MY139827A - Refractory metal substrate with improved thermal conductivity - Google Patents

Refractory metal substrate with improved thermal conductivity

Info

Publication number
MY139827A
MY139827A MYPI20055110A MYPI20055110A MY139827A MY 139827 A MY139827 A MY 139827A MY PI20055110 A MYPI20055110 A MY PI20055110A MY PI20055110 A MYPI20055110 A MY PI20055110A MY 139827 A MY139827 A MY 139827A
Authority
MY
Malaysia
Prior art keywords
major surface
metal
substrate
group
periodic table
Prior art date
Application number
MYPI20055110A
Other languages
English (en)
Inventor
Henry F Breit
Rong-Chein Richard Wu
Prabhat Kumar
Original Assignee
H C Starck In
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by H C Starck In filed Critical H C Starck In
Publication of MY139827A publication Critical patent/MY139827A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12361—All metal or with adjacent metals having aperture or cut
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
MYPI20055110A 2004-11-01 2005-10-28 Refractory metal substrate with improved thermal conductivity MY139827A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/978,940 US7416789B2 (en) 2004-11-01 2004-11-01 Refractory metal substrate with improved thermal conductivity

Publications (1)

Publication Number Publication Date
MY139827A true MY139827A (en) 2009-10-30

Family

ID=36010454

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20055110A MY139827A (en) 2004-11-01 2005-10-28 Refractory metal substrate with improved thermal conductivity

Country Status (8)

Country Link
US (2) US7416789B2 (enExample)
EP (1) EP1810330A2 (enExample)
JP (1) JP2008519437A (enExample)
KR (1) KR20070085553A (enExample)
CN (1) CN101160658A (enExample)
AU (1) AU2005302402A1 (enExample)
MY (1) MY139827A (enExample)
WO (1) WO2006050205A2 (enExample)

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CN102051498A (zh) * 2009-11-04 2011-05-11 江苏鼎启科技有限公司 钨铜、钼铜合金热沉材料及制备方法
US20110129189A1 (en) * 2009-11-30 2011-06-02 Venkata Adiseshaiah Bhagavatula Clad metal substrates in optical packages
US8563160B2 (en) * 2010-01-29 2013-10-22 GM Global Technology Operations LLC Interconnect member for a battery module
JP6008117B2 (ja) * 2012-02-15 2016-10-19 パナソニックＩｐマネジメント株式会社 グラファイト構造体およびそれを用いた電子デバイス
JP5938577B2 (ja) * 2012-04-19 2016-06-22 パナソニックＩｐマネジメント株式会社 熱伝導シートおよびその製造方法およびこれを用いた熱伝導体
CN103981382A (zh) * 2014-05-22 2014-08-13 武汉理工大学 一种高导热金刚石/铜基复合材料的制备方法
JP6227803B2 (ja) 2014-12-09 2017-11-08 インテル・コーポレーション 銅合金導電性経路構造体を備えるマイクロ電子基板
US20160192488A1 (en) * 2014-12-30 2016-06-30 Samsung Electro-Mechanics Co., Ltd. Circuit board, multilayered substrate having the circuit board and method of manufacturing the circuit board
CN104538836B (zh) * 2014-12-31 2018-02-02 西安炬光科技股份有限公司 一种用于高功率半导体激光器的液体制冷片
WO2017221105A1 (en) 2016-06-23 2017-12-28 Manoj Harilal Akkad Method for enhancing resistance to delamination of a coating layer applied to a rigid, monolithic substrate
JP6304670B1 (ja) * 2017-04-14 2018-04-04 株式会社半導体熱研究所 放熱基板、放熱基板電極、半導体パッケージ、及び半導体モジュール
EP3471138B1 (en) * 2017-10-12 2021-06-16 The Goodsystem Corp. Heat sink plate
JP6544727B2 (ja) * 2017-11-20 2019-07-17 株式会社半導体熱研究所 放熱基板、放熱基板電極、半導体パッケージ、及び半導体モジュール、並びに放熱基板の製造方法
CN110181898A (zh) * 2018-02-23 2019-08-30 福特环球技术公司 竹纤维复合板及其制造方法
EP3905315A4 (en) 2019-03-07 2022-10-19 Absolics Inc. PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE EQUIPPED WITH THE SAME
JP7433318B2 (ja) 2019-03-07 2024-02-19 アブソリックス インコーポレイテッド パッケージング基板及びこれを含む半導体装置
ES3033139T3 (en) 2019-03-12 2025-07-31 Absolics Inc Packaging substrate and semiconductor device comprising same
CN113272951B (zh) 2019-03-12 2024-04-16 爱玻索立克公司 封装基板及包括其的半导体装置
KR102622608B1 (ko) 2019-03-12 2024-01-08 앱솔릭스 인코포레이티드 패키징 기판 및 이의 제조방법
CN113424304B (zh) 2019-03-12 2024-04-12 爱玻索立克公司 装载盒及对象基板的装载方法
EP3910667B1 (en) * 2019-03-29 2025-08-13 Absolics Inc. Packaging glass substrate for semiconductor, packaging substrate for semiconductor, and semiconductor device
KR20220089715A (ko) 2019-08-23 2022-06-28 앱솔릭스 인코포레이티드 패키징 기판 및 이를 포함하는 반도체 장치
JP2021106202A (ja) * 2019-12-26 2021-07-26 住友電気工業株式会社 板材、放熱材及び板材の製造方法
CN111009496B (zh) * 2019-12-31 2021-07-06 长春理工大学 一种具有高热导率的半导体衬底及其制备方法
CN111261594A (zh) * 2020-03-12 2020-06-09 哈尔滨铸鼎工大新材料科技有限公司 一种带有导热通道的铜钼铜载体基板及其制造方法
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Also Published As

Publication number Publication date
US20060091552A1 (en) 2006-05-04
US20080102304A1 (en) 2008-05-01
WO2006050205A2 (en) 2006-05-11
US7416789B2 (en) 2008-08-26
CN101160658A (zh) 2008-04-09
EP1810330A2 (en) 2007-07-25
KR20070085553A (ko) 2007-08-27
JP2008519437A (ja) 2008-06-05
AU2005302402A1 (en) 2006-05-11
WO2006050205A3 (en) 2006-09-08

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