JP2008519437A5 - - Google Patents

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Publication number
JP2008519437A5
JP2008519437A5 JP2007539213A JP2007539213A JP2008519437A5 JP 2008519437 A5 JP2008519437 A5 JP 2008519437A5 JP 2007539213 A JP2007539213 A JP 2007539213A JP 2007539213 A JP2007539213 A JP 2007539213A JP 2008519437 A5 JP2008519437 A5 JP 2008519437A5
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JP
Japan
Prior art keywords
substrate
group
metal
layer
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007539213A
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English (en)
Japanese (ja)
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JP2008519437A (ja
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Publication date
Priority claimed from US10/978,940 external-priority patent/US7416789B2/en
Application filed filed Critical
Publication of JP2008519437A publication Critical patent/JP2008519437A/ja
Publication of JP2008519437A5 publication Critical patent/JP2008519437A5/ja
Pending legal-status Critical Current

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JP2007539213A 2004-11-01 2005-10-27 改良された熱伝導性を有する耐熱金属基板 Pending JP2008519437A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/978,940 US7416789B2 (en) 2004-11-01 2004-11-01 Refractory metal substrate with improved thermal conductivity
PCT/US2005/039150 WO2006050205A2 (en) 2004-11-01 2005-10-27 Refractory metal substrate with improved thermal conductivity

Publications (2)

Publication Number Publication Date
JP2008519437A JP2008519437A (ja) 2008-06-05
JP2008519437A5 true JP2008519437A5 (enExample) 2008-12-04

Family

ID=36010454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007539213A Pending JP2008519437A (ja) 2004-11-01 2005-10-27 改良された熱伝導性を有する耐熱金属基板

Country Status (8)

Country Link
US (2) US7416789B2 (enExample)
EP (1) EP1810330A2 (enExample)
JP (1) JP2008519437A (enExample)
KR (1) KR20070085553A (enExample)
CN (1) CN101160658A (enExample)
AU (1) AU2005302402A1 (enExample)
MY (1) MY139827A (enExample)
WO (1) WO2006050205A2 (enExample)

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US20110129189A1 (en) * 2009-11-30 2011-06-02 Venkata Adiseshaiah Bhagavatula Clad metal substrates in optical packages
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JP6008117B2 (ja) * 2012-02-15 2016-10-19 パナソニックＩｐマネジメント株式会社 グラファイト構造体およびそれを用いた電子デバイス
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JP6227803B2 (ja) 2014-12-09 2017-11-08 インテル・コーポレーション 銅合金導電性経路構造体を備えるマイクロ電子基板
US20160192488A1 (en) * 2014-12-30 2016-06-30 Samsung Electro-Mechanics Co., Ltd. Circuit board, multilayered substrate having the circuit board and method of manufacturing the circuit board
CN104538836B (zh) * 2014-12-31 2018-02-02 西安炬光科技股份有限公司 一种用于高功率半导体激光器的液体制冷片
WO2017221105A1 (en) 2016-06-23 2017-12-28 Manoj Harilal Akkad Method for enhancing resistance to delamination of a coating layer applied to a rigid, monolithic substrate
JP6304670B1 (ja) * 2017-04-14 2018-04-04 株式会社半導体熱研究所 放熱基板、放熱基板電極、半導体パッケージ、及び半導体モジュール
EP3471138B1 (en) * 2017-10-12 2021-06-16 The Goodsystem Corp. Heat sink plate
JP6544727B2 (ja) * 2017-11-20 2019-07-17 株式会社半導体熱研究所 放熱基板、放熱基板電極、半導体パッケージ、及び半導体モジュール、並びに放熱基板の製造方法
CN110181898A (zh) * 2018-02-23 2019-08-30 福特环球技术公司 竹纤维复合板及其制造方法
EP3905315A4 (en) 2019-03-07 2022-10-19 Absolics Inc. PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE EQUIPPED WITH THE SAME
JP7433318B2 (ja) 2019-03-07 2024-02-19 アブソリックス インコーポレイテッド パッケージング基板及びこれを含む半導体装置
ES3033139T3 (en) 2019-03-12 2025-07-31 Absolics Inc Packaging substrate and semiconductor device comprising same
CN113272951B (zh) 2019-03-12 2024-04-16 爱玻索立克公司 封装基板及包括其的半导体装置
KR102622608B1 (ko) 2019-03-12 2024-01-08 앱솔릭스 인코포레이티드 패키징 기판 및 이의 제조방법
CN113424304B (zh) 2019-03-12 2024-04-12 爱玻索立克公司 装载盒及对象基板的装载方法
EP3910667B1 (en) * 2019-03-29 2025-08-13 Absolics Inc. Packaging glass substrate for semiconductor, packaging substrate for semiconductor, and semiconductor device
KR20220089715A (ko) 2019-08-23 2022-06-28 앱솔릭스 인코포레이티드 패키징 기판 및 이를 포함하는 반도체 장치
JP2021106202A (ja) * 2019-12-26 2021-07-26 住友電気工業株式会社 板材、放熱材及び板材の製造方法
CN111009496B (zh) * 2019-12-31 2021-07-06 长春理工大学 一种具有高热导率的半导体衬底及其制备方法
CN111261594A (zh) * 2020-03-12 2020-06-09 哈尔滨铸鼎工大新材料科技有限公司 一种带有导热通道的铜钼铜载体基板及其制造方法
US11774190B2 (en) * 2020-04-14 2023-10-03 International Business Machines Corporation Pierced thermal interface constructions
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CN112941430B (zh) * 2021-02-01 2022-03-04 吉林大学 一种金刚石复合散热材料的粉末冶金制备方法
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WO2023168114A1 (en) * 2022-03-04 2023-09-07 The Regents Of The University Of California Bioinspired coatings, materials, and structures for thermal management

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