione |
CN104375098B (zh) * | 2013-08-15 | 2018-11-02 | 上海矽睿科技有限公司 | 磁传感装置及该装置的制备工艺 |
US10288697B2 (en) | 2015-01-13 | 2019-05-14 | Stmicroelectronics S.R.L. | AMR-type integrated magnetoresistive sensor for detecting magnetic fields perpendicular to the chip |
CN105607015A (zh) * | 2016-01-19 | 2016-05-25 | 三峡大学 | 一种三维空间磁场测量系统 |
CN106405453A (zh) * | 2016-11-15 | 2017-02-15 | 上海交通大学 | 一种三轴磁通门传感器 |
JP6932561B2 (ja) | 2017-06-15 | 2021-09-08 | キヤノン電子株式会社 | 3軸磁気検出装置および人工衛星 |
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-
2004
- 2004-12-22 US US11/022,495 patent/US7271586B2/en active Active
-
2005
- 2005-12-15 WO PCT/US2005/045372 patent/WO2006068909A1/en active Application Filing
- 2005-12-15 JP JP2007548309A patent/JP4750131B2/ja active Active
- 2005-12-15 KR KR1020077015981A patent/KR101167490B1/ko active IP Right Grant
- 2005-12-15 CN CN2005800481462A patent/CN101120263B/zh active Active
- 2005-12-15 EP EP05854146A patent/EP1839064B1/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011039040A (ja) * | 2009-07-14 | 2011-02-24 | Honeywell Internatl Inc | 垂直にセンサ組み立てる方法 |
JP2015053465A (ja) * | 2013-08-05 | 2015-03-19 | ローム株式会社 | 半導体装置 |
JP2021005630A (ja) * | 2019-06-26 | 2021-01-14 | Tdk株式会社 | 複合センサーモジュール用基板及びこれを備える複合センサーモジュール |
JP7302330B2 (ja) | 2019-06-26 | 2023-07-04 | Tdk株式会社 | 複合センサーモジュール |
Also Published As
Publication number | Publication date |
---|---|
US7271586B2 (en) | 2007-09-18 |
KR20070093422A (ko) | 2007-09-18 |
EP1839064B1 (en) | 2011-09-21 |
CN101120263B (zh) | 2012-06-13 |
JP4750131B2 (ja) | 2011-08-17 |
US20050122101A1 (en) | 2005-06-09 |
WO2006068909A1 (en) | 2006-06-29 |
KR101167490B1 (ko) | 2012-07-19 |
CN101120263A (zh) | 2008-02-06 |
EP1839064A1 (en) | 2007-10-03 |
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