JP2005276962A5 - - Google Patents
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- Publication number
- JP2005276962A5 JP2005276962A5 JP2004085969A JP2004085969A JP2005276962A5 JP 2005276962 A5 JP2005276962 A5 JP 2005276962A5 JP 2004085969 A JP2004085969 A JP 2004085969A JP 2004085969 A JP2004085969 A JP 2004085969A JP 2005276962 A5 JP2005276962 A5 JP 2005276962A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor device
- alloy containing
- insulating film
- containing copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 10
- 229910052802 copper Inorganic materials 0.000 claims 10
- 239000010949 copper Substances 0.000 claims 10
- 239000004065 semiconductor Substances 0.000 claims 10
- 239000000758 substrate Substances 0.000 claims 10
- 239000000956 alloy Substances 0.000 claims 9
- 229910045601 alloy Inorganic materials 0.000 claims 9
- 239000000463 material Substances 0.000 claims 7
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 6
- 239000002131 composite material Substances 0.000 claims 6
- 229910052750 molybdenum Inorganic materials 0.000 claims 6
- 239000011733 molybdenum Substances 0.000 claims 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 6
- 229910052721 tungsten Inorganic materials 0.000 claims 6
- 239000010937 tungsten Substances 0.000 claims 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 4
- 229910052782 aluminium Inorganic materials 0.000 claims 4
- 229910052710 silicon Inorganic materials 0.000 claims 4
- 239000010703 silicon Substances 0.000 claims 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 229910052799 carbon Inorganic materials 0.000 claims 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims 2
- 230000003746 surface roughness Effects 0.000 claims 2
- 230000007547 defect Effects 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004085969A JP4382547B2 (ja) | 2004-03-24 | 2004-03-24 | 半導体装置用基板と半導体装置 |
| PCT/JP2005/003846 WO2005091360A1 (ja) | 2004-03-24 | 2005-03-07 | 半導体装置用基板と半導体装置 |
| EP05720118A EP1732128A4 (en) | 2004-03-24 | 2005-03-07 | SUBSTRATE FOR A SEMICONDUCTOR COMPONENT AND SEMICONDUCTOR COMPONENT |
| US10/593,819 US7470982B2 (en) | 2004-03-24 | 2005-03-07 | Substrate for semiconductor device and semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004085969A JP4382547B2 (ja) | 2004-03-24 | 2004-03-24 | 半導体装置用基板と半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005276962A JP2005276962A (ja) | 2005-10-06 |
| JP2005276962A5 true JP2005276962A5 (enExample) | 2007-01-11 |
| JP4382547B2 JP4382547B2 (ja) | 2009-12-16 |
Family
ID=34993971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004085969A Expired - Fee Related JP4382547B2 (ja) | 2004-03-24 | 2004-03-24 | 半導体装置用基板と半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7470982B2 (enExample) |
| EP (1) | EP1732128A4 (enExample) |
| JP (1) | JP4382547B2 (enExample) |
| WO (1) | WO2005091360A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1858078A4 (en) * | 2005-01-20 | 2009-03-04 | Almt Corp | ELEMENT FOR A SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR |
| WO2007141851A1 (ja) * | 2006-06-07 | 2007-12-13 | Fujitsu Limited | 半導体パッケージ及び電子装置 |
| JP4768024B2 (ja) * | 2006-07-28 | 2011-09-07 | 京セラ株式会社 | 電子部品収納用パッケージおよび電子装置 |
| EP2098362A4 (en) | 2006-12-27 | 2012-07-18 | Hitachi Chemical Co Ltd | ENGRAVED PLATE AND BASE MATERIAL WITH CONCRETE STRUCTURE AND ENGRAVED PLATE |
| WO2008142700A2 (en) * | 2007-05-24 | 2008-11-27 | Micro Components Ltd. | Interconnect substrates, methods and systems thereof |
| JP4558012B2 (ja) * | 2007-07-05 | 2010-10-06 | 株式会社東芝 | 半導体パッケージ用放熱プレート及び半導体装置 |
| WO2010013383A1 (ja) * | 2008-07-30 | 2010-02-04 | 株式会社アライドマテリアル | ヒートスプレッダおよびその製造方法 |
| JP2010056194A (ja) * | 2008-08-27 | 2010-03-11 | Oki Data Corp | 半導体装置及び光プリントヘッド |
| TWI433615B (zh) * | 2012-04-12 | 2014-04-01 | 旭德科技股份有限公司 | 散熱基板及其製作方法 |
| US9575523B2 (en) * | 2015-01-22 | 2017-02-21 | Microsoft Technology Licensing, Llc | Device sandwich structured composite housing |
| JP7589487B2 (ja) * | 2020-10-12 | 2024-11-26 | 株式会社レゾナック | 金属回路基板および半導体冷却装置 |
| WO2024203738A1 (ja) * | 2023-03-30 | 2024-10-03 | 日本特殊陶業株式会社 | 半導体素子搭載用基板 |
| CN116618660A (zh) * | 2023-05-06 | 2023-08-22 | 宁波江丰电子材料股份有限公司 | 一种钼铜合金散热片及其制备方法与应用 |
| CN119900009B (zh) * | 2025-01-20 | 2025-10-24 | 西安交通大学 | 一种铜钨合金及其制备工艺 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5815241A (ja) * | 1981-07-20 | 1983-01-28 | Sumitomo Electric Ind Ltd | 半導体装置用基板 |
| JPS60128625A (ja) | 1983-12-15 | 1985-07-09 | Sumitomo Electric Ind Ltd | 半導体素子搭載用基板 |
| JPS61194884A (ja) | 1985-02-25 | 1986-08-29 | Hitachi Ltd | 超電導素子集積回路 |
| JP3493833B2 (ja) * | 1995-10-09 | 2004-02-03 | 住友電気工業株式会社 | 半導体素子搭載用プラスチックパッケージおよびその製造方法 |
| JP3814924B2 (ja) | 1997-04-03 | 2006-08-30 | 住友電気工業株式会社 | 半導体装置用基板 |
| JP4304749B2 (ja) * | 1998-02-24 | 2009-07-29 | 住友電気工業株式会社 | 半導体装置用部材の製造方法 |
| JP3436702B2 (ja) * | 1998-12-07 | 2003-08-18 | 日本碍子株式会社 | 複合材料 |
| JP2001118960A (ja) * | 1999-10-15 | 2001-04-27 | Sentan Zairyo:Kk | 電気絶縁膜付炭素基金属複合材基板 |
| WO2001069674A1 (en) * | 2000-03-15 | 2001-09-20 | Sumitomo Electric Industries, Ltd. | Aluminum-silicon carbide semiconductor substrate and method for producing the same |
| JP4206651B2 (ja) * | 2001-06-19 | 2009-01-14 | 三菱マテリアル株式会社 | ヒートシンク付回路基板 |
| JP2004104074A (ja) * | 2002-07-17 | 2004-04-02 | Sumitomo Electric Ind Ltd | 半導体装置用部材 |
-
2004
- 2004-03-24 JP JP2004085969A patent/JP4382547B2/ja not_active Expired - Fee Related
-
2005
- 2005-03-07 US US10/593,819 patent/US7470982B2/en not_active Expired - Fee Related
- 2005-03-07 WO PCT/JP2005/003846 patent/WO2005091360A1/ja not_active Ceased
- 2005-03-07 EP EP05720118A patent/EP1732128A4/en not_active Withdrawn
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